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Eric Pop
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Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A007, July 16–18, 2013
Paper No: IPACK2013-73115
Proceedings Papers

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 769-776, March 3–6, 2012
Paper No: MNHMT2012-75111
Proceedings Papers

Proc. ASME. ENIC2008, ASME 2008 3rd Energy Nanotechnology International Conference, 129-132, August 10–14, 2008
Paper No: ENIC2008-53050
Proceedings Papers

Proc. ASME. ENIC2008, ASME 2008 3rd Energy Nanotechnology International Conference, 97-108, August 10–14, 2008
Paper No: ENIC2008-53025
Proceedings Papers

Proc. ASME. HT2003, Heat Transfer: Volume 3, 803-805, July 21–23, 2003
Paper No: HT2003-47312
Proceedings Papers

Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 85-90, November 17–22, 2002
Paper No: IMECE2002-32124
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
Published Online: December 14, 2006