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David Shaddock
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Paper No: IPACK2017-74169
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015
Paper No: IPACK2015-48708
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 13-17, July 6–8, 2011
Paper No: IPACK2011-52015
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 517-524, July 8–12, 2007
Paper No: IPACK2007-33419
Proceedings Papers

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 25-32, October 31–November 6, 2008
Paper No: IMECE2008-68952
Proceedings Papers

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 201-208, November 11–15, 2007
Paper No: IMECE2007-42215