Volumes | International Conference on Integration and Commercialization of Micro and Nanosystems | American Society of Mechanical Engineers Digital Collection

Topics: Damping , Durability , Cycles , Filters , Water , Energy dissipation , Particulate matter , Cylinders , Fracture (Materials) , Fracture (Process)

Study on Micro Thermoelectric Power Device With Various Micro Combustors

Ruiyin Song, Menghong Shen, Wei Li, Canjun Yang

MNC 2008; 17-21doi:https://doi.org/10.1115/MicroNano2008-70026

Abstract

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Topics: Combustion chambers , Generators , Microelectromechanical systems

Thermal Effects on Nano-Energy Absorption Systems (Nano-EAS)

Claudiu Valentin Suciu

MNC 2008; 23-32doi:https://doi.org/10.1115/MicroNano2008-70039

Abstract

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Topics: Absorption , Temperature effects , Temperature , Coatings , Water , Desorption , Pressure , Cycles , Damping , Energy dissipation

Investigation on Multiple Piezoelectric Effect of Piezoelectric Crystal Under Applied Electric Field

Baoyuan Sun, Yinhui Shi, Min Qian, Jun Zhang, Zhonghua Zhang

MNC 2008; 33-37doi:https://doi.org/10.1115/MicroNano2008-70076

Abstract

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Topics: Boundary-value problems , Crystals , Electric fields , Piezoelectricity

Leakage Current Influence on Microdevice Performance and Reliability

Oren Lahav, Its’hak Yomtovian, Lior Kogut

MNC 2008; 39-42doi:https://doi.org/10.1115/MicroNano2008-70097

Abstract

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Topics: Leakage , Reliability , Currents , Failure

Effect of Electrical Coupling on Microgyro Performance

Its’hak Yomtovian, Oren Lahav, Segev Ben-Itzhak, Lior Kogut

MNC 2008; 43-46doi:https://doi.org/10.1115/MicroNano2008-70098

Abstract

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Topics: Displacement , Leakage , Micromachining , Phase shift , Reliability , Semiconductor wafers , Silicon-on-insulator

Simulation and Signal Processing of a Decoupled Bulk-Micromachined Z-Axis Gyroscope

Jian Cui, Xiaozhu Chi, Haitao Ding, Guizhen Yan

MNC 2008; 47-50doi:https://doi.org/10.1115/MicroNano2008-70108

Abstract

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Topics: Micromachining , Signal processing , Simulation , Automatic gain control , Atmospheric pressure , Crystals , Design , Measurement systems , Oscillations , Resolution (Optics)

Characterizing Metallization Introduced Polysilicon Corrosion of Surface Micromachined Structures With Submicron Capacitive Gap

Yunda Wang, Ming Cai, Ying Wang, Jing Chen

MNC 2008; 51-54doi:https://doi.org/10.1115/MicroNano2008-70116

Abstract

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Topics: Corrosion , Micromachining , Polysilicon

Development and Testing of a Miniature Silicon Microgyroscope Prototype

Dunzhu Xia, Bailing Zhou, Shourong Wang

MNC 2008; 55-59doi:https://doi.org/10.1115/MicroNano2008-70124

Abstract

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Topics: Engineering prototypes , Microgyroscopes , Silicon , Testing , Circuits , Atmospheric pressure , Capacitors , Pressure , Q-factor , Signals

Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging

Shenglin Ma, Yuliang Yi, Yaquan Tang, Xiaomei Yu

MNC 2008; 61-64doi:https://doi.org/10.1115/MicroNano2008-70128

Abstract

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Topics: Design , Infrared imaging , Manufacturing , Microelectromechanical systems , Silicon , Etching , Optimization , Thermomechanics

PFPE Modified Silicon Nano-Textured Surfaces for Adhesion and Friction Reduction

Ying Song, Hengyu Wang, Min Zou

MNC 2008; 65-67doi:https://doi.org/10.1115/MicroNano2008-70144

Abstract

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Topics: Adhesion , Crystallization , Friction , Silicon

Development of RF Power Attenuation Model With MEMS Coils

Quan Yuan, Xiuhan Li, Dan Li, Haixia Zhang

MNC 2008; 69-72doi:https://doi.org/10.1115/MicroNano2008-70145

Abstract

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Topics: Microelectromechanical systems

Numerical Analysis of Dry Gas Face Seals With Spiral Groove and Inner Annular Groove

Xu-Dong Peng, Li-Li Tan, Ji-Yun Li, Song-En Sheng, Shao-Xian Bai

MNC 2008; 73-77doi:https://doi.org/10.1115/MicroNano2008-70185

Abstract

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Topics: Finite element methods , Leakage , Numerical analysis , Optimization , Sealing (Process) , Stiffness

Study on Deformation of a Laser Surface Textured Mechanical Seal

Xu-Dong Peng, Song-En Sheng, Ji-Yun Li, Yong-Ning Cai, Shao-Xian Bai

MNC 2008; 79-84doi:https://doi.org/10.1115/MicroNano2008-70186

Abstract

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Topics: Deformation , Lasers , Leakage , Liquid films , Pressure , Sealing (Process) , Stability , Stiffness , Ceramics , Finite element analysis

Modeling and Analysis of Digital Tunable RF MEMS Capacitors

Dajia Wang, Jun Yao, Qing Rao, Li Zhang, Chuankai Qiu, Tianquan Fan

MNC 2008; 85-86doi:https://doi.org/10.1115/MicroNano2008-70226

Abstract

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Topics: Capacitors , Microelectromechanical systems , Modeling , Electrodes , Design , Cantilevers , Transmission lines , Cantilever beams , Capacitance , Displacement

Design of a Non-Powered MEMS High G Shock Sensor

Y. P. Wang, R. Q. Hsu, C. W. Wu

MNC 2008; 87-96doi:https://doi.org/10.1115/MicroNano2008-70235

Abstract

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Topics: Design , Microelectromechanical systems , Sensors , Shock (Mechanics) , Springs , Cantilever beams , Cantilevers , Simulation

The Study on Position Accuracy of Micro-Coordinate Measuring Machine

Chuan Yang, Qiang Zhao, Yu-Long Zhao, Wei-Xuan Jing

MNC 2008; 97-103doi:https://doi.org/10.1115/MicroNano2008-70242

Abstract

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Topics: Machinery , Control systems , Design , Bending (Stress) , Coordinate measuring machines , Interferometers , Lasers , Stepper motors

Total Internal Reflection (TIR) Lens Design for Surface Mount Techonology (SMT) LED Application

JaeYoung Joo, Do Kyun Woo, ChaBum Lee, SunKyu Lee

MNC 2008; 105-106doi:https://doi.org/10.1115/MicroNano2008-70261

Abstract

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Topics: Design , Lenses (Optics) , Reflection , Surface mount packaging , Diamond turning , Geometry , Matlab , Simulation results , Surface mount technology

Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond

James Lee, Tony Rogers

MNC 2008; 107-112doi:https://doi.org/10.1115/MicroNano2008-70288

Abstract

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Topics: Low temperature , Packaging , Semiconductor wafers , Bonding , Silicon , Vacuum , Complementary metal oxide semiconductors , Damage , Electrodes , Integrated systems

