In the abrasive cut-off operation in which a thin rotating disk is plunged through a workpiece, chips must be stored as a grain traverses the entire width of work being ground. Also, heat flows radially inward from the wheel surface for a longer time the wider the workpiece, thus increasing the tendency to overheat the polymeric bond posts that hold the abrasive grains in place. Oscillation of the workpiece in a tangential direction tends to reduce the length of continuous contact between abrasive grain and work and significantly improves grinding performance when relatively wide workpieces are ground. This paper discusses the more important aspects of the abrasive cut-off operation with oscillation.
The Abrasive Cut-off Operation With Oscillation
Mechanical Engineering Laboratory, Tokyo, Japan
M. C. Shaw
Mechanical Engineering Dept., Carnegie-Mellon University, Pittsburgh, Pa.
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Murata, R., and Shaw, M. C. (May 1, 1976). "The Abrasive Cut-off Operation With Oscillation." ASME. J. Eng. Ind. May 1976; 98(2): 410–422. doi: https://doi.org/10.1115/1.3438891
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