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Proceedings Papers

Advances in Electronic Packaging, Parts A, B, and C

Thermal Management of Electronic and Photonic Systems

InterPACK 2005; 11-18doi:https://doi.org/10.1115/IPACK2005-73011
InterPACK 2005; 19-25doi:https://doi.org/10.1115/IPACK2005-73013
InterPACK 2005; 27-32doi:https://doi.org/10.1115/IPACK2005-73023
InterPACK 2005; 33-41doi:https://doi.org/10.1115/IPACK2005-73027
InterPACK 2005; 43-50doi:https://doi.org/10.1115/IPACK2005-73040
InterPACK 2005; 51-58doi:https://doi.org/10.1115/IPACK2005-73041
InterPACK 2005; 59-64doi:https://doi.org/10.1115/IPACK2005-73052
InterPACK 2005; 65-69doi:https://doi.org/10.1115/IPACK2005-73055
InterPACK 2005; 71-78doi:https://doi.org/10.1115/IPACK2005-73071
InterPACK 2005; 79-89doi:https://doi.org/10.1115/IPACK2005-73073
InterPACK 2005; 91-98doi:https://doi.org/10.1115/IPACK2005-73084
InterPACK 2005; 99-103doi:https://doi.org/10.1115/IPACK2005-73087
InterPACK 2005; 105-112doi:https://doi.org/10.1115/IPACK2005-73090
InterPACK 2005; 113-118doi:https://doi.org/10.1115/IPACK2005-73100
InterPACK 2005; 119-127doi:https://doi.org/10.1115/IPACK2005-73101
InterPACK 2005; 129-135doi:https://doi.org/10.1115/IPACK2005-73106
InterPACK 2005; 137-142doi:https://doi.org/10.1115/IPACK2005-73113
InterPACK 2005; 143-150doi:https://doi.org/10.1115/IPACK2005-73118
InterPACK 2005; 151-160doi:https://doi.org/10.1115/IPACK2005-73119
InterPACK 2005; 161-168doi:https://doi.org/10.1115/IPACK2005-73120
InterPACK 2005; 169-176doi:https://doi.org/10.1115/IPACK2005-73121
InterPACK 2005; 177-182doi:https://doi.org/10.1115/IPACK2005-73124
InterPACK 2005; 183-188doi:https://doi.org/10.1115/IPACK2005-73126
InterPACK 2005; 189-195doi:https://doi.org/10.1115/IPACK2005-73128
InterPACK 2005; 197-203doi:https://doi.org/10.1115/IPACK2005-73131
InterPACK 2005; 205-213doi:https://doi.org/10.1115/IPACK2005-73137
InterPACK 2005; 215-224doi:https://doi.org/10.1115/IPACK2005-73138
InterPACK 2005; 225-231doi:https://doi.org/10.1115/IPACK2005-73157
InterPACK 2005; 233-238doi:https://doi.org/10.1115/IPACK2005-73170
InterPACK 2005; 239-243doi:https://doi.org/10.1115/IPACK2005-73180
InterPACK 2005; 245-252doi:https://doi.org/10.1115/IPACK2005-73181
InterPACK 2005; 253-258doi:https://doi.org/10.1115/IPACK2005-73185
InterPACK 2005; 259-266doi:https://doi.org/10.1115/IPACK2005-73189
InterPACK 2005; 267-275doi:https://doi.org/10.1115/IPACK2005-73191
InterPACK 2005; 277-285doi:https://doi.org/10.1115/IPACK2005-73211
InterPACK 2005; 287-290doi:https://doi.org/10.1115/IPACK2005-73219
InterPACK 2005; 291-298doi:https://doi.org/10.1115/IPACK2005-73222
InterPACK 2005; 299-304doi:https://doi.org/10.1115/IPACK2005-73224
InterPACK 2005; 305-314doi:https://doi.org/10.1115/IPACK2005-73226
InterPACK 2005; 315-327doi:https://doi.org/10.1115/IPACK2005-73228
InterPACK 2005; 329-336doi:https://doi.org/10.1115/IPACK2005-73234
InterPACK 2005; 337-344doi:https://doi.org/10.1115/IPACK2005-73235
