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Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
https://doi.org/10.1115/1.4039027
Published Online: March 2, 2018
View Article titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74169
https://doi.org/10.1115/IPACK2017-74169
View Paper titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
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Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48708
https://doi.org/10.1115/IPACK2015-48708
View Paper titled, Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders
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Topics: High temperature, Solders, Temperature, Stress, Creep, Equipment performance, Mechanical properties, Melting, Wire
Proceedings Papers

Development of a Compliant Nanothermal Interface Material

David Shaddock, Stanton Weaver, Ioannis Chasiotis, Binoy Shah, Dalong Zhong
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 13-17, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52015
https://doi.org/10.1115/IPACK2011-52015
View Paper titled, Development of a Compliant Nanothermal Interface Material
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Topics: Copper, Fatigue, Manufacturing, Plates (structures), Power density, Silicon, Solders, Stress, Testing performance, Thermal conductivity
Proceedings Papers

Adhesive Tiecoat/Polyimide Interactions in High Temperature Flex Packaging

Harry Schoeller, Aaron Knobloch, Hua Xia, David Shaddock, Chris Kapusta, Kevin Durocher, Jungyun Cho
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 517-524, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33419
https://doi.org/10.1115/IPACK2007-33419
View Paper titled, Adhesive Tiecoat/Polyimide Interactions in High Temperature Flex Packaging
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Topics: Adhesives, High temperature, Packaging, Stress, Simulation, Adhesion, Elastic moduli, Finite element analysis, Electronic packages, Heat treating (Metalworking)
Proceedings Papers

Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 25-32, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68952
https://doi.org/10.1115/IMECE2008-68952
View Paper titled, Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb
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Topics: Deformation, High temperature, Solders, Creep, Temperature, Alloys, Electronics, Stress, Tin, Drilling
Proceedings Papers

Constitutive Relations of High Temperature Solders

Harry Schoeller, Shubhra Bansal, Aaron Knobloch, David Shaddock, Junghyun Cho
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 201-208, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42215
https://doi.org/10.1115/IMECE2007-42215
View Paper titled, Constitutive Relations of High Temperature Solders
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Topics: Constitutive equations, High temperature, Solders, Wire, Nanoindentation, Creep, Failure, Finite element analysis, Mechanical properties, Temperature