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Brian M. Foley
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Paper No: IPACK2021-74116
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
Published Online: July 10, 2020
Journal Articles
Article Type: Research-Article
J. Heat Transfer. September 2014, 136(9): 092401.
Paper No: HT-13-1565
Published Online: June 12, 2014