InterPACK 2005; 345-351doi:https://doi.org/10.1115/IPACK2005-73241
InterPACK 2005; 353-364doi:https://doi.org/10.1115/IPACK2005-73242
InterPACK 2005; 365-372doi:https://doi.org/10.1115/IPACK2005-73262
InterPACK 2005; 373-378doi:https://doi.org/10.1115/IPACK2005-73264
InterPACK 2005; 379-383doi:https://doi.org/10.1115/IPACK2005-73265
InterPACK 2005; 385-391doi:https://doi.org/10.1115/IPACK2005-73268
InterPACK 2005; 393-400doi:https://doi.org/10.1115/IPACK2005-73272
InterPACK 2005; 401-408doi:https://doi.org/10.1115/IPACK2005-73273
InterPACK 2005; 409-414doi:https://doi.org/10.1115/IPACK2005-73278
InterPACK 2005; 415-424doi:https://doi.org/10.1115/IPACK2005-73283
InterPACK 2005; 425-430doi:https://doi.org/10.1115/IPACK2005-73284
InterPACK 2005; 431-437doi:https://doi.org/10.1115/IPACK2005-73286
InterPACK 2005; 439-443doi:https://doi.org/10.1115/IPACK2005-73288
InterPACK 2005; 445-450doi:https://doi.org/10.1115/IPACK2005-73293
Topics: Cooling
InterPACK 2005; 451-459doi:https://doi.org/10.1115/IPACK2005-73303
InterPACK 2005; 461-467doi:https://doi.org/10.1115/IPACK2005-73310
InterPACK 2005; 469-475doi:https://doi.org/10.1115/IPACK2005-73313
InterPACK 2005; 477-482doi:https://doi.org/10.1115/IPACK2005-73334
InterPACK 2005; 483-486doi:https://doi.org/10.1115/IPACK2005-73336
InterPACK 2005; 487-491doi:https://doi.org/10.1115/IPACK2005-73365
InterPACK 2005; 493-501doi:https://doi.org/10.1115/IPACK2005-73375
InterPACK 2005; 503-509doi:https://doi.org/10.1115/IPACK2005-73380
InterPACK 2005; 511-516doi:https://doi.org/10.1115/IPACK2005-73384
InterPACK 2005; 517-525doi:https://doi.org/10.1115/IPACK2005-73385
InterPACK 2005; 527-533doi:https://doi.org/10.1115/IPACK2005-73386
InterPACK 2005; 535-543doi:https://doi.org/10.1115/IPACK2005-73387
InterPACK 2005; 545-552doi:https://doi.org/10.1115/IPACK2005-73392
InterPACK 2005; 553-556doi:https://doi.org/10.1115/IPACK2005-73393
InterPACK 2005; 557-567doi:https://doi.org/10.1115/IPACK2005-73394
InterPACK 2005; 569-576doi:https://doi.org/10.1115/IPACK2005-73405
InterPACK 2005; 577-589doi:https://doi.org/10.1115/IPACK2005-73407
InterPACK 2005; 591-603doi:https://doi.org/10.1115/IPACK2005-73409
InterPACK 2005; 605-610doi:https://doi.org/10.1115/IPACK2005-73416
InterPACK 2005; 611-616doi:https://doi.org/10.1115/IPACK2005-73422
InterPACK 2005; 617-625doi:https://doi.org/10.1115/IPACK2005-73423
InterPACK 2005; 627-634doi:https://doi.org/10.1115/IPACK2005-73438
InterPACK 2005; 635-640doi:https://doi.org/10.1115/IPACK2005-73445
InterPACK 2005; 641-645doi:https://doi.org/10.1115/IPACK2005-73446
InterPACK 2005; 647-654doi:https://doi.org/10.1115/IPACK2005-73452
InterPACK 2005; 655-662doi:https://doi.org/10.1115/IPACK2005-73457
InterPACK 2005; 663-673doi:https://doi.org/10.1115/IPACK2005-73468
InterPACK 2005; 675-682doi:https://doi.org/10.1115/IPACK2005-73486
InterPACK 2005; 683-695doi:https://doi.org/10.1115/IPACK2005-73496
InterPACK 2005; 697-702doi:https://doi.org/10.1115/IPACK2005-73498

