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Abhijit Dasgupta
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Journal Articles
Accepted Manuscript
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-19-1002
Published Online: September 1, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Paper No: IPACK2018-8345
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Paper No: IPACK2017-74133
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011009.
Paper No: EP-16-1045
Published Online: January 27, 2017
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030801.
Paper No: EP-15-1143
Published Online: June 8, 2016
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015
Paper No: IPACK2015-48669
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015
Paper No: IPACK2015-48708
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015
Paper No: IPACK2015-48709
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A027, July 6–9, 2015
Paper No: IPACK2015-48707
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A006, July 6–9, 2015
Paper No: IPACK2015-48710
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031011.
Paper No: EP-13-1121
Published Online: September 1, 2015
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011009.
Paper No: EP-14-1062
Published Online: October 15, 2014
Proceedings Papers

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A057, November 15–21, 2013
Paper No: IMECE2013-66803
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A009, July 16–18, 2013
Paper No: IPACK2013-73164
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A014, July 16–18, 2013
Paper No: IPACK2013-73200
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 17-22, November 12–18, 2010
Paper No: IMECE2010-39764
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 351-356, November 12–18, 2010
Paper No: IMECE2010-39309
Proceedings Papers

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 15-22, November 13–19, 2009
Paper No: IMECE2009-11779