Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Topics: Fillers (Materials) , Thermal resistance , Computation , Cooling , Heat sinks , Integrated circuits , Mechanical structures , Metalwork , Springs

Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Suzana Prstic, Dongming He

InterPACK 2005; 99-103https://doi.org/10.1115/IPACK2005-73087

Abstract

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Topics: Heat exchangers , Microchannels , Heating , Boiling , Cooling , Heat , Heat transfer , Temperature sensors , Wall temperature

A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication

Tien-Yu Tom Lee, Victor A. Chiriac, Roger Stout

InterPACK 2005; 105-112https://doi.org/10.1115/IPACK2005-73090

Abstract

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Topics: Telecommunications , Transients (Dynamics) , Cycles , Steady state , Temperature , Waves , Junctions , Capacitors , Computation , Computer software

System Level Thermal Evaluation and Optimization of an Automotive Module Incorporating Several Power Packages

Victor Chiriac, Tom Lee, Kim Gauen

InterPACK 2005; 113-118https://doi.org/10.1115/IPACK2005-73100

Abstract

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Topics: Automotive industry , Computational fluid dynamics , Computer simulation , Design , Energy dissipation , Heat , Heat budget (Physics) , Heat conduction , Heat transfer coefficients , Heating

System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

Victor Chiriac, Tom Lee, Arvind Krishna, Venkata Krishnan, Rodney Lawrence

InterPACK 2005; 119-127https://doi.org/10.1115/IPACK2005-73101

Abstract

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Topics: Automotive industry , Boundary-value problems , Computer cooling , Design , Electrical conductivity , Modeling , Simulation , Steady state , Temperature , Thermal analysis

Empirical Optimization of High Density Plate-Fin Heat Sink for Constant Pumping Power in Low Profile Cooling Application

Kazuaki Yazawa, Tatsuro Yoshida, Shinji Nakagawa, Masaru Ishizuka

InterPACK 2005; 129-135https://doi.org/10.1115/IPACK2005-73106

Abstract

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Topics: Cooling , Density , Heat sinks , Optimization , Fins , Computer simulation , Computers , Fans , Flow (Dynamics) , Fluids

Transient Performance of a Finned PCM Heat Sink

V. Shatikian, G. Ziskind, R. Letan

InterPACK 2005; 137-142https://doi.org/10.1115/IPACK2005-73113

Abstract

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Topics: Heat sinks , Transients (Dynamics) , Temperature , Melting , Fins , Phase change materials , Aluminum , Computer simulation , Density , Heat

Thermal Optimal Design for Partially-Confined Compact Heat Sinks

M. P. Wang, H. T. Chen, J. T. Horng, T. Y. Wu, P. L. Chen, Y. H. Hung

InterPACK 2005; 143-150https://doi.org/10.1115/IPACK2005-73118

Abstract

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Topics: Design , Heat sinks , Pressure drop , Thermal resistance , Flow (Dynamics) , Composite materials , Experimental design , Forced convection , Heat flux , Optimization

Computational Method for Characterization of a Microchannel Heat Sink Involving Two-Phase Flow

Kanchan M. Kelkar, Suhas V. Patankar, Sukhvinder Kang

InterPACK 2005; 151-160https://doi.org/10.1115/IPACK2005-73119

Abstract

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Topics: Computational methods , Heat sinks , Microchannels , Two-phase flow , Flow (Dynamics) , Heat transfer , Heat , Coolants , Cooling , Electronic equipment

Convective Heat Transfer From Confined Heated Surfaces With Slot Jet Impingement

L. K. Liu, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung

InterPACK 2005; 161-168https://doi.org/10.1115/IPACK2005-73120

Abstract

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Topics: Convection , Transients (Dynamics) , Steady state , Heat transfer , Buoyancy , Composite materials , Heat flux , Mixed convection

Forced Convective Heat Transfer for Partially-Confined Compact PPF Heat Sinks With Top-Bypass Effect

T. Y. Wu, M. P. Wang, J. T. Horng, S. F. Chang, Y. H. Hung

InterPACK 2005; 169-176https://doi.org/10.1115/IPACK2005-73121

Abstract

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Topics: Convection , Forced convection , Heat sinks

Ceramic Flat Plate Evaporator for Loop Heat Pipe Cooling of Electronics

Walter Zimbeck, Jared Chaney, Patricio Espinoza, Edward Kroliczek, David C. Bugby, James Yun

InterPACK 2005; 177-182https://doi.org/10.1115/IPACK2005-73124

Abstract

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Topics: Ceramics , Cooling , Electronics , Flat plates , Heat pipes

Convective Performance of Package Based Single Phase Microchannel Heat Exchanger

Je-Young Chang, Ravi Prasher, David Chau, Alan Myers, John Dirner, Suzana Prstic, Dongming He

InterPACK 2005; 183-188https://doi.org/10.1115/IPACK2005-73126

Abstract

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Topics: Heat exchangers , Microchannels , Heating , Temperature sensors , Cooling , Fluids , Heat flux , Heat transfer , Integrated circuits , Junctions

High Dense Plate Fin Heat Sinks Characterization and Validation

Guoping Xu, Chakravarthy Akella, Lee Follmer

InterPACK 2005; 189-195https://doi.org/10.1115/IPACK2005-73128

Abstract

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Topics: Computer cooling , Heat sinks , Heat transfer

Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions

Je-Young Chang, Unnikrishnan Vadakkan, Ravi Prasher, Suzana Prstic

InterPACK 2005; 197-203https://doi.org/10.1115/IPACK2005-73131

Abstract

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Topics: Heating , Vapors , Copper , Boundary-value problems , Cooling , Heat , Heat conduction , Heat flux , Heat pipes , Heat transfer

Exergy-Based Optimization Strategies for Multi-Component Data Center Thermal Management: Part I — Analysis

Amip J. Shah, Van P. Carey, Cullen E. Bash, Chandrakant D. Patel

InterPACK 2005; 205-213https://doi.org/10.1115/IPACK2005-73137

Abstract

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Topics: Data centers , Exergy , Optimization , Thermal management

Exergy-Based Optimization Strategies for Multi-Component Data Center Thermal Management: Part II — Application and Validation

Amip J. Shah, Van P. Carey, Cullen E. Bash, Chandrakant D. Patel

InterPACK 2005; 215-224https://doi.org/10.1115/IPACK2005-73138

Abstract

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Topics: Data centers , Exergy , Optimization , Thermal management

Circuit-Thermal Collaboration Design Method for Outline Design Stage of Mobile Terminal

