The constitutive response of 63/37 Sn/Pb eutectic solder is studied under uniaxial tension. Stress-strain tests were performed under a wide range of applied strain rate, and creep tests were performed at several levels of applied load. Temperature dependence was ascertained by running the stress-strain and creep tests at various temperatures. With the goal of providing a constitutive description of the eutectic suitable for use in electronics packaging engineering finite element analyses, the material parameters of the phenomenological viscoplasticity model of Bodner and Partom were fit to these experiments as functions of temperature. The experiments described herein also yield important information concerning how many microstructural units must be present in a sample in order for repeatable, isotropic response to be obtained.
Issue Section:
Technical Papers
1.
Adams, P. J., 1981, “Thermal Fatigue of Solder Joints in Micro-Electronic Devices,” M. S. thesis, Massachusetts Institute of Technology.
2.
Arrowood, R., Mukherjee, A., and Jones, W. B., 1991, “Hot Deformation of Two-Phase Mixtures,” Solder Mechanics: A State of the Art Assessment D. R. Frear, W. B. Jones and K. R. Kinsman, eds. The Minerals, Metals & Materials Society, Warrendale, PA.
3.
Beek, J. M., 1986, “A Comparison of Current Models for Nonlinear Rate-Dependent Material Behavior of Crystalline Solids,” M.S. thesis, Texas A&M University.
4.
Bodner
S. R.
Partom
I.
Partom
Y.
1979
, “Uniaxial Cyclic Loading of Elastic-Viscoplastic Materials
,” ASME Journal of Applied Mechanics
, Vol. 46
, p. 805
805
.5.
Bodner
S. R.
Partom
Y.
1972
, “A Large Deformation Elastic-Viscoplastic Analysis of a Thick-Walled Spherical Shell
,” ASME Journal of Applied Mechanics
, Vol. 39
, p. 751
751
.6.
Bodner
S. R.
Partom
Y.
1975
, “Constitutive Equations for Elastic-Viscoplastic Strain-Hardening Materials
,” ASME Journal of Applied Mechanics
, Vol. 42
, p. 385
385
.7.
Bonda, N. R., and Noyan, I. C., 1991, “Deformation Inhomogeneity and Representative Volume in Pb/Sn Solder Alloys,” IBM Research Report, T. J. Watson Research Center, Yorktown Heights, NY.
8.
Busso
E. P.
Kitano
M.
Kumazawa
T.
1992
, “A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints
,” ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol. 114
, p. 331
331
.9.
Cagnon
M.
Suery
M.
Eberhardt
A.
Baudelet
B.
1977
, “High Temperature Deformation of the Pb-Sn Eutectic
,” Acta Metal.
, Vol. 25
, p. 71
71
.10.
Chan
K. S.
Bodner
S. R.
Lindholm
U. S.
1988
, “Phenomenological Modeling of Hardening and Thermal Recovery in Metals
,” ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol. 110
, p. 1
1
.11.
Chan, K. S., Bodner, S. R., Walker, K. P., and Lindholm, U. S., 1984, “A Survey of Unified Constitutive Theories,” 1984 Symposium on Nonlinear Constitutive Relations for High Temperature Applications, Cleveland, OH.
12.
Chan, K. S., Lindholm, U. S., and Bodner, S. R., 1988, “Constitutive Modeling for Isotropic Materials (HOST—Final Report),” NASA Contract CR-182132, June.
13.
Enke
N. F.
Kilinski
T. J.
Schroeder
S. A.
Lesniak
J. R.
1989
, “Mechanical Behaviors of 60/40 Tin-Lead Solder Lap Joints
,” IEEE Trans. Comp. Hybrids, Manuf. Technol
, Vol. 12
, p. 459
459
.14.
Frear
D.
Grivas
D.
Morris
J. W.
1988
, “A Microstructural Study of the Thermal Fatigue Failures of 60Sn-40Pb Solder Joints
,” J. Electronic Mat.
, Vol. 17
, p. 171
171
.15.
Harren
S. V.
Asaro
R. J.
1989
, “Nonuniform Deformations in Polycrystals and Aspects of the Validity of the Taylor Model
,” J. Mech. Phys. Solids
, Vol. 37
, p. 191
191
.16.
Harren
S. V.
De`ve
H. E.
Asaro
R. J.
1988
, “Shear Band Formation in Plane Strain Compression
,” Acta Metal
, Vol. 36
, p. 2435
2435
.17.
