Simulations of surface mounted electronic assemblies under general mechanical loading conditions have been performed using an hybrid analytical/experimental analysis approach. This method combines analytical techniques with experimentally determined load-deformation characteristics of the surface-mounted assemblies to predict loadings and deformations of the assemblies. An automated analysis procedure which integrated the finite element method, optimization theory, and the hybrid analysis approach was developed. This procedure can be used to study the strength of surface mounted devices located anywhere on a printed circuit board subjected to specified loading conditions.

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