The response of solid to shock compression has been an interesting topic for more than a century. The present work is the first attempt to experimentally show that plastic deformation can be generated in brittle materials by a heat-assisted laser shock peening process, using silicon crystal as a sample material. Strong dislocation activity and large compressive residual stress are induced by this process. The dislocation structure is characterized with transmission electron microscopy and electron backscattered diffraction. The residual stress is measured using Raman scattering. This work presents a fundamental base for the application of laser shock peening in brittle materials to generate large compressive residual stress and plastic deformation for better mechanical properties, such as fatigue life and fracture toughness.
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February 2008
Research Papers
Plastic Deformation in Silicon Crystal Induced by Heat-Assisted Laser Shock Peening
Gary J. Cheng,
Gary J. Cheng
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906
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M. Cai,
M. Cai
Department of Engineering Technology,
University of Houston
, Houston, TX 77204
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Daniel Pirzada,
Daniel Pirzada
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
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Maxime J.-F. Guinel,
Maxime J.-F. Guinel
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
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M. Grant Norton
M. Grant Norton
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
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Gary J. Cheng
School of Industrial Engineering,
Purdue University
, West Lafayette, IN 47906
M. Cai
Department of Engineering Technology,
University of Houston
, Houston, TX 77204
Daniel Pirzada
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
Maxime J.-F. Guinel
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164
M. Grant Norton
School of Mechanical and Materials Engineering,
Washington State University
, Pullman, WA 99164J. Manuf. Sci. Eng. Feb 2008, 130(1): 011008 (5 pages)
Published Online: February 6, 2008
Article history
Received:
February 27, 2007
Revised:
August 22, 2007
Published:
February 6, 2008
Citation
Cheng, G. J., Cai, M., Pirzada, D., Guinel, M. J., and Norton, M. G. (February 6, 2008). "Plastic Deformation in Silicon Crystal Induced by Heat-Assisted Laser Shock Peening." ASME. J. Manuf. Sci. Eng. February 2008; 130(1): 011008. https://doi.org/10.1115/1.2815343
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