Adhesive bonding, an effective joining technique for platelike structures in aircraft and automobiles, requires postbond inspection preferably with noncontact and single-sided access. The present study discusses the application of an imaging technique with a scanning laser source (SLS) to evaluate adhesive bonds in a platelike structure. When a laser Doppler vibrometer (LDV) is used as a receiver, the SLS technique realizes noncontact measurements with single-sided access. The imaging experiments that used narrowband burst waves and broadband chirp waves indicated that the imaging technique is appropriately applied to adhesive bonds and that the use of broadband chirp waves provides clearer images and reduces spurious images due to resonance. Furthermore, images of adhesive bonds were clearly obtained for a complex plate structure that consisted of a top-hat section and a flat plate, and this demonstrates that the imaging technique can be widely applied to evaluate various adhesive bonds.
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Adhesive Bond Imaging by Noncontact Measurements With Single-Sided Access
Shogo Nakao,
Shogo Nakao
Graduate School of Engineering,
Kyoto University,
Kyotodaigaku-katsura,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: nakao.shogo.24w@st.kyoto-u.ac.jp
Kyoto University,
Kyotodaigaku-katsura,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: nakao.shogo.24w@st.kyoto-u.ac.jp
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Takahiro Hayashi
Takahiro Hayashi
Graduate School of Engineering,
Kyoto University,
Kyotodaigaku-katsura,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: hayashi@kuaero.kyoto-u.ac.jp
Kyoto University,
Kyotodaigaku-katsura,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: hayashi@kuaero.kyoto-u.ac.jp
Search for other works by this author on:
Shogo Nakao
Graduate School of Engineering,
Kyoto University,
Kyotodaigaku-katsura,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: nakao.shogo.24w@st.kyoto-u.ac.jp
Kyoto University,
Kyotodaigaku-katsura,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: nakao.shogo.24w@st.kyoto-u.ac.jp
Takahiro Hayashi
Graduate School of Engineering,
Kyoto University,
Kyotodaigaku-katsura,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: hayashi@kuaero.kyoto-u.ac.jp
Kyoto University,
Kyotodaigaku-katsura,
Nishikyo-ku, Kyoto 615-8540, Japan
e-mail: hayashi@kuaero.kyoto-u.ac.jp
1Corresponding author.
Manuscript received October 23, 2017; final manuscript received January 14, 2018; published online February 23, 2018. Assoc. Editor: Hoon Sohn.
ASME J Nondestructive Evaluation. May 2018, 1(2): 021009-021009-5 (5 pages)
Published Online: February 23, 2018
Article history
Received:
October 23, 2017
Revised:
January 14, 2018
Citation
Nakao, S., and Hayashi, T. (February 23, 2018). "Adhesive Bond Imaging by Noncontact Measurements With Single-Sided Access." ASME. ASME J Nondestructive Evaluation. May 2018; 1(2): 021009–021009–5. https://doi.org/10.1115/1.4039229
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