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W. J. Meng
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Journal Articles

Scaling Anomaly in the Mechanical Response in Microscale Reverse Extrusion of Copper

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Bin Zhang, W. J. Meng
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. March 2020, 8(1): 010910.
Paper No: JMNM-19-1068
https://doi.org/10.1115/1.4046043
Published Online: February 13, 2020
View Articletitled, Scaling Anomaly in the Mechanical Response in Microscale Reverse Extrusion of Copper
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Topics: Extruding, Grain size, Microscale devices, Stress, Metalworking, Electron backscatter diffraction, Flow (Dynamics)
Journal Articles

Roll Molding of Microchannel Arrays on Al and Cu Sheet Metals: A Method for High-Throughput Manufacturing

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Bin Lu, W. J. Meng
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. March 2014, 2(1): 011007.
Paper No: JMNM-13-1053
https://doi.org/10.1115/1.4025978
Published Online: December 4, 2013
View Articletitled, Roll Molding of Microchannel Arrays on Al and Cu Sheet Metals: A Method for High-Throughput Manufacturing
Open the PDF for Roll Molding of Microchannel Arrays on Al and Cu Sheet Metals: A Method for High-Throughput Manufacturing in another window
Topics: Manufacturing, Microchannels, Molding, Rollers, Sheet metal, Strips, Stress, Flow (Dynamics)
Journal Articles

Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu-Based Microchannel Heat Exchangers

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Bin Lu, Ke Chen, W. J. Meng, Amar Karki, Rongying Jin
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. September 2013, 1(3): 031001.
Paper No: JMNM-12-1053
https://doi.org/10.1115/1.4024683
Published Online: July 9, 2013
View Articletitled, Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu-Based Microchannel Heat Exchangers
Open the PDF for Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu-Based Microchannel Heat Exchangers in another window
Topics: Annealing, Bonding, Microchannels, Temperature, Tension-leg platforms, Thermal conductivity, Thermal resistance, Transients (Dynamics), Heat transfer, Manufacturing