Micro and Nano Devices

A Bulk Micromachined Tunable Dual-Mode Microwave Bandpass Filter on Coplanar Waveguide

Min Miao, Jingpeng Bu, Liwei Zhao, Yufeng Jin, Yangfei Zhang

MNC 2008; 113-118doi:https://doi.org/10.1115/MicroNano2008-70023

Abstract

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Topics: Filters , Microelectromechanical systems , Micromachining , Microwaves , Waveguides

A New Design of Large Stroke Micro-Deformable Mirror Actuated by Electrostatic Repulsive Force

Fangrong Hu, Jun Yao, Chuankai Qiu, Dajia Wang

MNC 2008; 119-122doi:https://doi.org/10.1115/MicroNano2008-70058

Abstract

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Topics: Design , Mirrors , Electrodes , Springs , Electric fields , Microelectromechanical systems , Optics , Resonance , Shapes

Simulation and Improvement of 5GHz Power Divider on FR-4 PCB

Mu-Chun Wang, Chung-Hsin Kuo, Zhen-Ying Hsieh, Chun-Wei Huang, Shuang-Yuan Chen

MNC 2008; 123-128doi:https://doi.org/10.1115/MicroNano2008-70090

Abstract

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Topics: Simulation , Circuits , Energy dissipation , Fibers , Metals , Printed circuit boards , Resins , Stability , Strip transmission lines , Teams

High Isolation X-Band RF MEMS Shunt Switches on Groove Etched Substrates

Li Zhang, Jun Yao, Dajia Wa, Qing Rao, Hongsheng Zhong, Jurgen Schmoll

MNC 2008; 129-130doi:https://doi.org/10.1115/MicroNano2008-70107

Abstract

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Topics: Microelectromechanical systems , Switches , Transmission lines , Capacitance , Resonance , Bridges (Structures) , Circuits , Computer software , Design , Energy consumption

A Bulk Micromachined Cantilever Array for Uncooled Infrared Imaging

Yuliang Yi, Shenglin Ma, Xiaomei Yu, Ming Liu, Xiaohua Liu

MNC 2008; 131-134doi:https://doi.org/10.1115/MicroNano2008-70109

Abstract

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Topics: Cantilevers , Infrared imaging , Micromachining , Silicon , Imaging , Infrared radiation , Noise (Sound) , Reactive-ion etching , Temperature , Thermomechanics

3D Polymeric Devices Driven by Surface Micro Fluidic Capillaries

Chunguang Xia, Howon Lee, Nicholas X. Fang

MNC 2008; 135-136doi:https://doi.org/10.1115/MicroNano2008-70115

Abstract

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Topics: Cantilevers , Evaporation , Microfabrication , Polymers , Water

MEMS Based Dew Point Hygrometer With Optimal Self Adjusted Detection Threshold

Ryszard Jachowicz, Jerzy Weremczuk, Daniel Paczesny, Grzegorz Tarapata

MNC 2008; 137-142doi:https://doi.org/10.1115/MicroNano2008-70134

Abstract

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Topics: Humidity meters , Microelectromechanical systems , Sensors , Algorithms , Biomedicine , Cavities , Construction , Semiconductors (Materials) , Skin , Temperature

Design and Simulation of Piezoelectric Micro-Cantilever Ultrasonic Transducers for Audio Directional Loudspeakers

Teng Ma, Chenguang Cai, Limei Xu, Leon Xu, Xia Wang, Jian Ma, Chuankai Qiu

MNC 2008; 143-148doi:https://doi.org/10.1115/MicroNano2008-70135

Abstract

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Topics: Design , Loudspeakers , Microcantilevers , Simulation , Ultrasonic transducers , Manufacturing , Microelectromechanical systems , Transducers , Cantilevers , Finite element methods

Optical Feedback Interferometry and Its Application in MEMS Sensing

Huilan Liu, Yong Wang, Zaiyou Pan, Lishuang Feng

MNC 2008; 149-153doi:https://doi.org/10.1115/MicroNano2008-70137

Abstract

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Topics: Feedback , Interferometry , Microelectromechanical systems , Accelerometers , Lasers , Testing , Helium-neon lasers , Interferometers , Light sources , Microoptoelectromechanical systems

The Effect of Surface Nano/Micro-Texturing on Escherichia Coli Cell Adhesion

Hengyu Wang, Jeong-Hwan Kim, Min Zou, Steve Tung, Jin-Woo Kim

MNC 2008; 155-157doi:https://doi.org/10.1115/MicroNano2008-70146

Abstract

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Topics: Adhesion

Design of a Valveless Micropump for Medical Drug Delivery Systems

W. W. F. Leung, C. H. Cheng, K. F. Lei, C. Chao, T. H. Cheung, P. K. Yueng, P. T. Yuen

MNC 2008; 159-162doi:https://doi.org/10.1115/MicroNano2008-70162

Abstract

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Topics: Biomedicine , Design , Drug delivery systems , Micropumps , Manufacturing , Disks , Actuators , Engineering prototypes , Pumps , Flow (Dynamics)

Measurement of Solvent Vapor Absorption by Polydimethylsiloxane Using Quartz Crystal Microbalance

W. W. F. Leung, C. Chao, C. H. Cheng, K. F. Lei, D. Ngan, C. K. Lau, W. C. Tse

MNC 2008; 163-166doi:https://doi.org/10.1115/MicroNano2008-70163

Abstract

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Topics: Absorption , Quartz crystals , Vapors , Sensors , Nanofibers , Circuits , Microelectromechanical systems , Coating processes , Coatings , Crystals

Study of Package Technologies for Implantable Microdevices

Weihong Li, Zhenjiang Shi, Hang Guo, Shiqing Chen, Xiuhan Li, Haixia Zhang

MNC 2008; 167-170doi:https://doi.org/10.1115/MicroNano2008-70194

Abstract

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Topics: Circuits , Packaging , Resonance , Silicones , Thin films

Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery

Hang Guo, Hui Yang, Liming Zou

MNC 2008; 171-173doi:https://doi.org/10.1115/MicroNano2008-70195

Abstract

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Topics: Design , Manufacturing , Surgery , Displacement , Finite element methods , Microfabrication , Oscillating frequencies , Shapes , Silicon , Vibration

1.331μm Narrow-Bandwidth Light Source Based on Polymer Micro-Blazed Grating

Hairong Wang, Xianni Gao, Guoliang Sun, Yulong Zhao, Zhuangde Jiang

MNC 2008; 175-180doi:https://doi.org/10.1115/MicroNano2008-70207

Abstract

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Topics: Diffraction gratings , Light sources , Polymers

Nanoparticle-Assisted High Efficient Polymerase Chain Reaction

Yu-Cheng Lin, Hua-Lin Wu

MNC 2008; 181-184doi:https://doi.org/10.1115/MicroNano2008-70214

Abstract

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Topics: Chain , Nanoparticles , Energy transformation , Innovation , Polymer chains

