The transverse motion of a saw-wire affects the cutting surface geometry in wire-saw slicing. To evaluate the magnitude of the wire transverse motion under no-slurry and no-workpiece conditions, which should be minimized before starting the slicing process, a high accuracy, noncontact device has been developed. The measuring head of the device is composed of a laser diode module and a dual-element photodiode between which a saw-wire is placed for measurement. This paper elucidates the appropriate positional configurations of the photosensitive surface of the dual-element photodiode and the laser beam focal point with respect to the 160μm diameter wire in the laser beam direction. Furthermore, a measurement experiment is carried out on a wire-saw machine under no-slurry and no-workpiece conditions. The paper reports and discusses the critical issues, such as measurement sensitivity, linearity, and accuracy.

1.
Li
,
J.
,
Kao
,
I.
, and
Prasad
,
V.
, 1998, “
Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots Application to Silicon Wafer Production
,”
ASME J. Electron. Packag.
1043-7398,
120
, pp.
123
128
.
2.
Saphoo
,
R. K.
,
Prasad
,
V.
,
Kao
,
I.
,
Talbott
,
J.
, and
Gupta
,
K.
, 1998, “
An Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
,”
ASME J. Electron. Packag.
1043-7398,
120
, pp.
16
21
.
3.
Bhagavat
,
M.
,
Prasad
,
V.
, and
Kao
,
I.
, 2000, “
Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis
,”
ASME J. Tribol.
0742-4787,
122
, pp.
394
404
.
4.
Wei
,
S.
, and
Kao
,
I.
, 2000, “
Vibration Analysis of Wire in Free Abrasive Machining of the Modern Wiresaw Manufacturing Process
,”
J. Sound Vib.
0022-460X,
231
, pp.
1383
1395
.
5.
Ishikawa
,
K.
,
Suwabe
,
H.
,
Uneda
,
M.
,
Matsukawa
,
T.
, and
Kitajima
,
A.
, 2000, “
Effect of Slurry on Slicing Characteristics of Multi-Wire Saw
,”
J. Jpn. Soc. Precis. Eng.
0374-3543,
66
, pp.
1631
1635
.
6.
Ishikawa
,
K.
,
Suwabe
,
H.
,
Kitajima
,
A.
, and
Uneda
,
M.
, 2002, “
Effect of Slurry Behavior on Slicing Characteristics by Multi-Wire Saw of Descending Workpiece Type
,”
J. Jpn. Soc. Abrasive Tech.
,
46
, pp.
360
365
.
7.
Ishikawa
,
K.
,
Suwabe
,
H.
, and
Itoh
,
S.
, 2003, “
Relationship between Slurry Actions in Slicing Groove and Slicing Characteristics at Multi-Wire Saw
,”
J. Jpn. Soc. Precis. Eng.
0374-3543,
69
, pp.
1739
1743
.
8.
Zhu
,
L.
, and
Kao
,
I.
, 2005, “
Galerkin-Based Modal Analysis on the Vibration of Wire-Slurry System in Wafer Slicing Using a Wiresaw
,”
J. Sound Vib.
0022-460X,
283
, pp.
589
620
.
9.
Makino
,
K.
, and
Fukuda
,
K.
, 2001, “
The structure and function of the latest wire saw
,”
J. Soc. Grinding Eng.
,
45
, pp.
370
374
.
10.
For example,
Oishi
,
H.
,
Asakawa
,
K.
,
Matsuzaki
,
J.
,
Ashida
,
A.
, and
Uno
,
Y.
, 2000, “
Development of Water-Soluble Coolant for Multiwire Saw Slicing: Study on 400mm Diameter Silicon Ingot Slicing (1st Report)
,”
J. Jpn. Soc. Precis. Eng.
0374-3543,
66
, pp.
912
916
.
11.
Clark
,
W. I.
,
Shih
,
A. J.
,
Hardin
,
C. W.
,
Lemaster
,
R. L.
, and
McSpadden
,
S. B.
, 2003, “
Fixed Abrasive Diamond Wire Machining – Part I and Part II
,”
Int. J. Mach. Tools Manuf.
0890-6955,
43
, pp.
523
532
;
Clark
,
W. I.
,
Shih
,
A. J.
,
Hardin
,
C. W.
,
Lemaster
,
R. L.
, and
McSpadden
,
S. B.
, 2003, “
Fixed Abrasive Diamond Wire Machining – Part I and Part II
,”
Int. J. Mach. Tools Manuf.
0890-6955,
43
, pp.
533
542
.
12.
Hardin
,
C. W.
,
Qu
,
J.
, and
Shih
,
A. J.
, 2004, “
Fixed Abrasive Diamond Wire Saw Slicing of Single Crystal SiC Wafers
,”
Mater. Manuf. Processes
1042-6914,
19
, pp.
355
367
.
13.
Yamada
,
T.
,
Kinai
,
F.
,
Ichikawa
,
T.
,
Yokoyama
,
A.
,
Fukunaga
,
M.
, and
Ohshita
,
T.
, 2004, “
Warpage Analysis of Silicon Wafer in Ingot Slicing by Wire-Saw Machine
,”
AIP Conf. Proc.
0094-243X,
712
, pp.
1459
1463
.
14.
Ishikawa
,
K.
, 1995, “
High Efficiency and Precision Slicing of Brittle Materials
,”
Industrial Publishing & Consulting, Inc.
, pp.
183
191
.
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