The laser cleaning of copper surfaces with a Nd:YAG Q-switched laser pulse for the improvement of solder quality on printed circuit boards (PCBs) has been monitored and characterized by sensing the acoustic emission during the process and one-dimensional mathematical model analysis. It was found that selective removal of copper oxides from the surface was achieved by the laser operation, which was described theoretically by the model and was confirmed experimentally by the acoustic monitoring. The acoustic monitoring provided not only threshold laser fluence and optimal process window for the cleaning of copper but also the clear possibility for real-time surface monitoring of the process. Different features at the two laser wavelengths used (1064 nm and 532 nm) were observed in the surface morphology, i.e., the laser pulse with 532 nm wavelength produced a lightly sputtered wide area around the laser crater. From the theoretical and experimental investigation of laser cleaning mechanisms at different wavelengths, it was found that the mechanical effect induced by the intense shock waves was much more dominant at 532 nm wavelength than at 1064 nm.
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August 2001
Technical Papers
Characterization of Laser Cleaning of Copper for Soldering Processes
J. M. Lee,
J. M. Lee
Laser Group, Department of Engineering, University of Liverpool, Brownlow Street, Liverpool L69 3GH, UK
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K. G. Watkins,
K. G. Watkins
Laser Group, Department of Engineering, University of Liverpool, Brownlow Street, Liverpool L69 3GH, UK
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W. M. Steen
W. M. Steen
Laser Group, Department of Engineering, University of Liverpool, Brownlow Street, Liverpool L69 3GH, UK
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J. M. Lee
Laser Group, Department of Engineering, University of Liverpool, Brownlow Street, Liverpool L69 3GH, UK
K. G. Watkins
Laser Group, Department of Engineering, University of Liverpool, Brownlow Street, Liverpool L69 3GH, UK
W. M. Steen
Laser Group, Department of Engineering, University of Liverpool, Brownlow Street, Liverpool L69 3GH, UK
Contributed by the Manufacturing Engineering Division for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received June 1999; revised January 2000. Associate Editor: J. Lee.
J. Manuf. Sci. Eng. Aug 2001, 123(3): 521-527 (7 pages)
Published Online: January 1, 2000
Article history
Received:
June 1, 1999
Revised:
January 1, 2000
Citation
Lee , J. M., Watkins , K. G., and Steen, W. M. (January 1, 2000). "Characterization of Laser Cleaning of Copper for Soldering Processes ." ASME. J. Manuf. Sci. Eng. August 2001; 123(3): 521–527. https://doi.org/10.1115/1.1344897
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