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Proceedings Papers

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5576-8
Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems

Thermal Management

InterPACK 2013; V002T08A001doi:https://doi.org/10.1115/IPACK2013-73028
InterPACK 2013; V002T08A002doi:https://doi.org/10.1115/IPACK2013-73031
InterPACK 2013; V002T08A003doi:https://doi.org/10.1115/IPACK2013-73033
InterPACK 2013; V002T08A004doi:https://doi.org/10.1115/IPACK2013-73039
InterPACK 2013; V002T08A005doi:https://doi.org/10.1115/IPACK2013-73042
InterPACK 2013; V002T08A006doi:https://doi.org/10.1115/IPACK2013-73043
InterPACK 2013; V002T08A007doi:https://doi.org/10.1115/IPACK2013-73050
InterPACK 2013; V002T08A008doi:https://doi.org/10.1115/IPACK2013-73051
InterPACK 2013; V002T08A009doi:https://doi.org/10.1115/IPACK2013-73052
InterPACK 2013; V002T08A010doi:https://doi.org/10.1115/IPACK2013-73056
InterPACK 2013; V002T08A011doi:https://doi.org/10.1115/IPACK2013-73057
InterPACK 2013; V002T08A012doi:https://doi.org/10.1115/IPACK2013-73058
InterPACK 2013; V002T08A013doi:https://doi.org/10.1115/IPACK2013-73063
InterPACK 2013; V002T08A014doi:https://doi.org/10.1115/IPACK2013-73064
InterPACK 2013; V002T08A015doi:https://doi.org/10.1115/IPACK2013-73072
InterPACK 2013; V002T08A016doi:https://doi.org/10.1115/IPACK2013-73073
InterPACK 2013; V002T08A017doi:https://doi.org/10.1115/IPACK2013-73086
InterPACK 2013; V002T08A018doi:https://doi.org/10.1115/IPACK2013-73087
InterPACK 2013; V002T08A019doi:https://doi.org/10.1115/IPACK2013-73088
InterPACK 2013; V002T08A020doi:https://doi.org/10.1115/IPACK2013-73089
InterPACK 2013; V002T08A021doi:https://doi.org/10.1115/IPACK2013-73090
InterPACK 2013; V002T08A022doi:https://doi.org/10.1115/IPACK2013-73093
InterPACK 2013; V002T08A023doi:https://doi.org/10.1115/IPACK2013-73104
InterPACK 2013; V002T08A024doi:https://doi.org/10.1115/IPACK2013-73106
InterPACK 2013; V002T08A025doi:https://doi.org/10.1115/IPACK2013-73107
InterPACK 2013; V002T08A026doi:https://doi.org/10.1115/IPACK2013-73108
InterPACK 2013; V002T08A027doi:https://doi.org/10.1115/IPACK2013-73120
InterPACK 2013; V002T08A028doi:https://doi.org/10.1115/IPACK2013-73122
InterPACK 2013; V002T08A029doi:https://doi.org/10.1115/IPACK2013-73129
InterPACK 2013; V002T08A030doi:https://doi.org/10.1115/IPACK2013-73139
InterPACK 2013; V002T08A031doi:https://doi.org/10.1115/IPACK2013-73141
InterPACK 2013; V002T08A032doi:https://doi.org/10.1115/IPACK2013-73153
InterPACK 2013; V002T08A033doi:https://doi.org/10.1115/IPACK2013-73162
InterPACK 2013; V002T08A034doi:https://doi.org/10.1115/IPACK2013-73167
InterPACK 2013; V002T08A035doi:https://doi.org/10.1115/IPACK2013-73179
InterPACK 2013; V002T08A036doi:https://doi.org/10.1115/IPACK2013-73184
InterPACK 2013; V002T08A037doi:https://doi.org/10.1115/IPACK2013-73185
InterPACK 2013; V002T08A038doi:https://doi.org/10.1115/IPACK2013-73186
InterPACK 2013; V002T08A039doi:https://doi.org/10.1115/IPACK2013-73187
InterPACK 2013; V002T08A040doi:https://doi.org/10.1115/IPACK2013-73189
InterPACK 2013; V002T08A041doi:https://doi.org/10.1115/IPACK2013-73194
InterPACK 2013; V002T08A042doi:https://doi.org/10.1115/IPACK2013-73199
InterPACK 2013; V002T08A043doi:https://doi.org/10.1115/IPACK2013-73202
InterPACK 2013; V002T08A044doi:https://doi.org/10.1115/IPACK2013-73204
InterPACK 2013; V002T08A045doi:https://doi.org/10.1115/IPACK2013-73207
InterPACK 2013; V002T08A046doi:https://doi.org/10.1115/IPACK2013-73237
InterPACK 2013; V002T08A047doi:https://doi.org/10.1115/IPACK2013-73262
InterPACK 2013; V002T08A048doi:https://doi.org/10.1115/IPACK2013-73265
InterPACK 2013; V002T08A049doi:https://doi.org/10.1115/IPACK2013-73273
InterPACK 2013; V002T08A050doi:https://doi.org/10.1115/IPACK2013-73277
InterPACK 2013; V002T08A051doi:https://doi.org/10.1115/IPACK2013-73283
InterPACK 2013; V002T08A052doi:https://doi.org/10.1115/IPACK2013-73286
InterPACK 2013; V002T08A053doi:https://doi.org/10.1115/IPACK2013-73294
InterPACK 2013; V002T08A054doi:https://doi.org/10.1115/IPACK2013-73302

