This study investigated the sawing of A-plane and C-plane sapphires using the reciprocating diamond wire saw. The influences of process parameters and sapphire crystal structure on sawing force were experimentally researched. The experimental results indicated that, in sapphire sawing process, the sapphire crystal structure, the wire speed, and the feed rate had effects on the tangential sawing forces, and the tangential forces had good linear relationships with the material removal rates (MRRs). The specific sawing energies in the stable stage were clearly smaller than in the unstable stage.
An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw
Manuscript received March 31, 2017; final manuscript received September 28, 2017; published online November 2, 2017. Assoc. Editor: Kai Cheng.
- Views Icon Views
- Share Icon Share
- Cite Icon Cite
- Search Site
Huang, H., Li, X., and Xu, X. (November 2, 2017). "An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw." ASME. J. Manuf. Sci. Eng. December 2017; 139(12): 121011. https://doi.org/10.1115/1.4038109
Download citation file:
- Ris (Zotero)
- Reference Manager