Harren, S. V., and Skipor, A. F., 1995, “Thermal Cycling of Temperature and Strain Rate Dependent Solder Joints,” to be submitted for publication.
18.
James, G. H., 1986, “An Experimental Comparison of Current Viscoplastic Constitutive Models at Elevated Temperatures,” M.S. thesis, Texas A&M University.
19.
James
G. H.
Imbrie
P. K.
Hill
P. S.
Allen
D. H.
Haisler
W. E.
1987
, “An Experimental Comparison of Several Current Viscoplastic Constitutive Models at Elevated Temperature
,” ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol. 109
, p. 130
130
.20.
Kashyap
B. P.
Murty
G. S.
1981
, “Experimental Constitutive Relations for the High Temperature Deformation of a Pb-Sn Eutectic Alloy
,” Mat. Sci. Engng.
, Vol. 50
, p. 205
205
.21.
Kelley
J. M.
Gillis
P. P.
1974
, “The Influence of a Limiting Dislocation Flux on the Mechanical Response of Polycrystalline Metals
,” Int. J. Solids Struct.
, Vol. 10
, p. 45
45
.22.
Knecht
S.
Fox
L. R.
1990
, “Constitutive Relations and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder
,” IEEE Trans. Comp. Hybrids, Manuf. Technol
, Vol. 13
, p. 424
424
.23.
Kocks
U. F.
1976
, “Laws for Work-Hardening and Low-Temperature Creep
,” ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol. 98
, p. 76
76
.24.
Lau
J.
1989
, “Thermal Stress Analysis of SMT PQFP Packages and Interconnections
,” ASME Journal of Electronic Packaging
, Vol. 111
, p. 2
2
.25.
Lau
J.
Keely
C. A.
1989
, “Dynamic Characterization of Surface-Mount Component Leads for Solder Joint Inspection
,” IEEE Trans. Comp. Hybrids, Manuf. Technol
, Vol. 12
, p. 594
594
.26.
Lau, J., Powers, L., Baker, J., Rice, D., and Shaw, B., 1989, “Solder Joint Reliability of Fine Pitch Surface Mount Technology Assemblies,” 1989 IEMTS Symposium, San Francisco, CA.
27.
Lau, J., and Rice, D. W., 1985, “Solder Joint Fatigue in Surface Mount Technology: State of the Art,” Solid State Technology, Oct., p. 91.
28.
Lau
J.
Rice
D. W.
Harkins
C. G.
1990
, “Thermal Stress Analysis of Tape Automated Bonding and Interconnections
,” IEEE Trans. Comp. Hybrids, Manuf. Technol.
, Vol. 13
, p. 182
182
.29.
Merzer
A. M.
1982
, “Steady and Transient Creep Behavior Based on Unified Constitutive Equations
,” ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol. 104
, p. 18
18
.30.
Milly, T. M., 1981, “A Comparative Study of Nonlinear Rate-Dependent Mechanical Constitutive Theories for Crystalline Solids at Elevated Temperatures,” M.S. thesis, Virginia Polytechnic Institute and State University.
31.
Ramaswamy, V. G., 1985, “A Constitutive Model for the Inelastic Multiaxial Cyclic Response of a Nickel Base Superalloy Rene´ 80,” Ph.D. thesis, University of Cincinnati.
32.
Rhode
R. W.
Swearengen
J. C.
1980
, “Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys
,” ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol. 102
, p. 207
207
.33.
Riemer
D. E.
1990
, “Cycle Life Prediction for SMT Solder Joints on TCE-Mismatched Substrates
,” Soldering and Surface Mount Technology
, No. 6
, p. 52
52
.34.
Skipor, A. F., Harren, S. V., and Botsis, J., 1995, “The Effect of Mechanical Constraint on the Flow and Fracture of 63/37 Sn/Pb Eutectic Alloy,” Engineering Fracture Mechanics. In press.
35.
Stouffer, D. C., 1981, “A Constitutive Representation for IN 100,” Technical Report AFWAL-TR-81-4039, June.
36.
Stouffer, D. C., and Ramaswamy, V. G., 1988, “Constitutive Model for the Uniaxial, Multiaxial, and Thermomechanical Response of Rene´ 80 between 538°C and 1093°C,” 1988 ASME Winter Annual Meeting, Chicago, IL.
37.
Touloukian, Y. S., Kirby, R. K., Taylor, R. E., and Desai, P. D., 1975, Thermophysical Properties of Matter (Vol. 12), The TPRC Data Series, Plenum Publishers, New York, p. 874.
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