This study investigated the sawing of A-plane and C-plane sapphires using the reciprocating diamond wire saw. The influences of process parameters and sapphire crystal structure on sawing force were experimentally researched. The experimental results indicated that, in sapphire sawing process, the sapphire crystal structure, the wire speed, and the feed rate had effects on the tangential sawing forces, and the tangential forces had good linear relationships with the material removal rates (MRRs). The specific sawing energies in the stable stage were clearly smaller than in the unstable stage.

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