High Sensitive Sensor for Micro and Nano Particles Detection Based on DeFET

Mohamed F. Ibrahim, Fahmi Elsayed, Yehya H. Ghalab, Wael Badawy

MNC 2008; 185-188doi:https://doi.org/10.1115/MicroNano2008-70218

Abstract

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Topics: Nanoparticles , Sensors , Electric fields , Carbon dioxide , Design , Gates (Closures) , Particulate matter , Simulation , Transistors

Micro-Channel Haemo Dialyser

Goran N. Jovanovic, Eric K. Anderson, Alana R. Warner-Tuhy

MNC 2008; 189-190doi:https://doi.org/10.1115/MicroNano2008-70228

Abstract

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Topics: Microchannels , Fibers , Kidney , Health care , Blood flow , Developing nations , Diseases , Flow (Dynamics) , Mass transfer , Membranes

A Flexibly Single-Point Force Sensor

Gaofeng Zhou, Yulong Zhao, Zhuangde Jiang

MNC 2008; 191-195doi:https://doi.org/10.1115/MicroNano2008-70238

Abstract

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Topics: Force sensors , Sensors , Biomedicine , Friction , Gears , Printing , Testing , Transients (Dynamics)

Designing an Intelligent Controller for a Molecular Valve

Kasra Momeni, Aria Alasty

MNC 2008; 197-203doi:https://doi.org/10.1115/MicroNano2008-70257

Abstract

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Topics: Design , Intelligent control systems , Valves , Control equipment , Actuators , Atoms , Flow (Dynamics) , Drug delivery systems , Engines , Equations of motion

Design and Analysis of a Novel MEMS Variable Capacitor for RF Applications

Qing Rao, Jun Yao, Li Zhang, Dajia Wang, Mohua Yang

MNC 2008; 205-208doi:https://doi.org/10.1115/MicroNano2008-70263

Abstract

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Topics: Capacitors , Design , Microelectromechanical systems , Electrodes , Cantilever beams , Capacitance , Computer software , Elastic constants , Finite element analysis , Q-factor

Thermally Responsive Aptamer Surfaces for Microfluidic Sample Preparation

ThaiHuu Nguyen, Qiao Lin

MNC 2008; 209-215doi:https://doi.org/10.1115/MicroNano2008-70264

Abstract

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Topics: Fluorescence , Instrumentation , Mass spectrometry , Microfluidics

Finite Element Analysis Based Design Optimization of Exciting Efficiency for Micromachined Piezoelectric Transducer

Chenguang Cai, Quayle Chen, Dujuan Zeng, Fei Deng, Antti Salo, Leon Xu

MNC 2008; 217-221doi:https://doi.org/10.1115/MicroNano2008-70265

Abstract

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Topics: Design , Finite element analysis , Micromachining , Optimization , Piezoelectric transducers , Transducers , Membranes , Stress , Diaphragms (Mechanical devices) , Diaphragms (Structural)

Preparation of Poly(Dimethylsiloxane) Chip-Based Cartridge for Isoelectric Focusing and Whole-Channel Imaging Detection

Junjie Ou, Shuwen Wang, Carolyn L. Ren, Janusz Pawliszyn

MNC 2008; 223-224doi:https://doi.org/10.1115/MicroNano2008-70303

Abstract

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Topics: Imaging , Plasma desorption mass spectrometry , Microfluidics , Membranes , Separation (Technology) , Flow (Dynamics) , Glass , Proteins , Reservoirs , Design

Relationship Between Distance of Photonic Crystal Rods Array and Wavelength of Light Propagating in Right-Angular, Cross, and Y-Shapes Waveguide

Meng-Ju Lin

MNC 2008; 225-230doi:https://doi.org/10.1115/MicroNano2008-70307

Abstract

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Topics: Crystals , Rods , Shapes , Waveguides , Wavelength , Bifurcation , Artificial neural networks , Columns (Structural) , Computer software , Finite element methods

Micro and Nano Materials Characterization

Preparation and Characterization of Pt/WO₃ Nano-Film and Its Hydrogen-Sensing Properties

Changjun Hou, Jiale Dong, Yan Xu, Danqun Huo, Yike Tang, Jun Yang

MNC 2008; 231-236doi:https://doi.org/10.1115/MicroNano2008-70010

Abstract

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Topics: Hydrogen , Ions , Tungsten , Crystals , Atomic force microscopy , Catalysts , Electric potential , Membranes , Metal oxide semiconductors , Platinum

Poly(N-Isopropylacrylamide-Co-Methacrylic Acid) Micro/Nanoparticles: Formulation, Size Distribution and Use for Cu⁺⁺ Adsorption

Qinglin Wu, Peng Tian, Quang Cao

MNC 2008; 237-243doi:https://doi.org/10.1115/MicroNano2008-70019

Abstract

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Topics: Nanoparticles , Particulate matter , Temperature , Ions , Particle size , Metals , Surfactants , Copolymers , Weibull distribution , Hydrogels

Microstructure and Strength of Low Temperature Co-Fired Ceramic Substrates With Channels and Cavities

Yang-Fei Zhang, Min Miao, Yu-Feng Jin, Shu-Lin Bai

MNC 2008; 245-250doi:https://doi.org/10.1115/MicroNano2008-70040

Abstract

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Topics: Bending strength , Cavities , Ceramics , Finite element analysis , Low temperature , Aluminum , Fracture (Materials) , Fracture (Process) , Simulation , Emission spectroscopy

Nanoindentation Characterization of Ultrafine-Grained Surface Layer by Turning Versus Grinding

A. W. Warren, Y. B. Guo

MNC 2008; 251-256doi:https://doi.org/10.1115/MicroNano2008-70152

Abstract

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Topics: Grinding , Nanoindentation , Turning , Machining , Surface hardening , Bearings , Cams , Fatigue , Gears , Grain size

Nonlinear Responses and Optical Limiting Behavior of Ag Nano-Particles

M. H. Majles Ara, Z. Dehghani, E. Saievar Iranizad, S. Salmani

MNC 2008; 257-260doi:https://doi.org/10.1115/MicroNano2008-70174

Abstract

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Topics: Nanoparticles , Ultraviolet radiation , Absorption , Helium-neon lasers , Nonlinear optics , Particulate matter , Refraction , Scanning electron microscopy , Wavelength , X-ray diffraction

A New on Chip Nanomechanical Testing Concept Applied to Brittle and Ductile Thin Films Materials

Thomas Pardoen, Asmahan Safi, Michae¨l Coulombier, Pierre Carbonnelle, Jean-Pierre Raskin, Se´bastien Gravier

MNC 2008; 261-269doi:https://doi.org/10.1115/MicroNano2008-70232

Abstract

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Topics: Brittleness , Testing , Thin films , Fracture (Materials) , Fracture (Process) , Fracture toughness , Polysilicon , Ductility , Elastic moduli , Silicon nitride ceramics

Relaxor Properties and Conduction in TlInS₂ Crystals

Rauf Sardarly, Oktay Samedov, Arzu Nadzhafov, Famin Salmanov, Adil Abdullayev, Azad Bayramov

MNC 2008; 271-275doi:https://doi.org/10.1115/MicroNano2008-70329

Abstract

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Topics: Crystals , Heat conduction , Ferroelectric crystals , Data storage systems , Density , Electrons , Energy gap , Energy levels (Quantum mechanics) , Gamma rays , Magnetic materials