Thermal Management of Micro/Nanosystems

InterPACK 2005; 703-708doi:https://doi.org/10.1115/IPACK2005-73018
InterPACK 2005; 709-716doi:https://doi.org/10.1115/IPACK2005-73078
InterPACK 2005; 717-725doi:https://doi.org/10.1115/IPACK2005-73086
InterPACK 2005; 727-731doi:https://doi.org/10.1115/IPACK2005-73214
InterPACK 2005; 733-740doi:https://doi.org/10.1115/IPACK2005-73280
InterPACK 2005; 741-745doi:https://doi.org/10.1115/IPACK2005-73444

Optical MEMS

InterPACK 2005; 747-750doi:https://doi.org/10.1115/IPACK2005-73130
InterPACK 2005; 751-755doi:https://doi.org/10.1115/IPACK2005-73252
InterPACK 2005; 757-760doi:https://doi.org/10.1115/IPACK2005-73298
InterPACK 2005; 761-766doi:https://doi.org/10.1115/IPACK2005-73322
InterPACK 2005; 767-772doi:https://doi.org/10.1115/IPACK2005-73335
InterPACK 2005; 773-781doi:https://doi.org/10.1115/IPACK2005-73376
InterPACK 2005; 783-787doi:https://doi.org/10.1115/IPACK2005-73430
InterPACK 2005; 789-792doi:https://doi.org/10.1115/IPACK2005-73431
InterPACK 2005; 793-796doi:https://doi.org/10.1115/IPACK2005-73436
InterPACK 2005; 797-802doi:https://doi.org/10.1115/IPACK2005-73441

Airborne, Space and Defence Electronic Packaging

InterPACK 2005; 803-817doi:https://doi.org/10.1115/IPACK2005-73015
InterPACK 2005; 819-826doi:https://doi.org/10.1115/IPACK2005-73025
InterPACK 2005; 827-833doi:https://doi.org/10.1115/IPACK2005-73026
InterPACK 2005; 835-844doi:https://doi.org/10.1115/IPACK2005-73036

Packaging of Electronic and Photonic Systems

InterPACK 2005; 845-848doi:https://doi.org/10.1115/IPACK2005-73014
InterPACK 2005; 849-856doi:https://doi.org/10.1115/IPACK2005-73020
InterPACK 2005; 857-865doi:https://doi.org/10.1115/IPACK2005-73045
InterPACK 2005; 867-872doi:https://doi.org/10.1115/IPACK2005-73062
InterPACK 2005; 873-877doi:https://doi.org/10.1115/IPACK2005-73079
InterPACK 2005; 879-885doi:https://doi.org/10.1115/IPACK2005-73161
InterPACK 2005; 887-892doi:https://doi.org/10.1115/IPACK2005-73164
InterPACK 2005; 893-898doi:https://doi.org/10.1115/IPACK2005-73167
InterPACK 2005; 899-906doi:https://doi.org/10.1115/IPACK2005-73209
InterPACK 2005; 907-920doi:https://doi.org/10.1115/IPACK2005-73249
InterPACK 2005; 921-925doi:https://doi.org/10.1115/IPACK2005-73253
InterPACK 2005; 927-938doi:https://doi.org/10.1115/IPACK2005-73257
InterPACK 2005; 939-945doi:https://doi.org/10.1115/IPACK2005-73296
InterPACK 2005; 947-953doi:https://doi.org/10.1115/IPACK2005-73299
InterPACK 2005; 955-958doi:https://doi.org/10.1115/IPACK2005-73301
InterPACK 2005; 959-963doi:https://doi.org/10.1115/IPACK2005-73304
InterPACK 2005; 965-969doi:https://doi.org/10.1115/IPACK2005-73306
InterPACK 2005; 971-975doi:https://doi.org/10.1115/IPACK2005-73320
InterPACK 2005; 977-981doi:https://doi.org/10.1115/IPACK2005-73321
InterPACK 2005; 983-991doi:https://doi.org/10.1115/IPACK2005-73328
InterPACK 2005; 993-998doi:https://doi.org/10.1115/IPACK2005-73329
InterPACK 2005; 999-1004doi:https://doi.org/10.1115/IPACK2005-73339
InterPACK 2005; 1005-1011doi:https://doi.org/10.1115/IPACK2005-73360
InterPACK 2005; 1013-1019doi:https://doi.org/10.1115/IPACK2005-73362
InterPACK 2005; 1021-1029doi:https://doi.org/10.1115/IPACK2005-73364
InterPACK 2005; 1031-1036doi:https://doi.org/10.1115/IPACK2005-73371
InterPACK 2005; 1037-1044doi:https://doi.org/10.1115/IPACK2005-73373
InterPACK 2005; 1045-1051doi:https://doi.org/10.1115/IPACK2005-73391
InterPACK 2005; 1053-1062doi:https://doi.org/10.1115/IPACK2005-73484

