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Keywords: sawing machinesClose
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2011, 133(2): 021012.
Published Online: March 23, 2011
.... Experiments are conducted to slice the ingots in a HCT Shaping ™ wire saw machine. The thicknesses of the sliced wafers are measured with an ADE WaferCheck ™ system, and the experimental ln(MRR) profile is calculated according to Eq. 1 . The ln(MRR) profile is used to estimate the PDE-constrained GP...
Article Type: Design Innovations
J. Manuf. Sci. Eng. August 2006, 128(3): 826–834.
Published Online: January 24, 2006
... of the photosensitive surface of the dual-element photodiode and the laser beam focal point with respect to the 160 μ m diameter wire in the laser beam direction. Furthermore, a measurement experiment is carried out on a wire-saw machine under no-slurry and no-workpiece conditions. The paper reports and discusses...