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Darin J. Sharar
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
Published Online: November 5, 2021
Journal Articles
Article Type: Guest Editorial
J. Electron. Packag. December 2021, 143(4): 040301.
Paper No: EP-21-1127
Published Online: September 13, 2021
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Paper No: IPACK2020-2605
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Paper No: IPACK2020-2608
Proceedings Papers

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T03A016, August 3–7, 2014
Paper No: ICNMM2014-22029
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A018, July 16–18, 2013
Paper No: IPACK2013-73087
Topics: Flat heat pipes
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A042, July 16–18, 2013
Paper No: IPACK2013-73199
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 133-142, July 6–8, 2011
Paper No: IPACK2011-52079