During the electrical-assisted forming process, a significant decrease in the flow stress of the metal is beneficial to reduce the required force for the deformation with high-density electrical current introduced through the materials. It is an alternative manufacturing process of traditional hot forming to improve the formability without the undesirable effects caused by elevated temperature, such as surface oxidation. In this study, tension tests and electrical-assisted embossing process (EAEP) experiments were performed to study the electroplastic (EP) effect with high-density pulse current applied to the specimen and demonstrate the advantage of EAEP. In the first section of this study, specimens with various grain sizes were well prepared and an experimental setup was established to study the flow stress of SS316L sheet in the electroplastic tensile test. Extra cooling system was developed and the temperature increase caused by resistive heating was controlled. Thermal influence caused by resistive heating was thereby reduced. The impacts of the pulse current parameters on the flow stress were investigated. It was observed that the flow stress of the SS316L specimens was significantly reduced by the electroplastic effect. In the second section, the EAEP was proposed to fabricate microchannel feature on metal workpiece. Experiments were conducted to demonstrate the feasibility and advantage of the novel process. The protrusion feature height and microstructure of the grain deformation were measured to investigate the effect of the process parameters, such as the current density, the die geometric dimension, and the grain size of the specimen. Larger feature height was measured owing to the higher density current, which meant the electroplastic effects were helpful in EAEP.
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June 2014
Research-Article
Experimental Investigation of Tensile Properties of SS316L and Fabrication of Micro/Mesochannel Features by Electrical-Assisted Embossing Process
Linfa Peng,
Linfa Peng
Shanghai Key Laboratory of Digital Manufacture for Thin-Walled Structures,
Shanghai Jiao Tong University
,Shanghai 200240
, China
;State Key Laboratory of Mechanical
System and Vibration,
Shanghai 200240,
System and Vibration,
Shanghai Jiao Tong University
,Shanghai 200240,
China
Search for other works by this author on:
Jianming Mai,
Jianming Mai
Shanghai Key Laboratory of Digital Manufacture for Thin-Walled Structures,
Shanghai Jiao Tong University
,Shanghai 200240
, China
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Tianhao Jiang,
Tianhao Jiang
Shanghai Key Laboratory of Digital Manufacture for Thin-Walled Structures,
Shanghai Jiao Tong University
,Shanghai 200240
, China
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Xinmin Lai,
Xinmin Lai
1
State Key Laboratory of Mechanical
System and Vibration,
e-mail: xmlai@sjtu.edu.cn
System and Vibration,
Shanghai Jiao Tong University
,Shanghai 200240
, China
e-mail: xmlai@sjtu.edu.cn
1Corresponding author.
Search for other works by this author on:
Zhongqin Lin
Zhongqin Lin
State Key Laboratory of Mechanical
System and Vibration,
System and Vibration,
Shanghai Jiao Tong University
,Shanghai 200240
, China
Search for other works by this author on:
Linfa Peng
Shanghai Key Laboratory of Digital Manufacture for Thin-Walled Structures,
Shanghai Jiao Tong University
,Shanghai 200240
, China
;State Key Laboratory of Mechanical
System and Vibration,
Shanghai 200240,
System and Vibration,
Shanghai Jiao Tong University
,Shanghai 200240,
China
Jianming Mai
Shanghai Key Laboratory of Digital Manufacture for Thin-Walled Structures,
Shanghai Jiao Tong University
,Shanghai 200240
, China
Tianhao Jiang
Shanghai Key Laboratory of Digital Manufacture for Thin-Walled Structures,
Shanghai Jiao Tong University
,Shanghai 200240
, China
Xinmin Lai
State Key Laboratory of Mechanical
System and Vibration,
e-mail: xmlai@sjtu.edu.cn
System and Vibration,
Shanghai Jiao Tong University
,Shanghai 200240
, China
e-mail: xmlai@sjtu.edu.cn
Zhongqin Lin
State Key Laboratory of Mechanical
System and Vibration,
System and Vibration,
Shanghai Jiao Tong University
,Shanghai 200240
, China
1Corresponding author.
Contributed by the Manufacturing Engineering of ASME for publication in the JOURNAL OF MICRO- AND NANO-MANUFACTURING. Manuscript received June 16, 2013; final manuscript received February 10, 2014; published online March 24, 2014. Assoc. Editor: Ulf Engel.
J. Micro Nano-Manuf. Jun 2014, 2(2): 021002 (11 pages)
Published Online: March 24, 2014
Article history
Received:
June 16, 2013
Revision Received:
February 10, 2014
Citation
Peng, L., Mai, J., Jiang, T., Lai, X., and Lin, Z. (March 24, 2014). "Experimental Investigation of Tensile Properties of SS316L and Fabrication of Micro/Mesochannel Features by Electrical-Assisted Embossing Process." ASME. J. Micro Nano-Manuf. June 2014; 2(2): 021002. https://doi.org/10.1115/1.4026884
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