Packaging for Micro/Nanosystems

InterPACK 2005; 1063-1068doi:https://doi.org/10.1115/IPACK2005-73200
InterPACK 2005; 1069-1074doi:https://doi.org/10.1115/IPACK2005-73369

Reliability of Electronic and Photonic Systems

InterPACK 2005; 1075-1081doi:https://doi.org/10.1115/IPACK2005-73004
InterPACK 2005; 1083-1088doi:https://doi.org/10.1115/IPACK2005-73005
InterPACK 2005; 1089-1094doi:https://doi.org/10.1115/IPACK2005-73047
InterPACK 2005; 1095-1100doi:https://doi.org/10.1115/IPACK2005-73058
InterPACK 2005; 1101-1108doi:https://doi.org/10.1115/IPACK2005-73059
InterPACK 2005; 1109-1113doi:https://doi.org/10.1115/IPACK2005-73063
InterPACK 2005; 1115-1121doi:https://doi.org/10.1115/IPACK2005-73083
InterPACK 2005; 1123-1127doi:https://doi.org/10.1115/IPACK2005-73097
InterPACK 2005; 1129-1134doi:https://doi.org/10.1115/IPACK2005-73110
InterPACK 2005; 1135-1140doi:https://doi.org/10.1115/IPACK2005-73112
InterPACK 2005; 1141-1145doi:https://doi.org/10.1115/IPACK2005-73122
InterPACK 2005; 1147-1152doi:https://doi.org/10.1115/IPACK2005-73133
InterPACK 2005; 1153-1158doi:https://doi.org/10.1115/IPACK2005-73139
InterPACK 2005; 1159-1166doi:https://doi.org/10.1115/IPACK2005-73146
InterPACK 2005; 1167-1175doi:https://doi.org/10.1115/IPACK2005-73153
InterPACK 2005; 1177-1180doi:https://doi.org/10.1115/IPACK2005-73156
InterPACK 2005; 1181-1186doi:https://doi.org/10.1115/IPACK2005-73162
InterPACK 2005; 1187-1192doi:https://doi.org/10.1115/IPACK2005-73184
InterPACK 2005; 1193-1198doi:https://doi.org/10.1115/IPACK2005-73223
InterPACK 2005; 1199-1205doi:https://doi.org/10.1115/IPACK2005-73233
InterPACK 2005; 1207-1213doi:https://doi.org/10.1115/IPACK2005-73238
InterPACK 2005; 1215-1221doi:https://doi.org/10.1115/IPACK2005-73297
InterPACK 2005; 1223-1228doi:https://doi.org/10.1115/IPACK2005-73318
InterPACK 2005; 1229-1235doi:https://doi.org/10.1115/IPACK2005-73331
InterPACK 2005; 1237-1252doi:https://doi.org/10.1115/IPACK2005-73348
InterPACK 2005; 1253-1262doi:https://doi.org/10.1115/IPACK2005-73349
InterPACK 2005; 1263-1270doi:https://doi.org/10.1115/IPACK2005-73352
InterPACK 2005; 1271-1276doi:https://doi.org/10.1115/IPACK2005-73353
InterPACK 2005; 1277-1282doi:https://doi.org/10.1115/IPACK2005-73356
InterPACK 2005; 1283-1291doi:https://doi.org/10.1115/IPACK2005-73366
InterPACK 2005; 1293-1298doi:https://doi.org/10.1115/IPACK2005-73367
InterPACK 2005; 1299-1306doi:https://doi.org/10.1115/IPACK2005-73408
InterPACK 2005; 1307-1311doi:https://doi.org/10.1115/IPACK2005-73411
InterPACK 2005; 1313-1321doi:https://doi.org/10.1115/IPACK2005-73417
InterPACK 2005; 1323-1330doi:https://doi.org/10.1115/IPACK2005-73450
InterPACK 2005; 1331-1339doi:https://doi.org/10.1115/IPACK2005-73475
InterPACK 2005; 1341-1346doi:https://doi.org/10.1115/IPACK2005-73493