Yoshiharu Iwata, Shintaro Hayashi, Ryohei Satoh, Kozo Fujimoto

InterPACK 2005; 225-231https://doi.org/10.1115/IPACK2005-73157

Abstract

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Topics: Circuits , Collaboration , Design , Design methodology

A Vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics

Minhua Lu, Larry Mok, R. J. Bezama

InterPACK 2005; 233-238https://doi.org/10.1115/IPACK2005-73170

Abstract

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Topics: Cooling , Electronics , Foams (Chemistry) , Graphite , Heat flux , Vapors , Fluids , Water , Ethanol , Thermal conductivity

Effect of Next Generation Computer Graphic Card Blower Fan Speed on Thermal Performance and Acoustic Noise With Psychoacoustic Metrics

Helen Ule, Colin Novak, Robert Gaspar, Arunima Panigrahy, Gamal Refai-Ahmed

InterPACK 2005; 239-243https://doi.org/10.1115/IPACK2005-73180

Abstract

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Topics: Acoustics , Computers , Noise (Sound) , Fans , Cooling , Flow (Dynamics) , Graphics processing units , Air flow , Axial flow , Design

Orthotropic Thermal Conductivity Effect on Cylindrical Pin Fin Heat Transfer

Raj Bahadur, Avram Bar-Cohen

InterPACK 2005; 245-252https://doi.org/10.1115/IPACK2005-73181

Abstract

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Topics: Heat sinks , Heat transfer , Optimization , Polymer composites , Thermal conductivity

Mathematical Optimization of Electronic Enclosures

D. J. De Kock, M. Nagulapally, J. A. Visser, R. Nair, J. Nigen

InterPACK 2005; 253-258https://doi.org/10.1115/IPACK2005-73185

Abstract

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Topics: Optimization , Design , Computational fluid dynamics , Flow (Dynamics) , Lumber , Temperature , Filters , Design methodology , Electronic components , Fans

Indirect Spray Evaporative Thermal Management for Semiconductor Burn-In

Michael A. Benjamin, Andrew M. Odar, Erlendur Steinthorsson, Charles B. Cotten

InterPACK 2005; 259-266https://doi.org/10.1115/IPACK2005-73189

Abstract

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Topics: Cooling , Semiconductors (Materials) , Sprays , Thermal management

Porosity, Specific Surface Area and Effective Thermal Conductivity of Anisotropic Open Cell Lattice Structures

Kiran Balantrapu, Deepti Rao Sarde, Christopher M. Herald, Richard A. Wirtz

InterPACK 2005; 267-275https://doi.org/10.1115/IPACK2005-73191

Abstract

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Topics: Anisotropy , Porosity , Thermal conductivity

Impingement Air Cooling With Synthetic Jets Over Small and Large Heated Surfaces

Jivtesh Garg, Mehmet Arik, Stanton Weaver

InterPACK 2005; 277-285https://doi.org/10.1115/IPACK2005-73211

Abstract

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Topics: Cooling , Jets , Heat transfer , Natural convection , Electronics , Energy consumption , Heat , Heat transfer coefficients , Imaging , Resonance

Future of Thermal Management of High End Video Cards in ATX and BTX

Gamal Refai-Ahmed, Mohammed Tantoush, Colin Novak

InterPACK 2005; 287-290https://doi.org/10.1115/IPACK2005-73219

Abstract

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Topics: Thermal management , Graphics processing units , Cooling , Power density , Roads , Thermomechanics

Experimental Thermal Characterization of Pin Fin Heat Sinks With Top and Side Bypass

Ning Lei, Alfonso Ortega

InterPACK 2005; 291-298https://doi.org/10.1115/IPACK2005-73222

Abstract

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Topics: Heat sinks , Thermal characterization , Clearances (Engineering) , Flow (Dynamics) , Thermal resistance , Heat transfer coefficients , Aluminum , Heat flux , Pins (Engineering) , Temperature

The Effect of Die Attach Voiding on the Thermal Resistance of Chip Level Packages

Amy S. Fleischer, Barry C. Johnson, Li-Hsin Chang

InterPACK 2005; 299-304https://doi.org/10.1115/IPACK2005-73224

Abstract

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Topics: Thermal resistance , Geometry , Integrated circuit fabrication

Thermal Analyses of Composite Copper/ Porous Graphite Spreaders for Immersion Cooling Applications

Mohamed S. El-Genk, Hamed H. Saber, Jack Parker

InterPACK 2005; 305-314https://doi.org/10.1115/IPACK2005-73226

Abstract

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Topics: Composite materials , Cooling , Copper , Graphite , Thermal analysis , Energy dissipation , Nucleate boiling , Temperature , Thermal energy , Anisotropy

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

Felipe E. Ortega Gutierrez, Alfonso Ortega, Guoping Xu

InterPACK 2005; 315-327https://doi.org/10.1115/IPACK2005-73228

Abstract

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Topics: Flow (Dynamics) , Heat sinks , Heat transfer , Heat , Temperature measurement , Boundary-value problems , Clearances (Engineering) , Copper , Cross-flow , Finishes

Comparative Analysis of Different Data Center Airflow Management Configurations

Saurabh Shrivastava, Bahgat Sammakia, Roger Schmidt, Madhusudan Iyengar

InterPACK 2005; 329-336https://doi.org/10.1115/IPACK2005-73234

Abstract

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Topics: Air flow , Data centers , Thermal management

Transient Mixed-Convection With Applications to Cooling of Biomaterials

Saurabh Shrivastava, Bahgat Sammakia

InterPACK 2005; 337-344https://doi.org/10.1115/IPACK2005-73235

Abstract

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Topics: Biomaterials , Cavities , Cooling , Mixed convection , Transients (Dynamics)

Heat Transfer Enhancement in the Heat Sinks for Electronic Cooling Applications

Evan Small, Sadegh M. Sadeghipour, Mehdi Asheghi

InterPACK 2005; 345-351https://doi.org/10.1115/IPACK2005-73241

Abstract

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Topics: Computer cooling , Heat sinks , Heat transfer , Fins , Design , Engineering simulation , Pressure drop , Simulation , Mechanical engineering , Students

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Prasher, Je-Young Chang, Hakan Erturk, Gregory Chrysler, Chia-Pin Chiu, Ravi Mahajan

InterPACK 2005; 353-364https://doi.org/10.1115/IPACK2005-73242

Abstract

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Topics: Blocks (Building materials) , Boundary-value problems , Computer cooling , Cooling , Density , Design , Electrical conductivity , Heat pipes , Heat transfer , Industrial research

