Issue Section:
Nontraditional Processes
1.
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3.
Grant, N., “Recent trends and developments with rapidly solidified materials,” Metall. Trans. 23A, 1992, pp. 1083–1093.
4.
Dorn, L., Herbert, F., Jafari, S., and Purbst, D., “Investigation of the laser solderability of rapidly solidified solder materials in comparison to conventional solder materials,” Microsystem Technologies ’94, 1994, Berlin.
5.
Dorn, L., Grutzeck, H., and Jafari, S., “Schweißen und Lo¨ten mit Festko¨rperlasern”, Springer-Verlag, Berlin, 1992.
6.
Claeys, W., Quintard, V., and Dilhaire, S., “Optical Laser Probe for Solder Joints Quality Testing through Thermal-response Analysis,” Proc. of the 9th European Hybrid Microelectronics Conference, Nice, June 2–4, 1993, pp. 26–33.
7.
N. N., 1994, Focus on Tin, ITRI Publication, issue no. 7.
8.
Herbert, F., Illgen, L., and Rathmann, R., 1990, “Schnellerstarrte Lote in der Mikroelektronik,” 4. Tagung Elektroniktechnologie Berlin, 1990.
9.
Cheng
C. S.
A phase diagram of the alloys of the ternary system of Ag-Sb-Sn
”, Acta Physica Sinica
, Vol. 14
, No. 5
, 1958
, pp. 393
–399
.10.
Hansen, M., Der Aufbau der Zweistofflegierungen, Springer-Verlag, Berlin, 1936.
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