1-1 of 1
Keywords: wafer bonding alignment system
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2023, 11(2): 024503.
Paper No: JMNM-23-1057
Published Online: May 8, 2024
... errors and thermal deformation errors. The error budget predicts the overall performance of the system by synthesizing the final impact of these error sources on the position of the end effector of the system. Error budgeting for wafer bonding alignment systems is an important means to ensure alignment...