Advanced Technology for Server Cooling

Ralph L. Webb, Hasan Nasir

InterPACK 2005; 365-372https://doi.org/10.1115/IPACK2005-73262

Abstract

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Topics: Cooling , Heat exchangers , Microchannels

Use of Psychoacoustic Metrics for the Analysis of Next Generation Computer Graphic Card Noise

Colin Novak, Helen Ule, Robert Gaspar, Gamal Refai-Ahmed

InterPACK 2005; 373-378https://doi.org/10.1115/IPACK2005-73264

Abstract

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Topics: Computers , Noise (Sound) , Cooling , Graphics processing units , Sound quality , Energy dissipation , Acoustics , Fans , Heat , Heat flux

Bond Line Thickness of Thermal Interface Materials With Carbon Nanotubes

Senthil A. G. Singaravelu, Xuejiao Hu, Kenneth E. Goodson

InterPACK 2005; 379-383https://doi.org/10.1115/IPACK2005-73265

Abstract

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Topics: Carbon nanotubes , Thermal conductivity , Energy dissipation , Pressure , Rheology , Thermal resistance , Transients (Dynamics)

A Novel Scheme in Thermal Modeling of Printed Circuit Boards

Wenjun Liu, Min-Young Lee, Younes Shabany, Mehdi Asheghi

InterPACK 2005; 385-391https://doi.org/10.1115/IPACK2005-73268

Abstract

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Topics: Modeling , Printed circuit boards , Thermal resistance

Experimental Study on the Double-Sided Air Cooling for Integrated Power Electronics Modules

Ying Feng Pang, Elaine P. Scott, Zhenxian Liang, J. D. van Wyk

InterPACK 2005; 393-400https://doi.org/10.1115/IPACK2005-73272

Abstract

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Topics: Cooling , Electronics , Heat , Heat sinks , Thermal management , Thermal resistance , Flat heat pipes , Flow (Dynamics) , Junctions , Packaging

Distributed Leakage Flow in Raised-Floor Data Centers

Amir Radmehr, Roger R. Schmidt, Kailash C. Karki, Suhas V. Patankar

InterPACK 2005; 401-408https://doi.org/10.1115/IPACK2005-73273

Abstract

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Topics: Air flow , Data centers , Leakage flows

Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices

Randeep Singh, Aliakbar Akbarzadeh, Mastaka Mochizuki, Yuji Saito, Thang Nguyen, Bob Kao, Tanaphan Sataphan, Eiji Takenaka, Vijit Wuttijumnong

InterPACK 2005; 409-414https://doi.org/10.1115/IPACK2005-73278

Abstract

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Topics: Composite materials , Cooling , Fibers , Heat pipes

The Maisotsenko Cycle for Electronics Cooling

Valeriy Maisotsenko, Ilya Reyzin

InterPACK 2005; 415-424https://doi.org/10.1115/IPACK2005-73283

Abstract

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Topics: Computer cooling , Cycles , Electronics , Evaporative cooling

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac

InterPACK 2005; 425-430https://doi.org/10.1115/IPACK2005-73284

Abstract

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Topics: Compression , Cooling , Microchannels , Microelectronic devices , Refrigeration , Vapors

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

Masataka Mochizuki, Yuji Saito, Thang Nguyen, Vijit Wuttijumnong, Xiaoping Wu, Tien Nguyen

InterPACK 2005; 431-437https://doi.org/10.1115/IPACK2005-73286

Abstract

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Topics: Cooling , Heat pipes , Heat sinks , Laptop computers , Vapors , Energy dissipation , Heat , Clocks , Design , Heat flux

Piezoelectric Actuators for Low-Form-Factor Electronics Cooling

Tolga Ac¸ıkalın, Ioan Sauciuc, Suresh V. Garimella

InterPACK 2005; 439-443https://doi.org/10.1115/IPACK2005-73288

Abstract

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Topics: Computer cooling , Fans , Heat sinks , Piezoelectric actuators

Assessing Capabilities and Limitations of Air- and Liquid-Cooling for Low Profile Servers

Albert Chan, Jie Wei

InterPACK 2005; 445-450https://doi.org/10.1115/IPACK2005-73293

Abstract

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Topics: Cooling

Thermal Performance of Thermally Enhanced PBGA Packages

Sriram Neelakantan, Bennett Joiner

InterPACK 2005; 451-459https://doi.org/10.1115/IPACK2005-73303

Abstract

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Topics: Ball-Grid-Array packaging , Clearances (Engineering) , Computational fluid dynamics , Copper , Electrical conductivity , Finite element analysis , Heat , Heat sinks , Metals , Mixed convection

The Cooling Impact of a Pair of Opposed Unsteady Confined Impinging Air Jets

Victor Chiriac, Jorge L. Rosales

InterPACK 2005; 461-467https://doi.org/10.1115/IPACK2005-73310

Abstract

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Topics: Air jets , Cooling , Jets , Reynolds number , Flow (Dynamics) , Heat transfer , Unsteady flow , Bubbles , Convection , Displacement

Thermal Management of Fujitsu High-End Unix Servers

Jie Wei, Masahiro Suzuki

InterPACK 2005; 469-475https://doi.org/10.1115/IPACK2005-73313

Abstract

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Topics: Computers , Cooling , Thermal management

Tactile Temperature Analysis of Home Theater System

Ho Chul Ryu, Byung Ju Dan, In Ho Choi, Jin Yong Kim

InterPACK 2005; 477-482https://doi.org/10.1115/IPACK2005-73334

Abstract

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Topics: Computational fluid dynamics , Temperature , Vents

A New Approach to Model Axial Fans in Commercial CFD Tools

Nader Sadeghi, Fred Barez, Younes Shabany

InterPACK 2005; 483-486https://doi.org/10.1115/IPACK2005-73336

Abstract

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Topics: Computational fluid dynamics , Fans

Thermal Characterization of Dual-Core Processor in Computer Equipment

Manoj Nagulapally, Gamal Refai-Ahmed

InterPACK 2005; 487-491https://doi.org/10.1115/IPACK2005-73365

Abstract

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Topics: Agglomeration (Materials) , Boundary-value problems , Computational fluid dynamics , Computers , Energy conservation , Engineering simulation , Network models , Physics , Simulation , Simulation results

Airflow Uniformity Through Perforated Tiles in a Raised-Floor Data Center

James W. VanGilder, Roger R. Schmidt

InterPACK 2005; 493-501https://doi.org/10.1115/IPACK2005-73375

Abstract

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Topics: Air flow , Data centers , Tiles , Computational fluid dynamics , Leakage , Design , Building renovation , Construction , Cooling , Cooling systems

Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials

Gary Lehmann, Hao Zhang, Arun Gowda, David Esler

InterPACK 2005; 503-509https://doi.org/10.1115/IPACK2005-73380

Abstract

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Topics: Composite materials , Particle size , Thermal conductivity , Thermal resistance , Particulate matter , Electrical conductance , Adhesives , Lasers , Manufacturing , Modeling

Thermal Interface Material Technology Advancements and Challenges: An Overview

Ashay Dani, James C. Matayabas, Jr., Paul Koning

InterPACK 2005; 511-516https://doi.org/10.1115/IPACK2005-73384

Abstract

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Topics: Clocks , Design , Energy dissipation , Flip-chip , Flip-chip devices , Heat , Materials science , Packaging , Phase change materials , Polymers

Effect of Data Center Layout on Rack Inlet Air Temperatures

Roger Schmidt, Madhusudan Iyengar

InterPACK 2005; 517-525https://doi.org/10.1115/IPACK2005-73385

Abstract

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Topics: Cooling , Data centers , Temperature

Numerical Modeling of Jet Impingement and Validation of Convection: Conduction Decoupling in Thermal Design

Madhusudan Iyengar, Michael J. Ellsworth, Jr., Robert E. Simons, Levi A. Campbell

InterPACK 2005; 527-533https://doi.org/10.1115/IPACK2005-73386

Abstract

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Topics: Computer simulation , Convection , Design , Heat conduction , Jets , Density , Heat transfer coefficients , Computational fluid dynamics , Cooling , Errors

Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling

Madhusudan Iyengar, Roger Schmidt, Arun Sharma, Gerard McVicker, Saurabh Shrivastava, Sri Sri-Jayantha, Yasuo Amemiya, Hien Dang, Timothy Chainer, Bahgat Sammakia

InterPACK 2005; 535-543https://doi.org/10.1115/IPACK2005-73387

Abstract

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Topics: Computer simulation , Data centers , Thermal characterization

Improving the Performance of the Micro Jet Array Air Cooling MEMS Device Using CFD

Yangki Jung, R. Panneer Selvam

InterPACK 2005; 545-552https://doi.org/10.1115/IPACK2005-73392

Abstract

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Topics: Compressible flow , Computational fluid dynamics , Cooling , Finite difference methods , Heat transfer , Microelectromechanical systems

Heat Spreading Analysis of a Heat Sink Base Embedded With a Heat Pipe

Brian V. Borgmeyer, H. B. Ma

InterPACK 2005; 553-556https://doi.org/10.1115/IPACK2005-73393

Abstract

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Topics: Heat , Heat pipes , Heat sinks

Squeeze Flow Study of a Colloidal Paste

Drew A. Davidson, Gary L. Lehmann

InterPACK 2005; 557-567https://doi.org/10.1115/IPACK2005-73394

Abstract

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Topics: Disks , Flow (Dynamics) , Fluids

Theta_JC Metrology Development: Fixture Design Modeling

Michael Butch M. Dizon, Suzana Prstic, Sung-Won Moon

InterPACK 2005; 569-576https://doi.org/10.1115/IPACK2005-73405

Abstract

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Topics: Design , Metrology , Modeling , Errors , Computational fluid dynamics , Heat losses , Insulation , Junctions , Temperature , Cavities

Comparison of Different Single-Phase Liquid Jet Impingement Cooling Configurations in the Context of Thermal Management in Power Electronics

Sreekant V. J. Narumanchi, Desikan Bharathan, Vahab Hassani

InterPACK 2005; 577-589https://doi.org/10.1115/IPACK2005-73407

Abstract

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Topics: Computational fluid dynamics , Electronics , Erosion , Impingement cooling , Jets , Pressure drop , Thermal management

Towards a Thermal Moore’s Law

Shankar Krishnan, Suresh V. Garimella, Greg M. Chrysler, Ravi V. Mahajan

InterPACK 2005; 591-603https://doi.org/10.1115/IPACK2005-73409

Abstract

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Topics: Computers , Cooling , Design , Electrons , Energy dissipation , Heat , Heat sinks , Heat transfer , Leakage , Power density

A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects

Bing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl

InterPACK 2005; 605-610https://doi.org/10.1115/IPACK2005-73416

Abstract

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Topics: Cooling , Heat sinks , Microfluidics , Silicon chips , Complementary metal oxide semiconductors , Density , Electroplating , Engineering prototypes , Flip-chip , Flip-chip assemblies

Internal Thermal Management of IBM P-Server Large Format Multi-Chip Modules Utilizing Small Gap Technology

Patrick A. Coico, Gaetano Messina, Steven Ostrander, Jeffrey Zitz, Wei Zou

InterPACK 2005; 611-616https://doi.org/10.1115/IPACK2005-73422

Abstract

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Topics: Multi-chip modules , Thermal management , Hardware , Heat flux , Reliability , Computers , Cooling , Design , Fixturing , Flux (Metallurgy)

Mapping Potential Heatsink Conductance Across the Hydraulic Plane

Maurice F. Holahan

InterPACK 2005; 617-625https://doi.org/10.1115/IPACK2005-73423

Abstract

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Topics: Electrical conductance , Flow (Dynamics) , Pressure , Algorithms , Aluminum , Copper , Electrical conductivity , Fins , Geometry , Heat sinks

Flow Boiling Heat Transfer to a Dielectric Coolant in a Microchannel Heat Sink

Tailian Chen, Suresh V. Garimella

InterPACK 2005; 627-634https://doi.org/10.1115/IPACK2005-73438

Abstract

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Topics: Boiling , Coolants , Flow (Dynamics) , Heat sinks , Heat transfer , Microchannels , Critical heat flux , Design , Evaporation , Fluids

Testing the Thermal Resistance and Power Capacity of Production Heat Pipes

Sukhvinder Kang, Randy Cook, Dave Gailus

InterPACK 2005; 635-640https://doi.org/10.1115/IPACK2005-73445

Abstract

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Topics: Heat pipes , Testing , Thermal resistance , Heat , Heat sinks , Manufacturing , Design , Pipes , Specific heat , Air flow

Thermal Management of Voids and Delamination in TIMs

Vadim Gektin

InterPACK 2005; 641-645https://doi.org/10.1115/IPACK2005-73446

Abstract

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Topics: Delamination , Thermal management

Thermodynamic Design of Compact Thermal Compressor for Sorption Assisted Cryogenic Cooling of Electronics