Data Centers and Energy Efficient Electronic Systems

InterPACK 2013; V002T09A001doi:https://doi.org/10.1115/IPACK2013-73048
InterPACK 2013; V002T09A002doi:https://doi.org/10.1115/IPACK2013-73049
InterPACK 2013; V002T09A003doi:https://doi.org/10.1115/IPACK2013-73066
InterPACK 2013; V002T09A004doi:https://doi.org/10.1115/IPACK2013-73075
InterPACK 2013; V002T09A005doi:https://doi.org/10.1115/IPACK2013-73076
InterPACK 2013; V002T09A006doi:https://doi.org/10.1115/IPACK2013-73081
InterPACK 2013; V002T09A007doi:https://doi.org/10.1115/IPACK2013-73101
InterPACK 2013; V002T09A008doi:https://doi.org/10.1115/IPACK2013-73116
InterPACK 2013; V002T09A009doi:https://doi.org/10.1115/IPACK2013-73132
InterPACK 2013; V002T09A010doi:https://doi.org/10.1115/IPACK2013-73133
InterPACK 2013; V002T09A011doi:https://doi.org/10.1115/IPACK2013-73134
InterPACK 2013; V002T09A012doi:https://doi.org/10.1115/IPACK2013-73155
InterPACK 2013; V002T09A013doi:https://doi.org/10.1115/IPACK2013-73163
InterPACK 2013; V002T09A014doi:https://doi.org/10.1115/IPACK2013-73183
InterPACK 2013; V002T09A015doi:https://doi.org/10.1115/IPACK2013-73196
InterPACK 2013; V002T09A016doi:https://doi.org/10.1115/IPACK2013-73201
InterPACK 2013; V002T09A017doi:https://doi.org/10.1115/IPACK2013-73208
InterPACK 2013; V002T09A018doi:https://doi.org/10.1115/IPACK2013-73214
InterPACK 2013; V002T09A019doi:https://doi.org/10.1115/IPACK2013-73216
InterPACK 2013; V002T09A020doi:https://doi.org/10.1115/IPACK2013-73217
InterPACK 2013; V002T09A021doi:https://doi.org/10.1115/IPACK2013-73219
InterPACK 2013; V002T09A022doi:https://doi.org/10.1115/IPACK2013-73268
InterPACK 2013; V002T09A023doi:https://doi.org/10.1115/IPACK2013-73281
InterPACK 2013; V002T09A024doi:https://doi.org/10.1115/IPACK2013-73282
InterPACK 2013; V002T09A025doi:https://doi.org/10.1115/IPACK2013-73298
InterPACK 2013; V002T09A026doi:https://doi.org/10.1115/IPACK2013-73325
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