Interfacial contacting processes under a high temperature and a high bonding pressure (T = 973 K, P = 30 MPa) are experimentally studied, using oxygen free copper. The faying surfaces were machined by lathe, resulting in controlled regular surface asperities. The asperity angle of surface ridges was changed from 10 to 60 deg. The change in the interfacial deformation mode with the asperity angle has been investigated. Results show the interfacial contact process is strongly influenced by the asperity angle (shape of surface ridge). The bonding tests were carried out in high vacuum atmosphere (10−4 Pa) so that the surface oxide film need not be considered. Experimental results are in good agreement with the results calculated by a finite element model, in which the interfacial contact is assumed to be produced by power law creep alone. It was thus suggested that void coalescence is governed by power law creep under the present test conditions (T = 973 K and P = 30 MPa) except for the final stage of bonding. Experimental results also suggest that the elementary rate process of interfacial contact due to power law creep is classified into two types; surface folding and interfacial expansion. Here, the surface folding is the phenomenon that two faying surfaces are overlapped to each other and the interfacial expansion means that the bonded interface area is extended along the bond-interface.

1.
Derby
B.
, and
Wallach
E. R.
,
1982
, “
Theoretical Model for Diffusion Bonding
,”
Metal Sci.
, Vol.
16
, pp.
49
56
.
2.
Guo
Z. X.
, and
Ridley
N.
,
1987
, “
Modeling of Diffusion Bonding of Metals
,”
Materials Sci. and Technology
, Vol.
3
, pp.
945
953
.
3.
Nishiguchi
K.
, and
Takahashi
Y.
,
1985
, “
A Quantitative Analysis of Solid State Bonding Process Based on Fundamental Bonding Mechanisms
,”
Quarterly J. Japan Weld. Soc.
, Vol.
3
, pp.
303
315
.
4.
Panousis
N. T.
, and
Kershiner
R. C.
,
1980
, “
Thermocompression Bondability of Thick-Film Gold—A Comparison to Thin-Film Gold
,”
IEEE
, Vol.
CHMT-3
, No.
4
, pp.
617
623
.
5.
Takahashi
Y.
, and
Inoue
K.
,
1992
, “
Recent Void Shrinkage Models and Their Applicability to Diffusion Bonding
,”
Mater. Sci. and Tech.
, Vol.
8
, pp.
953
964
.
6.
Takahashi
Y.
,
Ueno
F.
, and
Nishiguchi
K.
,
1988
, “
A Numerical Analysis of the Void-shrinkage Process Controlled by Surface Diffusion
,”
Acta Metall.
, Vol.
36
, No.
11
, pp.
3007
3018
.
7.
Takahashi
Y.
,
Koguchi
T.
, and
Nishiguchi
K.
,
1993
a, “
Modeling of Viscoplastic Adhering Process by a Finite Element Technique
,”
ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol.
115
, pp.
150
155
.
8.
Takahashi
Y.
,
Koguchi
T.
, and
Nishiguchi
K.
,
1993
b, “
Effect of Bulk Deformation on Viscoplastic Adhering Process—A Numerical Study of Solid State Pressure Welding
,”
ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol.
115
, pp.
171
178
.
9.
Takahashi
Y.
, and
Nishiguchi
K.
,
1989
, “
Determination of Optimum Process Conditions in Solid Phase Bonding by a Numerical Model
,”
Welding in the World
, Vol.
27
, No.
3/4
, pp.
100
113
.
10.
Takahashi, Y., and Tanimoto, M., 1994, “Effect of Surface Asperity on Interfacial Contact Process Controlled by Power Law Creep—Numerical Study of Viscoplastic Adhering Process,” ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY, in press (1995).
This content is only available via PDF.
You do not currently have access to this content.