Micro and Nano Mechanics

Design of Nanocrystalline Materials for Structural Applications

Ashok Saxena, Rahul Rajgarhia, Shubhra Bansal

MNC 2008; 277-281doi:https://doi.org/10.1115/MicroNano2008-70012

Abstract

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Topics: Design , Nanocrystals , Grain boundaries , Atoms , Atomic structure , Creep , Durability , Energetics , Fatigue , Fracture toughness

A Numerical Method for Predicting Thermoelastic Damping in Micromechanical Resonators

Yang Xu, Zhili Hao

MNC 2008; 283-288doi:https://doi.org/10.1115/MicroNano2008-70036

Abstract

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Topics: Micromechanical resonators , Numerical analysis , Thermoelastic damping , Computer software , Cycles , Entropy , Finite element analysis , Geometry , Heat conduction , Modeling

Indentation Mechanics for Micro- and Nano-Layered Composites

G. Tang, Y.-L. Shen

MNC 2008; 289-294doi:https://doi.org/10.1115/MicroNano2008-70038

Abstract

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Topics: Composite materials , Deformation , Silicon , Tension , Aluminum , Ceramics , Computer simulation , Cracking (Materials) , Diamonds , Finite element methods

Self-Assembled Nanostructures

Wei Lu

MNC 2008; 295-296doi:https://doi.org/10.1115/MicroNano2008-70067

Abstract

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Topics: Nanostructures , Self-assembly

Molecular Dynamics Modeling of Thermal Transport in Damaged Continua

Navin Kumar, Kishore Pochiraju

MNC 2008; 297-302doi:https://doi.org/10.1115/MicroNano2008-70070

Abstract

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Topics: Modeling , Molecular dynamics , Damage , Thermal conductivity , Atoms , Displacement , Equilibrium (Physics) , Fracture (Materials) , Stress , Temperature

Study on the Shockwave Pressure Testing Method for Detonating Cords

Ying-Wei Bai, Zhuang-De Jiang, Yu-Long Zhao, En-Yi Chu, Kexuan Wang

MNC 2008; 303-307doi:https://doi.org/10.1115/MicroNano2008-70078

Abstract

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Topics: Cordage , Pressure testing , Shock waves

Analysis of Electrostatically Actuated Narrow Microcantilevers Using Rayleigh-Ritz Energy Technique

Manish M. Joglekar, Kedar Y. Hardikar, Dnyanesh N. Pawaskar

MNC 2008; 309-319doi:https://doi.org/10.1115/MicroNano2008-70130

Abstract

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Topics: Microcantilevers , Accounting , Algebra , Algorithms , Boundary-value problems , Capacitance , Deflection , Design , Displacement , Microelectromechanical systems

Nanoindentation on a Ni Nanodot-Patterned Surface

Hengyu Wang, Min Zou, Robert L. Jackson, Preston R. Larson, Matthew B. Johnson

MNC 2008; 321-323doi:https://doi.org/10.1115/MicroNano2008-70147

Abstract

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Topics: Nanoindentation

The Influence of Residual Stress and Tip Geometry on the Measurement of Surface Property Using Nanoindentation: Experimental Study and Numerical Analysis

A. W. Warren, Y. B. Guo

MNC 2008; 325-332doi:https://doi.org/10.1115/MicroNano2008-70156

Abstract

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Topics: Geometry , Nanoindentation , Numerical analysis , Stress , Surface properties , Displacement , Simulation , Carbon steel , Cross section (Physics) , Finite element analysis

Finite Element Modeling of Carbon Nanotube Composites for Vibration Damping

R. L. Dai, W. H. Liao

MNC 2008; 333-339doi:https://doi.org/10.1115/MicroNano2008-70165

Abstract

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Topics: Carbon nanotubes , Composite materials , Damping , Finite element analysis , Modeling , Vibration , Epoxy resins , Finite element methods , Energy dissipation , Stiffness

The Capillary Force Between an AFM Tip and a Surface at Different Humidity

Sheng Chau Chen, Jen Fin Lin

MNC 2008; 341-344doi:https://doi.org/10.1115/MicroNano2008-70204

Abstract

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Topics: Atomic force microscopy , Bridges (Structures) , Equilibrium (Physics) , Flat plates , Water

Stress Distribution on Open-Ended Carbon Nanotubes

Kasra Momeni, Aria Alasty

MNC 2008; 345-353doi:https://doi.org/10.1115/MicroNano2008-70251

Abstract

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Topics: Carbon nanotubes , Stress concentration , Stress , Boundary-value problems , Composite materials , Constitutive equations

Micro- and Nano- Thermal Transport and Integrated System Applications

Analytic Solution of Gaseous Slip Heat Transfer in Micro-Channel

Tiantian Zhang, Li Jia, Zhicheng Wang, Yan Li, Xing Li

MNC 2008; 355-361doi:https://doi.org/10.1115/MicroNano2008-70033

Abstract

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Topics: Heat transfer , Heating , Microchannels , Slip flow , Temperature

Research on Heat Transfer Characteristic of Pulsating Heat Pipe

Yan Li, Li Jia, Tiantian Zhang

MNC 2008; 363-367doi:https://doi.org/10.1115/MicroNano2008-70034

Abstract

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Topics: Heat pipes , Heat transfer

Hydrodynamic and Thermal Boundary Layers Over a Flat Plate With Slip Flow and Constant Surface Heat Flux

Abdul Aziz

MNC 2008; 369-374doi:https://doi.org/10.1115/MicroNano2008-70041

Abstract

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Topics: Flat plates , Heat flux , Slip flow , Thermal boundary layers , Momentum , Prandtl number , Temperature , Boundary layers , Flow (Dynamics) , Knudsen number

The Model of Non-Fourier Heat Conduction in a Kind of Two-Phase Medium With Great Different Heat Conductivity

Wen-Qiang Lu, Junfeng Lu

MNC 2008; 375-379doi:https://doi.org/10.1115/MicroNano2008-70061

Abstract

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Topics: Equilibrium (Physics) , Heat , Heat conduction , Thermal conductivity

Micro Cooling Based on Acoustic Streaming

Hongming Sun, Hang Guo

MNC 2008; 381-385doi:https://doi.org/10.1115/MicroNano2008-70192

Abstract

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Topics: Acoustics , Cooling , Microchannels , Fluids , Heat transfer , Forced convection , Microfluidics , Navier-Stokes equations , Radiation (Physics) , Temperature

Effect of Operating Temperature on the Water Removal in a Polymer Electrolyte Fuel Cell

Wanyuan Shi, Nobuyuki Oshima, L. Kumar Saha, Eru Kurihara

MNC 2008; 387-393doi:https://doi.org/10.1115/MicroNano2008-70206

Abstract

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Topics: Electrolytes , Fuel cells , Operating temperature , Polymers , Water , Gas diffusion layers , Temperature , Floods , Pressure , Steady state

Visualization of Micro Vapor Bubble Dynamic Behaviors in Open Capillary Microgrooves