Shivesh K. Suman, Andrei G. Fedorov, Yogendra K. Joshi

InterPACK 2005; 647-654https://doi.org/10.1115/IPACK2005-73452

Abstract

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Topics: Compressors , Cooling , Design , Electronics , Refrigeration , Sorption

Boiling of Enhanced Surfaces at High Heat Fluxes in a Small Boiler

Liang-Han Chien, C.-W. Chen

InterPACK 2005; 655-662https://doi.org/10.1115/IPACK2005-73457

Abstract

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Topics: Boilers , Boiling , Condensation , Cooling , Evaporation , Flux (Metallurgy) , Heat , Thermal resistance

Maintaining Datacom Rack Inlet Air Temperatures With Water Cooled Heat Exchanger

Roger Schmidt, Richard C. Chu, Mike Ellsworth, Madhu Iyengar, Don Porter, Vinod Kamath, Bret Lehman

InterPACK 2005; 663-673https://doi.org/10.1115/IPACK2005-73468

Abstract

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Topics: Data centers , Doors , Heat exchangers , Temperature , Water

Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan

InterPACK 2005; 675-682https://doi.org/10.1115/IPACK2005-73486

Abstract

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Topics: Optimization , Design , Heat flux , Clocks , Energy dissipation , Finite element analysis , Finite element methods , Finite element model , Junctions , Separation (Technology)

Design of a Transient, Temperature Control System for a Low-Temperature Infrared Optical Telescope Utilizing a Ramai R-Cooled Thermoelectric Assembly as the Condenser of a Two-Phase Cooling System

Donald C. Price, W. Gerald Wyatt, Pete Townsend, Mark C. Woods, Brad W. Fennell

InterPACK 2005; 683-695https://doi.org/10.1115/IPACK2005-73496

Abstract

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Topics: Condensers (steam plant) , Cooling systems , Design , Low temperature , Manufacturing , Telescopes , Temperature control , Transients (Dynamics) , Temperature , Optical elements

Experimental Investigation of the Miniature Loop Heat Pipe With Flat Evaporator

Randeep Singh, Aliakbar Akbarzadeh, Masataka Mochizuki, Thang Nguyen, Vijit Wuttijumnong

InterPACK 2005; 697-702https://doi.org/10.1115/IPACK2005-73498

Abstract

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Topics: Computer cooling , Heat pipes

Thermal Management of Micro/Nanosystems

Redesigns of HSOP Package for High Power Consumption Based on the Numerical Thermal Simulation Analysis

John Chia, Jinfa Chen

InterPACK 2005; 703-708https://doi.org/10.1115/IPACK2005-73018

Abstract

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Topics: Design , Energy consumption , Simulation analysis , Thermal conductivity , Fatigue life , Finite element methods , Finite element model , Heat , Heat conduction , Reliability

Experimental Validation of Channeled Wall Passive Cooling Enhancement

Kazuaki Yazawa, Yasushi Nishino, Shinji Nakagawa, Masaru Ishizuka

InterPACK 2005; 709-716https://doi.org/10.1115/IPACK2005-73078

Abstract

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Topics: Cooling , Composite materials , Design , Electronics , Flow (Dynamics) , Numerical analysis , Optimization , Shapes , Temperature , Thermal conductivity

Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow

Ravi S. Prasher, John Dirner, Je-Young Chang, Alan Myers, David Chau, Dongming He, Suzana Prstic

InterPACK 2005; 717-725https://doi.org/10.1115/IPACK2005-73086

Abstract

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Topics: Cross-flow , Heat exchangers , Pressure drop , Silicon , Thermal resistance , Dimensions , Fins , Fluids , Friction , Pins (Engineering)

Jet Impingement Cooling Using Micro Channels in Low Temperature Cofire Ceramic (LTCC) Substrates

W. Kinzy Jones, Surya Kappagantula, Marc Zampino

InterPACK 2005; 727-731https://doi.org/10.1115/IPACK2005-73214

Abstract

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Topics: Ceramics , Impingement cooling , Low temperature , Microchannels

Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice

Hing Wah Lee, Parthiban Arunasalam, Ishak A. Azid, Kankanhally N. Seetharamu

InterPACK 2005; 733-740https://doi.org/10.1115/IPACK2005-73280

Abstract

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Topics: Chain , Flow (Dynamics) , Optimization , Temperature control , Artificial neural networks , Finite element analysis , Microfluidics , Simulation results , Temperature distribution , Annealing

Thermal Management for Chip-Scale Atomic Clocks

Alexander Laws, Richard Y. J. Chang, Victor M. Bright, Y. C. Lee

InterPACK 2005; 741-745https://doi.org/10.1115/IPACK2005-73444

Abstract

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Topics: Atomic clocks , Thermal management , Temperature , Switches , Clocks , Design , Energy dissipation , Vehicles , Waste heat , Cavities

Optical MEMS

GaN Film Grown on Si Substrate for Monolithic Optical MEMS

F.-R. Hu, K. Ochi, B.-S. Choi, Y. Kanamori, K. Hane

InterPACK 2005; 747-750https://doi.org/10.1115/IPACK2005-73130

Abstract

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Topics: Gallium nitride , Microelectromechanical systems , Atomic force microscopy , Diffraction gratings , Electron microscopy , Lasers , Molecular beam epitaxy , Photonic equipment

Hermetic Packaging of Micro Scanner for Laser Display Applications

Won Kyoung Choi, Moon Gi Cho, Sun Kyoung Seo, Hyuck Mo Lee, Byung Gil Jeong, Hwa-Sun Lee, Young-Chul Ko, Jin-Ho Lee, Chang Youl Moon

InterPACK 2005; 751-755https://doi.org/10.1115/IPACK2005-73252

Abstract

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Topics: Lasers , Packaging , Sealing (Process) , Shear strength , Adhesion , Adhesives , Alloys , Cavities , Ceramics , Design

Wafer-Level Packaging Technology With Through-Hole Interconnections in Silicon Substrate

Satoshi Yamamoto, Masanobu Saruta, Hideyuki Wada, Michikazu Tomita, Tatsuo Suemasu

InterPACK 2005; 757-760https://doi.org/10.1115/IPACK2005-73298

Abstract

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Topics: Packaging , Semiconductor wafers , Silicon , Reliability , Sensors , Alloys , Copper , Density , Electrical resistance , Electroplating

Laser-Induced Damage of Polycrystalline Silicon Optically Powered MEMS Actuators

Justin R. Serrano, Leslie M. Phinney, Carlton F. Brooks

InterPACK 2005; 761-766https://doi.org/10.1115/IPACK2005-73322

Abstract

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Topics: Actuators , Damage , Lasers , Microelectromechanical systems , Polysilicon , Energy dissipation , Imaging , Irradiation (Radiation exposure) , Micromachining , Waves