Photonics

InterPACK 2005; 1347-1350doi:https://doi.org/10.1115/IPACK2005-73135

Modeling and Characterization of Electronic and Photonic Systems

InterPACK 2005; 1351-1358doi:https://doi.org/10.1115/IPACK2005-73007
InterPACK 2005; 1359-1364doi:https://doi.org/10.1115/IPACK2005-73008
InterPACK 2005; 1365-1370doi:https://doi.org/10.1115/IPACK2005-73021
InterPACK 2005; 1371-1374doi:https://doi.org/10.1115/IPACK2005-73035
InterPACK 2005; 1375-1377doi:https://doi.org/10.1115/IPACK2005-73039
InterPACK 2005; 1379-1387doi:https://doi.org/10.1115/IPACK2005-73051
InterPACK 2005; 1389-1395doi:https://doi.org/10.1115/IPACK2005-73053
InterPACK 2005; 1397-1404doi:https://doi.org/10.1115/IPACK2005-73085
InterPACK 2005; 1405-1412doi:https://doi.org/10.1115/IPACK2005-73096
InterPACK 2005; 1413-1420doi:https://doi.org/10.1115/IPACK2005-73196
InterPACK 2005; 1421-1426doi:https://doi.org/10.1115/IPACK2005-73202
InterPACK 2005; 1427-1432doi:https://doi.org/10.1115/IPACK2005-73212
InterPACK 2005; 1433-1440doi:https://doi.org/10.1115/IPACK2005-73213
InterPACK 2005; 1441-1447doi:https://doi.org/10.1115/IPACK2005-73215
InterPACK 2005; 1449-1454doi:https://doi.org/10.1115/IPACK2005-73216
InterPACK 2005; 1455-1458doi:https://doi.org/10.1115/IPACK2005-73237
InterPACK 2005; 1459-1470doi:https://doi.org/10.1115/IPACK2005-73239
InterPACK 2005; 1471-1478doi:https://doi.org/10.1115/IPACK2005-73258
InterPACK 2005; 1479-1486doi:https://doi.org/10.1115/IPACK2005-73259
InterPACK 2005; 1487-1492doi:https://doi.org/10.1115/IPACK2005-73274
InterPACK 2005; 1493-1497doi:https://doi.org/10.1115/IPACK2005-73277
InterPACK 2005; 1499-1503doi:https://doi.org/10.1115/IPACK2005-73291
InterPACK 2005; 1505-1508doi:https://doi.org/10.1115/IPACK2005-73307
InterPACK 2005; 1509-1521doi:https://doi.org/10.1115/IPACK2005-73370
InterPACK 2005; 1523-1528doi:https://doi.org/10.1115/IPACK2005-73401
InterPACK 2005; 1529-1534doi:https://doi.org/10.1115/IPACK2005-73418
InterPACK 2005; 1535-1543doi:https://doi.org/10.1115/IPACK2005-73426
InterPACK 2005; 1545-1556doi:https://doi.org/10.1115/IPACK2005-73427
InterPACK 2005; 1557-1563doi:https://doi.org/10.1115/IPACK2005-73428
InterPACK 2005; 1565-1573doi:https://doi.org/10.1115/IPACK2005-73429
InterPACK 2005; 1575-1581doi:https://doi.org/10.1115/IPACK2005-73437

Manufacturing and Test of Electronic and Photonic Systems

InterPACK 2005; 1583-1586doi:https://doi.org/10.1115/IPACK2005-73046
InterPACK 2005; 1587-1592doi:https://doi.org/10.1115/IPACK2005-73109
InterPACK 2005; 1593-1599doi:https://doi.org/10.1115/IPACK2005-73302