An interfacial contact process due to power law creep is studied using a finite element technique. The contact process is assumed to be produced by power law creep alone after initial intimate contact by instantaneous plastic deformation, i.e., no diffusional mechanisms for void shrinkage are taken into account. Also, the surface oxide film is not considered. If the bonded material is deformed, then the deformation is influenced by the initial faying surface wauiness with the asperity angle αo, and the contact process is achieved by two modes; surface folding at the bond-interface (type I) and interfacial expansion (type II), where the surface folding is the phenomenon that two faying surfaces are overlapped to each other. The surface folding phenomenon occurs preferentially when αo is less than 30 deg (as the surface wauiness height decreases). On the other hand, the interfacial expansion is dominant at αo > 45 deg. This can be explained in terms of the distribution of equivalent strain (stress) in the vicinity of the bond-interface.

1.
Enjo
T.
,
Ikeuchi
K.
, and
Akikawa
N.
,
1982
, “
Effect of The Roughness of Faying Surface on The Early Process of Diffusion Welding
,”
J. Jap. Weld. Soc.
, Vol.
51
, No.
12
, pp.
1028
1035
.
2.
Garmong
G.
,
Paton
N. E.
, and
Argon
A. S.
,
1975
, “
Attainment of Full Interfacial Contact During Diffusion Bonding
,”
Metall. Trans.
, Vol.
6A
, pp.
1269
1279
.
3.
Hamilton, C. H., 1973, “Pressure Requirements for Diffusion Bonding of Metals,” Titanium Sci. and Tech., R. I. Jaffee and H. H. Burte, eds., Vol. 1, Plenum Press, New York, pp. 625–648.
4.
Hill
A.
, and
Wallach
E. R.
,
1989
, “
Modelling Solid State Diffusion Bonding
,”
Acta Metall.
, Vol.
37
, pp.
2425
2437
.
5.
Hill, R., 1950, The Mathematical Theory of Plasticity, Oxford at the Clarendon Press, London, pp. 213–226.
6.
Nishiguchi
K.
, and
Takahashi
Y.
,
1985
, “
A Quantitative Analysis of Solid State Bonding Process Based on Fundamental Bonding Mechanisms
,”
Quarterly J. Japan Weld. Soc.
, Vol.
3
, pp.
303
315
.
7.
Ohashi
O.
, and
Hashimoto
T.
,
1976
, “
Study on Diffusion Welding (Report 1)
,”
J. Jap. Weld. Soc.
, Vol.
45
, No.
1
, pp.
78
81
.
8.
Takahashi
Y.
, and
Inoue
K.
,
1992
, “
Recent Void Shrinkage Models and Their Applicability to Diffusion Bonding
,”
Mater. Sci. and Tech.
, Vol.
8
, pp.
953
964
.
9.
Takahashi
Y.
,
Koguchi
T.
, and
Nishiguchi
K.
,
1993
a, “
Modeling of Viscoplastic Adhering Process by a Finite Element Technique
,”
ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol.
115
, pp.
150
155
.
10.
Takahashi
Y.
,
Koguchi
T.
, and
Nishiguchi
K.
,
1993
b, “
Effect of Bulk Deformation on Viscoplastic Adhering Process—A Numerical Study of Solid State Pressure Welding
,”
ASME JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY
, Vol.
115
, pp.
171
178
.
11.
Tomita
Y.
, and
Sowerby
R.
,
1978
, “
An Approximate Analysis for Studying the Deformation Mechanics of Rate Sensitive Materials
,”
Int. J. Mech. Sci.
, Vol.
20
, pp.
361
371
.
12.
Wilkinson
D. S.
, and
Ashby
M. F.
,
1975
, “
Pressure Sintering by Power Law Creep
,”
Acta Metall.
, Vol.
23
, pp.
1277
1285
.
This content is only available via PDF.
You do not currently have access to this content.