Measurement and Analysis of Insertion Loss in an Optical Collimation System Designed for a 2D MEMS Optical Switch

Tsuyoshi Ikehara, Ryutaro Maeda, Xue Chuan Shan

InterPACK 2005; 767-772https://doi.org/10.1115/IPACK2005-73335

Abstract

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Topics: Microelectromechanical systems , Switches , Lenses (Optics) , Mirrors , Ray tracing

An Efficient Numerical Procedure for Solving Microscale Heat Transport Equation During Femtosecond Laser Heating of Nanoscale Metal Films

Illayathambi Kunadian, J. M. McDonough, Ravi Ranjan Kumar

InterPACK 2005; 773-781https://doi.org/10.1115/IPACK2005-73376

Abstract

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Topics: Heat , Heating , Lasers , Metals , Microscale devices , Nanoscale phenomena , Stability , Dimensions , Numerical analysis , Partial differential equations

Deformation Analysis of Center-Anchored Square Plate Induced by Residual Gradient Stress

Pen-Lun Chang, Meng-Ju Lin, Tsung-Li Fan

InterPACK 2005; 783-787https://doi.org/10.1115/IPACK2005-73430

Abstract

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Topics: Deformation , Stress , Warping , Metals , Mirrors , Shapes , Temperature , Diluents , Finite element methods , Materials properties

Development of 1D Optical Micro Scanner Driven by Piezoelectric Actuators

Takeshi Kobayashi, Jiunnjye Tsaur, Ryutaro Maeda

InterPACK 2005; 789-792https://doi.org/10.1115/IPACK2005-73431

Abstract

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Topics: Piezoelectric actuators , Cantilevers , Hinges , Microelectromechanical systems , Microfabrication , Mirrors , Resonance , Rotation , Silicon-on-insulator

Surface Activated Flip-Chip Bonding of Laser Chips

Eiji Higurashi, Masao Nakagawa, Tadatomo Suga, Renshi Sawada

InterPACK 2005; 793-796https://doi.org/10.1115/IPACK2005-73436

Abstract

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Topics: Bonding , Flip-chip , Lasers

Variable Focal Length Microlens by Low Voltage Electrowetting on Dielectric (EWOD) Actuation

Raj K. Dash, Theodorian Borca-Tasciuc

InterPACK 2005; 797-802https://doi.org/10.1115/IPACK2005-73441

Abstract

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Topics: Design , Dielectric liquids , Dielectric materials , Electrodes , Lenses (Optics) , Microfabrication

Airborne, Space and Defence Electronic Packaging

Dynamic and Thermal Elastic Problems for STM Flatpack Hardware

Fred Cutting

InterPACK 2005; 803-817https://doi.org/10.1115/IPACK2005-73015

Abstract

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Topics: Design , Energy dissipation , Fatigue , Hardware , Heat , Random vibration , Resonance , Rotational inertia , Spectral energy distribution , Springs

Survey of Environmental Data for COTS (Commercial Off-the-Shelf) Used in Military Systems

Medy Ramot, Eran Weiss, Niv Cohen

InterPACK 2005; 819-826https://doi.org/10.1115/IPACK2005-73025

Abstract

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Topics: Military systems , Defense industry , Design , Computers , Data storage systems , Semiconductors (Materials) , Telecommunications

Mechanical Design Aspects During Full-Scale Development Process of Electronic Assemblies for Military Systems

Medy Ramot

InterPACK 2005; 827-833https://doi.org/10.1115/IPACK2005-73026

Abstract

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Topics: Design engineering , Manufacturing , Military systems

Characterization of Electrical Failure Modes in Chip-on-Board Assemblies for Extreme Temperature Environments

Donald V. Schatzel, Andrew A. Shapiro

InterPACK 2005; 835-844https://doi.org/10.1115/IPACK2005-73036

Abstract

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Topics: Failure mechanisms , Temperature , Cycles , Design , Vehicles , Electronics , Failure , Reliability , Technology development , Automotive design

Packaging of Electronic and Photonic Systems

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

J. Varghese, A. Dasgupta

InterPACK 2005; 845-848https://doi.org/10.1115/IPACK2005-73014

Abstract

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Topics: Electrical wires , Failure , Testing , Durability , Intermetallic compounds , Solders , Damage , Surface mount packaging , Brittleness , Deformation

Development of Integrated Process-Ageing Modeling Methodology for Flip Chip on Flex Interconnections With Non-Conductive Adhesives

Xiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao

InterPACK 2005; 849-856https://doi.org/10.1115/IPACK2005-73020

Abstract

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Topics: Adhesives , Flip-chip , Flip-chip devices , Modeling , Stress , Finite element analysis , Finite element model , Reliability , Temperature , Thermomechanics

Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology

George F. Raiser, Dudi Amir

InterPACK 2005; 857-865https://doi.org/10.1115/IPACK2005-73045

Abstract

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Topics: Metrology , Nickel , Reliability , Shear (Mechanics) , Shock (Mechanics) , Solder joints

Simulation of Warpage Considering Both Thermal and Cure Induced Shrinkage During Molding in IC Packaging

Shiang-Yu Teng, Sheng-Jye Hwang

InterPACK 2005; 867-872https://doi.org/10.1115/IPACK2005-73062

Abstract

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Topics: Integrated circuit packaging , Molding , Shrinkage (Materials) , Simulation , Warping , Pressure , Simulation models , Temperature , Thermal expansion

Novel Cyanide Free Electroless Au Plating for the Reliable Joint Between Ni-P/Au and Sn-Ag-Cu Based Lead Free Solder

Akihiro Aiba, Kazumi Kawamura, Masashi Kumagai

InterPACK 2005; 873-877https://doi.org/10.1115/IPACK2005-73079

Abstract

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Topics: Lead-free solders , Plating , Tin , Corrosion , Stability , Ball-Grid-Array packaging , Cyanide process , Displacement , Metals , Oxidation

The Bondabilities of Various Metals Using Ag Metallo-Organic Nanoparticles and These Bonding Mechanisms

Shinji Kobayashi, Eiichi Ide, Shinji Angata, Akio Hirose, Kojiro F. Kobayashi

InterPACK 2005; 879-885https://doi.org/10.1115/IPACK2005-73161

Abstract

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Topics: Bonding , Metals , Nanoparticles , Solders

The Sintering Process of Ag Metallo-Organic Nanoparticles and the Influence of the Joining Parameters Upon Cu-to-Cu Joining

