The effect of drilling speed and the chip load on the hole quality in a printed circuit board was investigated. The hole defects considered were smear, burr, nail heading and void. Holes drilled with different combinations of the speed and chip load were sectioned and examined using a scanning electron microscope to identify and quantify the defects. Each defect was related to the drilling variables in order to explain the reason for its formation and discuss the broad trends in the relationships.

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Lund, P., 1988, Quality Assessment of Printed Circuit Boards, Bishop Graphics, Inc., Westlake Village, CA, 1.
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op cit., Ref. 1, pp. 407–412.
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Bolton, R., and Hough, C. L., 1992, “Evaluation of Force and IR Thermal Centers for Drilling Printed Circuit Boards,” Energy Resources Conference, Houston.
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