Bubble Behavior and Its Effect on Surface Integrity in Laser-Induced Plasma Micro-Machining Silicon Wafer

Laser-induced plasma micro-machining (LIPMM) process does well in fabricating high-quality surface microstructures of hard and brittle materials. However, the liquid medium is overheated to induce lots of bubbles to defocus the laser beam, reducing machining stability, and explosive behavior of bubbles destroys the surface quality. Thus, the static and dynamical behaviors of bubbles in LIPMM are comprehensively investigated in this article. First, a series of mechanisms including bubble generation and growth, bubble motion and explosion, and the effect of bubbles behavior on machining characteristics were explained. Second, a volume of fluid (VOF) model of bubble motions in laser-induced plasma micro-machining was established to simulate the dynamical behavior of bubbles under different depths of water layer, which reflect the growth of microbubbles, the aggregation of multiple bubbles, and the floating movement of bubbles. Then, a series of experiments were carried out to reveal bubble static behaviors, and further bubble explosion behaviors on surface integrity, surface defects, and hardness were analyzed. The increase of laser frequency leads to the increase of the maximum attached bubble size. Obstructed by bubble dynamical behaviors, a discontinuous section and the unablated area are observed in the microchannel. The elastic modulus and surface hardness of surface impacted by explosion bubbles are reduced. This research contributes to better understanding bubble behavior related to machining performances in LIPMM of single-crystal silicon.