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Haotian Wu
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A024, October 26–28, 2021
Paper No: IPACK2021-74076
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021
Paper No: IPACK2021-74075
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Paper No: IPACK2021-74061
Journal Articles
Accepted Manuscript
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-21-1059
Published Online: October 12, 2021
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Paper No: IPACK2020-2677
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020
Paper No: IPACK2020-2675
Proceedings Papers

Proc. ASME. IDETC-CIE2015, Volume 3: 17th International Conference on Advanced Vehicle Technologies; 12th International Conference on Design Education; 8th Frontiers in Biomedical Devices, V003T01A047, August 2–5, 2015
Paper No: DETC2015-47980