The microscale laser dynamic forming (LDF) process is a high strain rate microfabrication technique, which uses a pulse laser to generate high pressure by vaporizing and ionizing an ablative coating, and thus produces complex 3D microstructures in thin foils. One of the most important features of this technique is ultrahigh strain rate (typically ), which is theoretically favorable for increasing formability. However, due to the lack of measurement techniques in microscale and submicroscale, the formability of workpieces in LDF is hardly studied. In this article, experiments were carried out on aluminum foils to study the forming limits and fracture of thin films in LDF. The deformation depth was measured by an optical profilometer and the formed feature was observed using a focused ion beam and a scanning electron microscope. Meanwhile, a finite element model based on a modified Johnson–Cook constitutive model and a Johnson–Cook failure model was developed to simulate the mechanical and fracture behaviors of materials in LDF. Experimental results were used to verify the model. The verified model was used to predict the forming limit diagram of aluminum foil in LDF. The forming limit diagrams show a significant increase in formability compared with other metal forming processes.
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e-mail: gjcheng@purdue.edu
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December 2010
Research Papers
Forming Limit and Fracture Mode of Microscale Laser Dynamic Forming
Ji Li,
Ji Li
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906
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Huang Gao,
Huang Gao
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906
Search for other works by this author on:
Gary J. Cheng
Gary J. Cheng
School of Industrial Engineering,
e-mail: gjcheng@purdue.edu
Purdue University
, West Lafayette, IN 47906
Search for other works by this author on:
Ji Li
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906
Huang Gao
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906
Gary J. Cheng
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906e-mail: gjcheng@purdue.edu
J. Manuf. Sci. Eng. Dec 2010, 132(6): 061005 (10 pages)
Published Online: October 19, 2010
Article history
Received:
November 5, 2009
Revised:
June 10, 2010
Online:
October 19, 2010
Published:
October 19, 2010
Citation
Li, J., Gao, H., and Cheng, G. J. (October 19, 2010). "Forming Limit and Fracture Mode of Microscale Laser Dynamic Forming." ASME. J. Manuf. Sci. Eng. December 2010; 132(6): 061005. https://doi.org/10.1115/1.4002546
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