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Dereje Agonafer
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Journal Articles
Accepted Manuscript
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-19-1064
Published Online: October 1, 2019
Journal Articles
Accepted Manuscript
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-18-1094
Published Online: October 1, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031003.
Paper No: EP-18-1103
Published Online: May 8, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
Published Online: April 10, 2019
Proceedings Papers

Proc. ASME. IMECE2018, Volume 6A: Energy, V06AT08A053, November 9–15, 2018
Paper No: IMECE2018-88502
Proceedings Papers

Proc. ASME. IMECE2018, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A044, November 9–15, 2018
Paper No: IMECE2018-88497
Proceedings Papers

Proc. ASME. IMECE2018, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A064, November 9–15, 2018
Paper No: IMECE2018-88507
Proceedings Papers

Proc. ASME. IMECE2018, Volume 13: Design, Reliability, Safety, and Risk, V013T05A049, November 9–15, 2018
Paper No: IMECE2018-88508
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018
Paper No: IPACK2018-8432
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Paper No: IPACK2018-8436
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Paper No: IPACK2018-8253
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, August 27–30, 2018
Paper No: IPACK2018-8378
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 27–30, 2018
Paper No: IPACK2018-8255
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, August 29–September 1, 2017
Paper No: IPACK2017-74016
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Paper No: IPACK2017-74278
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Paper No: IPACK2017-74279
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 29–September 1, 2017
Paper No: IPACK2017-74028
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 29–September 1, 2017
Paper No: IPACK2017-74254
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041011.
Paper No: EP-17-1021
Published Online: October 27, 2017
Topics: Fans, Temperature
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041012.
Paper No: EP-17-1022
Published Online: October 27, 2017