Xuegong Hu, Liyuan Wu, Dawei Tang

MNC 2008; 395-400doi:https://doi.org/10.1115/MicroNano2008-70244

Abstract

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Topics: Bubbles , Vapors , Visualization , Microbubbles , Collapse , Heat transfer , Image processing , Matlab , Nucleate boiling , Theoretical analysis

Transport of Hydrogen Molecules in Single-Walled Carbon Nanotube

Kyung Su Oh, DongHyun Kim, Seungho Park, Ohmyoung Kwon, Young Ki Choi, Joon Sik Lee

MNC 2008; 401-403doi:https://doi.org/10.1115/MicroNano2008-70248

Abstract

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Topics: Hydrogen , Single-walled carbon nanotubes , Single-walled nanotubes , Quantum mechanics , Carbon nanotubes , Containers , Density , Mass transfer , Molecular dynamics simulation , Nanoscale phenomena

Modeling of Light Scattering by Silica Nanoporous Structures

Qunzhi Zhu, Yongguang Li, Dawei Chen

MNC 2008; 405-409doi:https://doi.org/10.1115/MicroNano2008-70260

Abstract

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Topics: Light scattering , Modeling , Electromagnetic scattering , Radiation scattering , Scattering (Physics) , Density , Wavelength , Nanoscale phenomena , Radiative heat transfer , Visible spectrum

The Effects of Large Blood Vessels on Three-Dimensional Tissue Temperature Distributions During Electromagnetic Induced Nano-Hyperthermia: Numerical Simulation

Zhong-Shan Deng, Jing Liu

MNC 2008; 411-412doi:https://doi.org/10.1115/MicroNano2008-70269

Abstract

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Topics: Biological tissues , Blood vessels , Computer simulation , Temperature distribution , Tumors , Blood , Heating , Vessels , Blood flow , Heat sinks

Uncertainty Analysis in Bioheat Transfer Modeling for Treatment Planning of Nano-Cryosurgery

Zhong-Shan Deng, Jing Liu

MNC 2008; 413-414doi:https://doi.org/10.1115/MicroNano2008-70270

Abstract

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Topics: Bioheat transfer , Modeling , Uncertainty analysis , Nanoparticles , Biological tissues , Uncertainty , Tumors , Temperature , Temperature distribution

Near-Field Radiative Heat Transfer Between Materials With Dielectric Coatings

Ceji Fu, Wenchang Tan

MNC 2008; 415-421doi:https://doi.org/10.1115/MicroNano2008-70279

Abstract

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Topics: Coatings , Polaritons , Radiative heat transfer

Study for the Interface Thermal Resistance of Metal-Dielectric Layers

Heng-Chieh Chien, Da-Jen Yao, Cheng-Ting Hsu

MNC 2008; 423-427doi:https://doi.org/10.1115/MicroNano2008-70280

Abstract

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Topics: Metals , Thermal resistance , Adhesion , Aluminum , Fluids , Microelectromechanical systems , Nickel , Plasma-enhanced chemical vapor deposition , Platinum , Thin films

Rapid Electromagnetic Rewarming of Cryopreserved Tissues Using Nano-Magnetoparticles: Feasibility Study

Zhong-Shan Deng, Jing Liu

MNC 2008; 429-430doi:https://doi.org/10.1115/MicroNano2008-70282

Abstract

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Topics: Biological tissues , Biomaterials , Heating , Cooling , Cryonics , Ice , Temperature , Vitrification , Biological cells , Convection

Bubble Dynamics on Nanostructured Cu Surfaces

Chen Li, Nikhil Koratkar, G. P. Peterson

MNC 2008; 431-436doi:https://doi.org/10.1115/MicroNano2008-70296

Abstract

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Topics: Bubbles , Dynamics (Mechanics) , Boiling , Nucleation (Physics) , Visualization , Data acquisition systems , Density , Fluctuations (Physics) , Fluids , Heat exchangers

Interactions of Liquid Plugs in a Pulsating Heat Pipe

Wei Qu, Chong Qu, Yan Zhou

MNC 2008; 437-441doi:https://doi.org/10.1115/MicroNano2008-70315

Abstract

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Topics: Heat pipes , Heating

Experimental Performance of a Nanofluid Pulsating Heat Pipe

Wei Qu, Chong Qu, Jianchao Feng

MNC 2008; 443-448doi:https://doi.org/10.1115/MicroNano2008-70316

Abstract

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Topics: Heat pipes , Nanofluids , Thermal resistance

Molecular Dynamics Simulations of Heat Conduction in Thin Film With Nano-Holes

Koji Miyazaki, Daisuke Nagai, Hiroshi Tsukamoto

MNC 2008; 449-454doi:https://doi.org/10.1115/MicroNano2008-70327

Abstract

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Topics: Heat conduction , Molecular dynamics simulation , Thin films , Phonons , Nanostructures , Temperature , Thermal conductivity , Boundary-value problems , Fourier transforms , Mean free path

A DSMC Study of the Si/Ge Interface Thermal Resistance

Mei-Jiau Huang, Dong-Jiun Tsai, Liang-Chun Liu

MNC 2008; 455-460doi:https://doi.org/10.1115/MicroNano2008-70330

Abstract

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Topics: Thermal resistance , Phonons , Simulation , Simulation results , Acoustics , Approximation , Dispersion relations , Reflection , Relaxation (Physics) , Temperature

A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films

Tai-Ming Chang, Chien-Chou Weng, Mei-Jiau Huang

MNC 2008; 461-466doi:https://doi.org/10.1115/MicroNano2008-70331

Abstract

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Topics: Silicon , Surface roughness , Thermal conductivity , Thin films , Temperature , Atoms , Simulation , Boundary-value problems , Computation , Evaporation

Micro-Nano Fluidics and Biosensing

Multiscale Modeling of Protein Stretching in Nanofluidic Flows

Zhi Yang, C. P. Chen, Z. J. Chen, C. C. Chieng

MNC 2008; 467-472doi:https://doi.org/10.1115/MicroNano2008-70027

Abstract

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Topics: Flow (Dynamics) , Multiscale modeling , Nanofluidics , Proteins , Deformation , Dynamics (Mechanics) , Atomic force microscopy , Bridges (Structures) , Clamps (Tools) , DNA

Capillary Flow in Microchannel With Pillars

Auro Ashish Saha, Mark Tweedie, Susanta Roy, Sushanta K. Mitra, Jim McLaughlin

MNC 2008; 473-480doi:https://doi.org/10.1115/MicroNano2008-70043

Abstract

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Topics: Columns (Structural) , Flow (Dynamics) , Microchannels , Microfluidics , Microscopes , Adhesives , Computer simulation , Ethanol , Fluids , Glass

Simulating Selective Particle Seperation in a Dielectrophoretic Microchannel

Naga Siva Kumar G., Sushanta K. Mitra

MNC 2008; 481-485doi:https://doi.org/10.1115/MicroNano2008-70044

Abstract

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Topics: Electric fields , Microchannels , Particulate matter , Electrodes , Engineering simulation , Simulation , Bacteria , Biomedicine , Blood , Computational fluid dynamics

