The response of solid to shock compression has been an interesting topic for more than a century. The present work is the first attempt to experimentally show that plastic deformation can be generated in brittle materials by a heat-assisted laser shock peening process, using silicon crystal as a sample material. Strong dislocation activity and large compressive residual stress are induced by this process. The dislocation structure is characterized with transmission electron microscopy and electron backscattered diffraction. The residual stress is measured using Raman scattering. This work presents a fundamental base for the application of laser shock peening in brittle materials to generate large compressive residual stress and plastic deformation for better mechanical properties, such as fatigue life and fracture toughness.
Skip Nav Destination
Article navigation
February 2008
Research Papers
Plastic Deformation in Silicon Crystal Induced by Heat-Assisted Laser Shock Peening
Gary J. Cheng,
Gary J. Cheng
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906
Search for other works by this author on:
M. Cai,
M. Cai
Department of Engineering Technology,
University of Houston
, Houston, TX 77204
Search for other works by this author on:
Daniel Pirzada,
Daniel Pirzada
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
Search for other works by this author on:
Maxime J.-F. Guinel,
Maxime J.-F. Guinel
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
Search for other works by this author on:
M. Grant Norton
M. Grant Norton
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
Search for other works by this author on:
Gary J. Cheng
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906
M. Cai
Department of Engineering Technology,
University of Houston
, Houston, TX 77204
Daniel Pirzada
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
Maxime J.-F. Guinel
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
M. Grant Norton
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164J. Manuf. Sci. Eng. Feb 2008, 130(1): 011008 (5 pages)
Published Online: February 6, 2008
Article history
Received:
February 27, 2007
Revised:
August 22, 2007
Published:
February 6, 2008
Citation
Cheng, G. J., Cai, M., Pirzada, D., Guinel, M. J., and Norton, M. G. (February 6, 2008). "Plastic Deformation in Silicon Crystal Induced by Heat-Assisted Laser Shock Peening." ASME. J. Manuf. Sci. Eng. February 2008; 130(1): 011008. https://doi.org/10.1115/1.2815343
Download citation file:
Get Email Alerts
Related Articles
Systematical Characterization of Material Response to Microscale Laser Shock Peening
J. Manuf. Sci. Eng (November,2004)
Characterization of Plastic Deformation Induced by Microscale Laser Shock Peening
J. Appl. Mech (September,2004)
Response of Thin Films and Substrate to Micro-Scale Laser Shock Peening
J. Manuf. Sci. Eng (June,2007)
Dynamic Material Response of Aluminum Single Crystal Under Microscale Laser Shock Peening
J. Manuf. Sci. Eng (June,2009)
Related Proceedings Papers
Related Chapters
Component and Printed Circuit Board
Thermal Management of Telecommunication Equipment, Second Edition
Component and Printed Circuit Board
Thermal Management of Telecommunications Equipment
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler & Pressure Vessel Codes, Volume 1 Sixth Edition