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Douglas DeVoto
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A018, October 7–9, 2019
Paper No: IPACK2019-6456
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A020, October 7–9, 2019
Paper No: IPACK2019-6470
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
Published Online: May 8, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 27–30, 2018
Paper No: IPACK2018-8262
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Paper No: IPACK2018-8276
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013
Paper No: IPACK2013-73143
Proceedings Papers

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 837-842, November 11–17, 2011
Paper No: IMECE2011-65399
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 771-773, July 19–23, 2009
Paper No: InterPACK2009-89174
Proceedings Papers

Proc. ASME. ES2009, ASME 2009 3rd International Conference on Energy Sustainability, Volume 2, 1041-1045, July 19–23, 2009
Paper No: ES2009-90474
Proceedings Papers

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 55-59, November 13–19, 2009
Paper No: IMECE2009-11776