Numerical Simulation of AC Electrothermal Microfluidic Pumping

E. Du, Souran P. Manoochehri

MNC 2008; 487-493doi:https://doi.org/10.1115/MicroNano2008-70066

Abstract

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Topics: Computer simulation , Microfluidics , Electrodes , Fluids , Electrical conductivity , Signals , Thermal conductivity , Dielectrophoresis , Electric fields , Electrokinetics

Thermally Actuated Droplet Motion on Chemically Homogeneous, Striated, and Defected Surfaces

Jian-Zhang Chen

MNC 2008; 495-496doi:https://doi.org/10.1115/MicroNano2008-70096

Abstract

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Topics: Drops , Coating processes , Coatings , Fittings , Hinges , Surface roughness , Temperature gradient , Three-dimensional models

Development of a Thermal Switch for the Heat Regulation Based on the Liquid Column Control

SuHeon Jeong, W. Nakayama, JaeYoung Joo, SunKyu Lee

MNC 2008; 497-498doi:https://doi.org/10.1115/MicroNano2008-70121

Abstract

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Topics: Heat , Switches , Geometry , Heat transfer , Temperature , Fluids , Thermal resistance

Measurement of Intracellular Drug Concentration in a Single Cancer Cell Isolated in a Microfabricated Biochip for Cancer Diagnosis

Paul Li, Derek Chew

MNC 2008; 499-501doi:https://doi.org/10.1115/MicroNano2008-70164

Abstract

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Topics: Cancer , Drugs , Integrated circuits , Microfluidics

Manipulation of Individual Beads Using Submicron Magnetic Features in Microfluidic Channels

Zhengchun Peng, Peter Hesketh, Paul Joseph

MNC 2008; 503-507doi:https://doi.org/10.1115/MicroNano2008-70169

Abstract

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Topics: Microfluidics , Density , Design , Magnetic fields

On the Ultrasonic Manipulation of Micro/Nano Particles

Hui Yang, Hang Guo

MNC 2008; 509-512doi:https://doi.org/10.1115/MicroNano2008-70193

Abstract

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Topics: Nanoparticles , Particulate matter , Standing waves , Gravity (Force) , Ultrasound

Microfluidic Devices for Rapid Protein Separation

Z. Hugh Fan, Champak Das, Cesar Moreira, Daniel Olivero, Hong Chen

MNC 2008; 513-516doi:https://doi.org/10.1115/MicroNano2008-70208

Abstract

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Topics: Microfluidics , Proteins , Separation (Technology) , Polymers , Coating processes , Coatings , Copolymers , Electric fields , Electroosmosis , Electrophoresis

Investigation of Temperature-Dependent Droplet Formation of Nanofluids in Microfluidic T-Junction

Nam-Trung Nguyen, S. M. Sohel Murshed, Say-Hwa Tan

MNC 2008; 517-521doi:https://doi.org/10.1115/MicroNano2008-70268

Abstract

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Topics: Drops , Junctions , Microfluidics , Nanofluids , Temperature

Thermal Control for Droplet-Based Microfluidics

Nam-Trung Nguyen

MNC 2008; 523-528doi:https://doi.org/10.1115/MicroNano2008-70277

Abstract

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Topics: Drops , Microfluidics

Glass-Glass Wafer Bonding for Microfluidic Devices

Nick Aitken, Tony Rogers

MNC 2008; 529-533doi:https://doi.org/10.1115/MicroNano2008-70293

Abstract

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Topics: Bonding , Glass , Microfluidics , Semiconductor wafers , Borosilicate glasses , Cavities , Quartz , Absorption , Adhesives , Biomedicine

Temperature Measurement in Microfluidic Systems Using Photobleaching of a Fluorescent Slab

Lin Gui, Carolyn L. Ren

MNC 2008; 535-542doi:https://doi.org/10.1115/MicroNano2008-70295

Abstract

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Topics: Microfluidics , Slabs , Temperature measurement , Plasma desorption mass spectrometry , Electrophoresis , Temperature distribution , Diffusion (Physics) , Polishing equipment , Polymers , Temperature

Electro-Osmotic Flow With Free Surface in Nanochannels

Sang W. Joo, Shizhi Qian, Yingtao Jiang, Marcos A. Cheney

MNC 2008; 543-547doi:https://doi.org/10.1115/MicroNano2008-70302

Abstract

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Topics: Electroosmosis , Flow (Dynamics) , Stability , Thin films

Microscale Mass Diffusion Sensing of Polymer Solutions Using Soret Forced Rayleigh Scattering

Yuji Nagasaka

MNC 2008; 549-550doi:https://doi.org/10.1115/MicroNano2008-70309

Abstract

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Topics: Diffusion (Physics) , Microscale devices , Polymer solutions , Rayleigh scattering , Casting , Polymer films , Nanostructures

Mechanical Properties of PDMS Membrane and Influences of Commonly Used Chemicals in Microfabrication

Miao Liu, Jianren Sun, Ying Sun, Quanfang Chen

MNC 2008; 551-556doi:https://doi.org/10.1115/MicroNano2008-70343

Abstract

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Topics: Mechanical properties , Membranes , Microfabrication , Plasma desorption mass spectrometry , Microfluidics , Chemical reactions

Micro, Nano, and Multiscale Manufacturing

Back-Side Wafer Grinding Quality Affecting Back-End Assembly Process for LCD Driver ICs

Mu-Chun Wang, Zhen-Ying Hsieh, Kuo-Shu Huang, Shuang-Yuan Chen, Heng-Sheng Huang

MNC 2008; 557-561doi:https://doi.org/10.1115/MicroNano2008-70014

Abstract

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Topics: Grinding , Manufacturing , Semiconductor wafers , Assembly lines , Crystals , Data collection , Diluents , Reliability , Semiconductors (Materials) , Shapes

Investigation of Dicing Saw Methods Impacting Back-End Assembly Process

Mu-Chun Wang, Zhen-Ying Hsieh, Kuo-Shu Huang, Shuang-Yuan Chen, Heng-Sheng Huang

MNC 2008; 563-567doi:https://doi.org/10.1115/MicroNano2008-70015

Abstract

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Topics: Manufacturing , Cutting , Machinery , Semiconductor wafers , Lasers , Assembly lines , Blades , Diamonds , Diluents , Shapes

Avoidance of Bonding Pad Contamination Affecting Back-End Assembly Process

Mu-Chun Wang, Kuo-Shu Huang, Zhen-Ying Hsieh, Shuang-Yuan Chen, Heng-Sheng Huang

MNC 2008; 569-572doi:https://doi.org/10.1115/MicroNano2008-70016

Abstract

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Topics: Bonding , Contamination , Manufacturing , Wire , Reliability , Shrinkage (Materials) , Adhesion , Diluents , Machinery , Signals

Fabrication of Suspending GAN Microstructures With Combinations of Anisotropic and Isotropic Dry Etching Techniques

Jianan Lv, Zhenchuan Yang, Kevin J. Chen

MNC 2008; 573-577doi:https://doi.org/10.1115/MicroNano2008-70037

Abstract

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Topics: Anisotropy , Dry etching , Manufacturing , Gallium nitride , Etching , Reactive-ion etching , Silicon , Plasmas (Ionized gases) , Scanning electron microscopes

