Reliability aspects are crucial for the success of every technology in industrial application. Regarding interconnect devices, several methods are applied to evaluate reliability of conductor paths like accelerated environmental tests. Especially, molded interconnect devices (MID), which enable numerous applications with three-dimensional (3D) circuitry on 3D shaped injection-molded thermoplastic parts are often under particular stress, e.g., as component of a housing. In this study, a new test method for evaluating the flexural fatigue strength of conductor paths produced by the laser-based LPKF-LDS® technology is presented. For characterization of test samples, a test bench for flexural fatigue test was built up. A result of the flexural fatigue test is a characteristic Woehler curve of the metal layer system. Applying this new test method, essential influencing parameters on the reliability of MID under mechanical load can be identified. So, the metal layer system as well as the geometric parameters of the metal layer is crucial for the performance. Furthermore, test specimens are tested under different types of mechanical load, i.e., tensile stress and compressive stress. For a holistic view on reliability of MID, experimental results are discussed and supported by simulations. An important finding of the study is the advantage of nickel-free layer systems in contrast to the Cu/Ni/Au layer system, which is often used in MID technology.

References

References
1.
Franke
,
J.
,
2014
,
Three-Dimensional Molded Interconnect Devices (3D-MID)—Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
,
Hanser Publishers
,
Munich, Germany
, pp. 192–195.
2.
Mueller
,
H.
,
Weser
,
S.
,
Eberhardt
,
W.
,
Kueck
,
H.
, and
Zimmermann
,
A.
,
2015
, “
Fine Pitch Metal Deposition on LDS Materials
,”
4M/ICOMM Conference
, Milan, Italy, Mar. 31–Apr. 2, pp. 506–509.
3.
Buckmüller
,
P.
,
Eberhardt
,
W.
,
Kessler
,
U.
,
Willeck
,
H.
, and
Kueck
,
H.
,
2010
, “
Aluminium Wedge–Wedge Wire Bonding on Thermoplastic Substrates Made by LPKF-LDS® Technology
,” 3rd Electronic System-Integration Technology Conference (
ESTC
), Berlin, Germany, Sept. 13–16, pp. 1–5.
4.
Kuepfer
,
R.
, and
Hess
,
T.
,
2016
, “
A Volume Business—MID in the Pole Position
,”
12th International Congress Molded Interconnect Devices
(MID), Wuerzburg, Germany, Sept. 28–29, pp.
247
255
.
5.
Roesler
,
J.
,
Harders
,
H.
, and
Baeker
,
M.
,
2008
,
Mechanisches Verhalten der Werkstoffe
,
Vieweg + Teubner
,
Wiesbaden, Germany
, pp.
357
363
.
6.
Roos
,
E.
, and
Maile
,
K.
,
2005
,
Werkstoffkunde Für Ingenieure
,
Springer Verlag
,
Berlin, Germany
, pp.
102
104
.
7.
Groezinger
,
T.
,
Wild
,
P.
, and
Kueck
,
H.
,
2014
, “
Investigations on MID-Reliability Under Thermal and Mechanical Cyclic Loading
,”
11th International Congress Molded Interconnect Devices
(MID), Nuremberg, Germany, Sept. 24–25.
8.
Celanese Corporation,
2011
, “Ticona—A Business of Celanese,” Celanese Corporation, Irving, TX.
9.
Warkentin
,
D.
,
2005
, “
Untersuchungen zu kapazitiven Beschleunigungssensoren aus metallbeschichtetem
Kunststoff,” Doctoral thesis, University of Stuttgart, Stuttgart, Germany.
10.
Fischer
,
A.
,
Mueller
,
H.
, and
Kuhn
,
T.
,
2014
, “
Reliability of LDS Conductor Paths—Influencing Factors and Characterization Methods
,”
11th International Congress Molded Interconnect Devices
(MID), Nuremberg, Germany, Sept. 24–25.
11.
Kanani
,
N.
,
2007
,
Chemische Vernickelung
,
Eugen G. Leuze Verlag
,
Bad Saulgau, Germany
, pp.
128
130
; 161–164; 272–279; and 297–300.
12.
ANSYS,
2016
, “Materials Data Base,” ANSYS Inc., Canonsburg, PA.
13.
MatWeb,
2016
, “Nickel,” MatWeb, LLC, Blacksburg, VA, accessed May 11, 2017, http://www.matweb.com/search/DataSheet.aspx?MatGUID=e6eb83327e534850a062dbca3bc758dc
14.
Kanani
,
N.
,
2000
,
Kupferschichten
,
Eugen G. Leuze Verlag
,
Bad Saulgau, Germany
, pp.
201
203
.
You do not currently have access to this content.