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1-7 of 7
Keywords: adhesives
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 2011, 133(3): 031006.
Published Online: July 18, 2011
...Z. Ahmad; M. P. Ansell; D. Smedley Adhesives used for bonded-in steel or composite pultruded rods and plate to make connections in timber structures are commonly room temperature cure adhesives. The room temperature cure, applied without pressure, thixotropic, and shear thinning characteristics...
Journal Articles
Publisher: ASME
Article Type: Multi-Physics Approaches For The Behavior Of Polymer-Based Materials
J. Eng. Mater. Technol. July 2011, 133(3): 030906.
Published Online: July 5, 2011
...Jean Yves Cognard; Romain Créac’hcadec; Laurent Sohier Experimental and numerical analyses of the mechanical behavior of bonded joints can be made particularly difficult by the influence of edge effects. Therefore, understanding the stress distribution in an adhesive joint can lead to improvements...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. April 2011, 133(2): 021015.
Published Online: March 21, 2011
...Dongyeon Lee; Hareesh V. Tippur; Brian J. Jensen; Philip B. Bogert Tensile and fracture responses of the phenylethynyl terminated imide oligomer (PETI-5) are studied. Since this polymer is a candidate aerospace structural adhesive as well as a matrix material in composite systems, neat as well...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. July 2010, 132(3): 031016.
Published Online: June 24, 2010
...Z. Ahmad; M. P. Ansell; D. Smedley The environmental stability of three room temperature cure epoxy adhesives was evaluated following exposure to temperatures of 20 ° C , 30 ° C , and 50 ° C at 95%RH, to 50 ° C in air and soaked in water for up to 90 days. The adhesives contained nano...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2004, 126(1): 14–18.
Published Online: January 22, 2004
...Deok-Bo Lee; Toru Ikeda; Noriyuki Miyazaki; Nak-Sam Choi The effect of bond thickness on the fracture toughness of adhesive joints was investigated from a microstructural perspective, using compact tension (CT) adhesive-joint specimens with different bond thicknesses. The adhesive material...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. July 2001, 123(3): 322–328.
Published Online: March 15, 2001
...Jianmei He; Martin Y. M. Chiang; Donald L. Hunston A finite element analysis (FEA) was conducted to examine the feasibility of determining the shear modulus of an adhesive in a bonded geometry using a three-point bending test on a sandwich beam specimen. The FEA results were compared...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2000, 122(1): 80–85.
Published Online: June 22, 1999
...Toru Ikeda; Akira Yamashita; Deokbo Lee; Noriyuki Miyazaki The evaluation of a fracture from a thin layer constrained by a hard material is important in relation to the structural integrity of adhesive joints and composite materials. It has been reported that the fracture toughness of a crack...