Shinji Angata, Eiichi Ide, Akio Hirose, Kojiro F. Kobayashi

InterPACK 2005; 887-892https://doi.org/10.1115/IPACK2005-73164

Abstract

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Topics: Joining , Nanoparticles , Sintering , Bonding , Shells , Agglomeration (Materials) , Nanotechnology , Pressure , Solders , Surface energy

Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder

Akio Hirose, Takashi Hojo, Yosuke Sogo, Ryoko Miwa, Kojiro F. Kobayashi, Atsushi Yamaguchi, Akio Furusawa, Kazuto Nishida

InterPACK 2005; 893-898https://doi.org/10.1115/IPACK2005-73167

Abstract

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Topics: Ball-Grid-Array packaging , Solder joints , Solders , Tin

Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors

Amelia G. Grobnic, Robert James, Ping Lu, Stephen J. Mihailov

InterPACK 2005; 899-906https://doi.org/10.1115/IPACK2005-73209

Abstract

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Topics: Circuits , Fiber Bragg gratings , Sensors , Thermal stresses , Photonic equipment , Design , Finite element analysis , Geometry , Optical instruments , Optimization

Structural Analysis of Microelectronic and Photonic Systems

E. Suhir

InterPACK 2005; 907-920https://doi.org/10.1115/IPACK2005-73249

Abstract

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Topics: Photonic systems , Structural analysis , Modeling , Design , ASME honors and awards , Engineering disciplines , Engineering research , Experimental methods , Fibers , Finite element analysis

Wafer Level Package Challenges: Fabrication Methodology, Packaging Infrastructure and Die-Shrink Considerations

Vern Solberg

InterPACK 2005; 921-925https://doi.org/10.1115/IPACK2005-73253

Abstract

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Topics: Manufacturing , Packaging , Semiconductor wafers , Design , Printed circuit boards , Testing

Deformation and Fatigue Fracture of Pb-Free Solder Alloys Under Complicated Load Conditions

J. Liang, N. Dariavach, P. Callahan, D. Shangguan, X. Li

InterPACK 2005; 927-938https://doi.org/10.1115/IPACK2005-73257

Abstract

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Topics: Alloys , Deformation , Fatigue , Fracture (Materials) , Fracture (Process) , Lead-free solders , Stress , Solders , Temperature , Die cutting

Novel Test Methods for Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin

InterPACK 2005; 939-945https://doi.org/10.1115/IPACK2005-73296

Abstract

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Topics: Atomic force microscopy , Design , Electromagnetic scattering , Electronic packaging , Failure , Failure mechanisms , Finite element analysis , Geometry , Grinding , Packaging

Fabrication of Sub-Micron Silicon Vias by Deep Reactive Ion Etching

Shawn X. D. Zhang, Ronald Hon, S. W. Ricky Lee

InterPACK 2005; 947-953https://doi.org/10.1115/IPACK2005-73299

Abstract

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Topics: Manufacturing , Reactive-ion etching , Silicon , Microelectromechanical systems , Microfabrication , Etching , Packaging

Use of Array Capacitors to Improve the Power Delivery Performance of a Microprocessor System

Kimberly D. Eilert, Kaladhar Radhakrishnan, Michael J. Hill, Kemal Aygu¨n

InterPACK 2005; 955-958https://doi.org/10.1115/IPACK2005-73301

Abstract

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Topics: Capacitors , Frequency response , Modeling , Optimization , Simulation models

Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability

Sankara J. Subramanian

InterPACK 2005; 959-963https://doi.org/10.1115/IPACK2005-73304

Abstract

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Topics: Finite element model , Modeling , Reliability , Solders , Thermomechanics , Cracking (Materials) , Fracture (Process) , Testing , Brittleness , Corners (Structural elements)

On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques

Sandeep Sane, Shalabh Tandon, Biju Chandran, Tsgereda Alazar, Leonard R. Sorenson

InterPACK 2005; 965-969https://doi.org/10.1115/IPACK2005-73306

Abstract

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Topics: Shear (Mechanics) , Silicon , Manufacturing , Failure mechanisms , Stress , Failure , Reliability , Calibration , Delays , Failure analysis

An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems

Lesley Polka, Ravi Mahajan, Johanna Swan, Gaurang Choksi

InterPACK 2005; 971-975https://doi.org/10.1115/IPACK2005-73320

Abstract

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Topics: System-in-package , Architecture , Industrial research , Packaging

MX2 Processor Module: Twice the Processors in Half the Volume

Christian Belady, Gary Williams, Shaun Harris

InterPACK 2005; 977-981https://doi.org/10.1115/IPACK2005-73321

Abstract

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Topics: Computers , Cooling , Design , Engineers , Fillers (Materials) , Packaging , Power converters , Teams , Thermal resistance

Analytical and Experimental Characterization of Bonding Over Active Circuitry

Li Zhang, Vijaylaxmi Gumaste, Anindya Poddar, Luu Nguyen, Gary Schulze

InterPACK 2005; 983-991https://doi.org/10.1115/IPACK2005-73328

Abstract

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Topics: Bonding , Experimental characterization , Stress , Fracture (Materials) , Wire bonding , Aluminum , Computer simulation , Cracking (Materials) , Damage , Design

Chip Scale Package for Image Sensor Device

Yung-Ching Chao, John Liu, Yao-Jung Lee, De-Shin Liu, Jeff Wang, Ching-Yang Chen, Sam Huang, Alex Lu

InterPACK 2005; 993-998https://doi.org/10.1115/IPACK2005-73329

Abstract

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Topics: Sensors , Bonding , Flip-chip , Flip-chip devices , Manufacturing , Metals , Optical glass , Reliability , Sealing (Process) , Semiconductor wafers

Electrical Simulation Design Technology of Silicon Through Substrate

Takamasa Takano, Masataka Yamaguchi, Koichi Nakayama, Tomoko Maruyama, Shigeki Chujyo, Satoru Kuramochi, Yoshitaka Fukuoka

InterPACK 2005; 999-1004https://doi.org/10.1115/IPACK2005-73339

Abstract

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Topics: Design , Silicon , Simulation , Packaging , System-in-package , Transmission lines , Cables , Circuits , Clocks , Delays

Mechanical Design and Analysis of Land Grid Array (LGA) Sockets

Vinayak Pandey, Sankara Subramanian, Sudarshan Rangaraj, Tod Byquist

InterPACK 2005; 1005-1011https://doi.org/10.1115/IPACK2005-73360

Abstract

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Topics: Accelerated life testing , Ball-Grid-Array packaging , Computer simulation , Design , Design engineering , Manufacturing , Optimization , Pins (Engineering) , Reliability , Shock (Mechanics)

