In droplet-based manufacturing processes, such as dropwise rapid prototyping, solder bumping, and spray forming, the quality of the deposit is adversely affected by bouncing of liquid droplets off the target surfaces. This study investigates the effects of wetting and surface roughness on the bouncing phenomenon. An analytical model, based on the conservation of energy during deposition, was developed to correlate wetting and surface roughness to a dimensionless droplet bouncing potential. In addition, experiments were conducted to image the deposition behavior of Pb solder droplets, averaging in diameter, on prepared substrates with a wide range of wetting properties and roughness levels. The high-speed image data correlate well with the model prediction that droplets are likely to bounce as a target surface becomes less wetting or is roughened.
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April 2009
Research Papers
The Effects of Wetting and Surface Roughness on Liquid Metal Droplet Bouncing
Wen-Kai Hsiao,
Wen-Kai Hsiao
Laboratory for Manufacturing and Productivity,
Massachusetts Institute of Technology
, 77 Massachusetts Avenue, Cambridge MA 02139
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Jung-Hoon Chun,
Jung-Hoon Chun
Laboratory for Manufacturing and Productivity,
Massachusetts Institute of Technology
, 77 Massachusetts Avenue, Cambridge MA 02139
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Nannaji Saka
Nannaji Saka
Laboratory for Manufacturing and Productivity,
Massachusetts Institute of Technology
, 77 Massachusetts Avenue, Cambridge MA 02139
Search for other works by this author on:
Wen-Kai Hsiao
Laboratory for Manufacturing and Productivity,
Massachusetts Institute of Technology
, 77 Massachusetts Avenue, Cambridge MA 02139
Jung-Hoon Chun
Laboratory for Manufacturing and Productivity,
Massachusetts Institute of Technology
, 77 Massachusetts Avenue, Cambridge MA 02139
Nannaji Saka
Laboratory for Manufacturing and Productivity,
Massachusetts Institute of Technology
, 77 Massachusetts Avenue, Cambridge MA 02139J. Manuf. Sci. Eng. Apr 2009, 131(2): 021010 (8 pages)
Published Online: March 27, 2009
Article history
Received:
November 27, 2007
Revised:
January 5, 2009
Published:
March 27, 2009
Citation
Hsiao, W., Chun, J., and Saka, N. (March 27, 2009). "The Effects of Wetting and Surface Roughness on Liquid Metal Droplet Bouncing." ASME. J. Manuf. Sci. Eng. April 2009; 131(2): 021010. https://doi.org/10.1115/1.3090884
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