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Fatemeh Tavakkoli
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Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 29–September 1, 2017
Paper No: IPACK2017-74295
Journal Articles
Article Type: Research-Article
J. Heat Transfer. August 2016, 138(8): 082101.
Paper No: HT-15-1825
Published Online: May 3, 2016