The Application of UV-LEDs to Microlithography

Chen-Kang Huang, Jeng-Gang Sung

MNC 2008; 579-582doi:https://doi.org/10.1115/MicroNano2008-70055

Abstract

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Topics: Light-emitting diodes , Ultraviolet radiation , Light sources , Displacement , Energy conservation , Etching , Heat sinks , Lenses (Optics) , Lithography , Materials science

Fabrication of Inner Micro-Grooved Pipes

Y. Chi, R. Du

MNC 2008; 583-587doi:https://doi.org/10.1115/MicroNano2008-70068

Abstract

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Topics: Manufacturing , Pipes , Spin (Aerodynamics) , Spinning (Textile)

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Yuxin Sun, Masumi Saka

MNC 2008; 589-592doi:https://doi.org/10.1115/MicroNano2008-70073

Abstract

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Topics: Electrodiffusion , Manufacturing , Fibers , Aluminum , Anodes , Atoms , Crystallization , Current density , Temperature

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

Zhibo Ma, Sen Ren, Dayong Qiao, Weizheng Yuan

MNC 2008; 593-596doi:https://doi.org/10.1115/MicroNano2008-70079

Abstract

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Topics: Manufacturing , Pressure sensors , Resonance , Semiconductor wafers , Silicon-on-insulator , Diaphragms (Mechanical devices) , Diaphragms (Structural) , Pressure , Silicon , Chemical etching

Evaluation and Characterization of Titanium to Glass Anodic Bonding

Qiong Shu, Juan Su, Gang Zhao, Ying Wang, Jing Chen

MNC 2008; 597-600doi:https://doi.org/10.1115/MicroNano2008-70111

Abstract

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Topics: Bonding , Glass , Semiconductor wafers , Titanium

Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices

Yinhua Lei, Wei Wang, Huaiqiang Yu, Ting Li, Yufeng Jin, Haixia Zhang, Zhihong Li

MNC 2008; 601-604doi:https://doi.org/10.1115/MicroNano2008-70112

Abstract

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Topics: Micromachining , Etching , Silicon , Microelectromechanical systems

Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching

Gang Zhao, Qiong Shu, Yue Li, Jing Chen

MNC 2008; 605-608doi:https://doi.org/10.1115/MicroNano2008-70125

Abstract

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Topics: Plasma etching , Titanium , Etching , Plasmas (Ionized gases) , Springs , Surface roughness

A Combined Model and Its Verification for Femtosecond-Pulse Materials Interactions

Lan Jiang, Hai-Lung Tsai

MNC 2008; 609-614doi:https://doi.org/10.1115/MicroNano2008-70127

Abstract

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Topics: Damage , Equilibrium (Physics) , Heat , Laser materials , Metals , Modeling , Nanoscale phenomena , Plasmas (Ionized gases) , Shapes , Temperature

Fabrication of Nanoscale Vias by Offset Patterning

Chi Ho Lau, S. W. Ricky Lee

MNC 2008; 615-618doi:https://doi.org/10.1115/MicroNano2008-70131

Abstract

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Topics: Manufacturing , Nanoscale phenomena , Photolithography , Size reduction (Materials)

Investigation on the Effects of Copper Electroplating Process

Yue Chen, Xiuhan Li, Shi Qing Chen, Haixia Zhang

MNC 2008; 619-622doi:https://doi.org/10.1115/MicroNano2008-70132

Abstract

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Topics: Copper , Current density , Electrical resistivity , Electroplating

Fabrication of SiC MEMS Pressure Sensor Based on Novel Vacuum-Sealed Method

Chao Wang, Xiaobao Geng, Haixia Zhang

MNC 2008; 623-626doi:https://doi.org/10.1115/MicroNano2008-70136

Abstract

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Topics: Manufacturing , Microelectromechanical systems , Pressure sensors , Vacuum , Plasma-enhanced chemical vapor deposition , Stiction , Mechanical properties , Micromachining , Sealing (Process) , Semiconductor wafers

Fabrication of SiC MEMS Pressure Sensor by Anodic Bonding

Wei Tang, Zhe Chen, Dayu Tian, Haixia Zhang

MNC 2008; 627-630doi:https://doi.org/10.1115/MicroNano2008-70138

Abstract

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Topics: Bonding , Complementary metal oxide semiconductors , Manufacturing , Microelectromechanical systems , Micromachining , Pressure sensors

Fabrication of Superhydrophilic Surfaces by Aluminum-Induced Crystallization of Amorphous Silicon

Kenneth Kollias, Hengyu Wang, Min Zou

MNC 2008; 631-633doi:https://doi.org/10.1115/MicroNano2008-70143

Abstract

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Topics: Aluminum , Crystallization , Manufacturing , Silicon , Water

Laser Direct-Write Micro Dents Using Laser Shock Peening: Experimental Study and Numerical Simulations

M. P. Sealy, Y. B. Guo, C. Dumitrescu, P. V. Puzinauskas, S. C. Chen

MNC 2008; 635-639doi:https://doi.org/10.1115/MicroNano2008-70157

Abstract

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Topics: Computer simulation , Laser hardening , Lasers , Aluminum , Engineering simulation , Finite element analysis , Laser materials , Lubricants , Pressure , Residual stresses

Effect of the Molecular Weight and Density of Ambient Gas on Shock Wave in Laser-Assisted Nanostructuring

Liying Guo, Xinwei Wang

MNC 2008; 641-665doi:https://doi.org/10.1115/MicroNano2008-70178

Abstract

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Topics: Density , Lasers , Molecular weight , Shock waves , Atoms , Fluence (Radiation measurement) , Molecular dynamics simulation , Pressure

Dynamics Evolution of Shock Waves in Laser-Material Interaction

Sobieslaw Gacek, Xinwei Wang

MNC 2008; 667-675doi:https://doi.org/10.1115/MicroNano2008-70181

Abstract

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Topics: Dynamics (Mechanics) , Laser materials , Shock waves , Absorption , Density , Engineering simulation , Lasers , Molecular dynamics , Plumes (Fluid dynamics) , Pressure

Failure Investigation and Analysis of Abnormal Capacitance of Accelerometer After ICP Release

Ping An, Yandong He, Shitao Wang, Yanping Bai, Yilong Hao

MNC 2008; 677-681doi:https://doi.org/10.1115/MicroNano2008-70201

Abstract

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Topics: Accelerometers , Capacitance , Failure , Contamination , Epoxy resins , Etching , Failure analysis , Inspection , Plasmas (Ionized gases) , Polishing

The Effect of Duration of First and Second Anodization Steps on the Ordering of Nanopores in Anodic Aluminum Oxide Templates Achieved by Three Step Anodic Oxidation Process

M. Abdollahzadeh, N. Parvaini-Ahmadi, F. Nasirpouri

MNC 2008; 683-687doi:https://doi.org/10.1115/MicroNano2008-70224

Abstract

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Topics: Aluminum , Nanopores , Oxidation

Study on Precision Positioning System of Two-Dimensional Platform Based on High-Speed and Large-Range

