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Keywords: wire saw slicingClose
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2011, 133(2): 021012.
Published Online: March 23, 2011
...Hongxu Zhao; Ran Jin; Su Wu; Jianjun Shi Thickness uniformity of wafers is a critical quality measure in a wire saw slicing process. Nonuniformity occurs when the material removal rate (MRR) changes over time during a slicing process, and it poses a significant problem for the downstream processes...