Expressions are derived for the bond stresses induced by a radially symmetric temperature distribution in spherical propellant grains bonded to spherical casings. Equations for the evaluation of radial and tangential stresses in the propellant and its casing have also been derived. Both solid and hollow propellant grains have been investigated. Design considerations have been developed to enable the designer to minimize the bond stress. A comparison between the hollow and solid spherical propellant assembly shows that the hollow sphere has a lower bond stress than the solid sphere, assuming all other factors are the same.

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