Chuan Yang, Zhi Zhang

MNC 2008; 689-696doi:https://doi.org/10.1115/MicroNano2008-70255

Abstract

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Topics: Artificial neural networks , Control algorithms , Control systems , Design , Errors , Fuzzy logic , Fuzzy reasoning , Machining , Stress

Fabrication of Multilayer Tubular Nanoporous Ceramic Membranes via Gel-Casting Followed by Dip-Coating

P. Ahmadian Namini, A. A. Babaluo, M. Akhfash Ardestani, E. Jannatduost, M. Peyravi

MNC 2008; 697-702doi:https://doi.org/10.1115/MicroNano2008-70256

Abstract

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Topics: Casting , Ceramics , Coating processes , Coatings , Manufacturing , Membranes

Fabrication of Phase Reflection Sawtooth Gratings Optimized by Scalar and Vector Way by Using Diamond Cutting

ChaBum Lee, T. Kuriyagawa, TaeJun Kim, SunKyu Lee

MNC 2008; 703-704doi:https://doi.org/10.1115/MicroNano2008-70266

Abstract

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Topics: Cutting , Diamonds , Diffraction gratings , Manufacturing , Reflection , Scalars , Diffraction , Polarization (Electricity) , Polarization (Light) , Polarization (Waves)

Wafer Bonding Processes for the Manufacture of Microsystems

Tony Rogers, Nick Aitken

MNC 2008; 705-710doi:https://doi.org/10.1115/MicroNano2008-70292

Abstract

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Topics: Bonding , Microelectromechanical systems , Semiconductor wafers , Bond strength , Glass , Manufacturing , Packaging , Temperature , Vacuum , Acoustics

An Integrated Approach to High-Speed Probe-Based Nanofabrication: SPM Imaging

Yan Yan, Qingze Zou

MNC 2008; 711-720doi:https://doi.org/10.1115/MicroNano2008-70297

Abstract

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Topics: Imaging , Nanofabrication , Probes , Scanning probe microscopy , Atomic force microscopy , Actuators , Calibration , Control algorithms , Design , Dynamics (Mechanics)

Synthesis of α-Al₂O₃ Nanopowder From Ammonium Dawsonite

P. Ahmadian Namini, A. A. Babaluo, M. Akhfash Ardestani, E. Jannatduost, M. Peyravi

MNC 2008; 721-724doi:https://doi.org/10.1115/MicroNano2008-70306

Abstract

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Topics: Chemistry , Fourier transform infrared spectroscopy , Nanoparticles , Scanning electron microscopy , X-ray diffraction

Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems

Gyoko Nagayama, Ryuji Ando, Kei Muramatsu, Takaharu Tsuruta

MNC 2008; 725-726doi:https://doi.org/10.1115/MicroNano2008-70323

Abstract

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Topics: Etching , Manufacturing , Micro fuel cells , Microelectromechanical systems , Porosity , Silicon

Micro-Nano Electronics and Materials

Design of an Organic Pixel Addressing Circuit for Active-Matrix OLED Displays

Mohsen Purahmad, Iman Rezenejad Gatabi

MNC 2008; 727-730doi:https://doi.org/10.1115/MicroNano2008-70059

Abstract

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Topics: Circuits , Design , Thin film transistors , Transistors , Luminescence , Simulation results

Correcting Front-End RF Impedance Mismatch for 2.4GHz Wireless Long-Distance Data Transmission

Mu-Chun Wang, Zhen-Ying Hsieh, Shu-Han Chao, Chia-Hao Tu, Shuang-Yuan Chen

MNC 2008; 731-736doi:https://doi.org/10.1115/MicroNano2008-70092

Abstract

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Topics: Circuits , Design , Electronic components , Errors , Radiation (Physics) , Shapes , Signals , Transmission lines , Transportation systems

Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products

Mu-Chun Wang, Zhen-Ying Hsieh, Ting-Yu Yang, Chia-Hao Tu, Shuang-Yuan Chen

MNC 2008; 737-741doi:https://doi.org/10.1115/MicroNano2008-70093

Abstract

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Topics: Circuits , Printed circuit board assemblies , Electronic components , Copper , Energy dissipation , Shapes , Temperature , Assembly lines , Circuit design , Contact resistance

Temperature and Active Layer Thickness Dependent Stability of On-Plastic a-Si:H Thin Film Transistors Fabricated at 150°C

Jian-Zhang Chen, I-Chun Cheng

MNC 2008; 743-744doi:https://doi.org/10.1115/MicroNano2008-70103

Abstract

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Topics: Stability , Temperature , Thin film transistors , Electrical measurement , Heat conduction

High Q Circular-Section Solenoid-Type Inductor

Xiuhan Li, Guanghua Shu, Jinan Sao, Xiongwei Zhang

MNC 2008; 745-749doi:https://doi.org/10.1115/MicroNano2008-70139

Abstract

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Topics: Complementary metal oxide semiconductors , Flip-chip , Flip-chip devices , Inductors , Q-factor , Solenoids

Growth and Characterization of PZT Thin Films

Daqun Bao, Yi Zhang, Hang Guo

MNC 2008; 751-755doi:https://doi.org/10.1115/MicroNano2008-70289

Abstract

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Topics: Thin films , Sol-gel processing , Annealing , Atomic force microscopy , Circuits , Polarization (Electricity) , Polarization (Light) , Polarization (Waves) , Residual stresses , Stress

Nanowire-Based High Speed Transparent and Flexible Thin-Film Transistor Devices

Eric N. Dattoli, Kevin Baler, Wei Lu

MNC 2008; 757-759doi:https://doi.org/10.1115/MicroNano2008-70328

Abstract

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Topics: Nanowires , Thin film transistors , Transparency

Commercialization of Micro and Nano Technology

Nanotechnology in Textile Industry and Advantages

Charlie Chow

MNC 2008; 761-763doi:https://doi.org/10.1115/MicroNano2008-70017

Abstract

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Topics: Nanotechnology , Textiles , Particulate matter , Electronics , Fibers , Innovation , Oceans , Yarns

Study of Low-Temperature Wafer Bonding With Au-Au Bonding Technique

H. Kurotaki, H. Shinohara, H. Kobayashi, J. Mizuno, S. Shoji

MNC 2008; 765-766doi:https://doi.org/10.1115/MicroNano2008-70064

Abstract

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Topics: Bonding , Low temperature , Semiconductor wafers , Metal bonding , Diffusion bonding (Metals) , Brightness (Photometry) , Metals , Microelectromechanical systems , Semiconductors (Materials) , Temperature

Failure Modes Model of MEMS Accelerometers Based on Neural Networks

Yanping Bai, Ping An, Yilong Hao

MNC 2008; 767-771doi:https://doi.org/10.1115/MicroNano2008-70104

Abstract

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Topics: Accelerometers , Artificial neural networks , Failure mechanisms , Microelectromechanical systems

CMORE: Fast Track From Lab to Fab

Lou Hermans, Raffa Borzi

MNC 2008; 773-780doi:https://doi.org/10.1115/MicroNano2008-70225

Abstract

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Topics: Complementary metal oxide semiconductors , Contamination , Failure , Flow (Dynamics) , Manufacturing , Microelectromechanical systems , Packaging , Product development , Semiconductor wafers