The thermal management challenges facing electronic system developers and the need, as well as challenges, associated with the development of a Gen-3 embedded cooling paradigm are examined. We argue that the inherent limitations of the prevailing “remote cooling” technology have resulted in commercial and military electronic systems that are thermally-limited, performing well below the inherent electrical capability of the device technology they exploit. To overcome these limitations and remove a significant barrier to continued Moore's law progression in electronic components and systems, DARPA is pursuing the aggressive development of thermal management “embedded” in the chip, substrate, and/or package to directly cool the heat generation sites. The options and challenges associated with the development of this “Gen-3” thermal management technology are described.
Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm
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Manuscript received October 24, 2012; final manuscript received January 22, 2013; published online July 23, 2013. Assoc. Editor: Debjyoti Banerjee.
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Bar-Cohen, A. (July 23, 2013). "Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm." ASME. J. Nanotechnol. Eng. Med. May 2013; 4(2): 020907. https://doi.org/10.1115/1.4023898
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