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F. Patrick McCluskey
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Paper No: IPACK2021-73367
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013
Paper No: IPACK2013-73209
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 687-696, November 11–17, 2011
Paper No: IMECE2011-65590
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 5-15, November 12–18, 2010
Paper No: IMECE2010-41019
Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 409-416, August 8–13, 2010
Paper No: IHTC14-22306
Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 675-680, August 8–13, 2010
Paper No: IHTC14-23040
Proceedings Papers

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 75-84, November 13–19, 2009
Paper No: IMECE2009-12713
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 825-829, July 8–12, 2007
Paper No: IPACK2007-33455
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 553-556, July 8–12, 2007
Paper No: IPACK2007-33456
Proceedings Papers

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 77-85, November 5–11, 2005
Paper No: IMECE2005-81111