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

John Lau, S. W. Ricky Lee, Fubin Song, Dongkai Shangguan, Dennis C. Lau, Walter Dauksher

InterPACK 2005; 1013-1019https://doi.org/10.1115/IPACK2005-73362

Abstract

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Topics: Ball-Grid-Array packaging , Fatigue , Lead-free solders , Alloys , Failure mechanisms , Vehicles

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

John Lau, Ricky Lee, Walter Dauksher, Dongkai Shangguan, Fubin Song, Dennis Lau

InterPACK 2005; 1021-1029https://doi.org/10.1115/IPACK2005-73364

Abstract

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Topics: Ball-Grid-Array packaging , Fatigue life , Lead-free solders , Reliability , Design , Fatigue , Manufacturing

A Paradigm Shift in the Development of Chemical Mechanical Polishing (CMP): Cost-Effective CMP Planarization in Next Generation Substrate/Package Design and Manufacturing

Stefanie Lotz, Robert Baresel, Dipto Thakurta, Lei Jiang, Tuhin Ghosh

InterPACK 2005; 1031-1036https://doi.org/10.1115/IPACK2005-73371

Abstract

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Topics: Design , Manufacturing , Polishing , Slurries , Copper , Recycling , Computer-aided design , Data collection , Density , Electroplating

Development of Lead-Free Compatible Molded Underfill (MUF) Materials for Flip Chip Stacked Packaging: Key Challenges and Learnings

Vassou LeBonheur, Choong Kooi Chee

InterPACK 2005; 1037-1044https://doi.org/10.1115/IPACK2005-73373

Abstract

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Topics: Flip-chip , Packaging

Dual Die Package Design Strategy and Performance

Mahadevan Suryakumar, Lu-Vong T. Phan, Mathew Ma, Wajahat Ahmed

InterPACK 2005; 1045-1051https://doi.org/10.1115/IPACK2005-73391

Abstract

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Topics: Design , Leakage , Clocks , Cycles , Energy efficiency , Packaging

Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)

Dongji Xie, David Geiger, Dongkai Shangguan, Daniel T. Rooney, Louis J. Gullo

InterPACK 2005; 1053-1062https://doi.org/10.1115/IPACK2005-73484

Abstract

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Topics: Solder joints , Failure , Finite element analysis , Lumber , Failure analysis , Failure mechanisms , Metals , Probability , Screws , Stress

Packaging for Micro/Nanosystems

DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII

Bryan Hsieh, Kevin Chiang, Y. P. Wang, C. S. Hsiao

InterPACK 2005; 1063-1068https://doi.org/10.1115/IPACK2005-73200

Abstract

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Topics: Ball-Grid-Array packages , Ball-Grid-Array packaging , Clocks , Density , Electronics , Laptop computers , Manufacturing , Noise (Sound) , Packaging , Signals

Ceramic Via Wafer-Level Packaging for MEMS

John M. Heck, Leonel R. Arana, Bill Read, Thomas S. Dory

InterPACK 2005; 1069-1074https://doi.org/10.1115/IPACK2005-73369

Abstract

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Topics: Ceramics , Microelectromechanical systems , Packaging , Semiconductor wafers , Bonding , MEMS packaging , Solders , Compression , Copper , Glass

Reliability of Electronic and Photonic Systems

Reduce Vibration Analysis Errors With Precise Weight Predictions

Frank Fan Wang

InterPACK 2005; 1075-1081https://doi.org/10.1115/IPACK2005-73004

Abstract

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Topics: Errors , Vibration analysis , Weight (Mass) , Design , Finite element analysis , Computers , Electronics , Modeling , Testing , Avionics

Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment

Frank Fan Wang

InterPACK 2005; 1083-1088https://doi.org/10.1115/IPACK2005-73005

Abstract

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Topics: Electronic equipment , Shock (Mechanics) , Stress , Vibration , Resonance , Damage , Excitation , Random vibration , Spectral energy distribution , Waves

Understanding and Testing for Drop Impact Failure

S. K. W. Seah, E. H. Wong, R. Ranjan, C. T. Lim, Y.-W. Mai

InterPACK 2005; 1089-1094https://doi.org/10.1115/IPACK2005-73047

Abstract

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Topics: Failure , Testing , Inertia (Mechanics) , Solder joints , Ball-Grid-Array packages , Electronics , Impact testing , Printed circuit boards , Shock (Mechanics) , Stress

Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball

Seungbae Park, Ramji Dhakal, Lawrence Lehman, Eric Cotts

InterPACK 2005; 1095-1100https://doi.org/10.1115/IPACK2005-73058

Abstract

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Topics: Solders , Stress , Tin , Solder joints , Ball-Grid-Array packaging , Deformation , Optical microscopy , Fatigue life , Grain boundaries , Imaging

Plastic Strain Based Criterion for Reliability Assessment of CSP Packages Subjected to Dynamic Shock Loads

Liping Zhu, Rick Williams

InterPACK 2005; 1101-1108https://doi.org/10.1115/IPACK2005-73059

Abstract

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Topics: Ball-Grid-Array packaging , Finite element analysis , Reliability , Shock (Mechanics) , Stress , Failure , Ball-Grid-Array packages , Solder joints , Computer simulation , Computer software

Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability

Don-Son Jiang, Joe Hung, Yu-Po Wang, C. S. Hsiao

InterPACK 2005; 1109-1113https://doi.org/10.1115/IPACK2005-73063

Abstract

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Topics: Finishes , Lead-free solders , Reliability , Solders

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography

Toshihiko Sayama, Hiroyuki Tsuritani, Kentaro Uesugi, Akira Tsuchiyama, Tsukasa Nakano, Hideyuki Yasuda, Takeshi Takayanagi, Takao Mori

InterPACK 2005; 1115-1121https://doi.org/10.1115/IPACK2005-73083

Abstract

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Topics: Nondestructive evaluation , Solders , Synchrotron radiation , X-rays , Joining , Reliability , Tin , Cycles , Density , Flip-chip

Evaluation System for Ionic Migration On/In the Superconnect Leveled Printed Circuit Board by Means of AC Impedance Method

Sachio Yoshihara

InterPACK 2005; 1123-1127https://doi.org/10.1115/IPACK2005-73097

Abstract

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Topics: Printed circuit boards , Copper , Electronic packaging , Reliability

Experimental and Numerical Evaluation of Residual Stress in IC Chips

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki

InterPACK 2005; 1129-1134https://doi.org/10.1115/IPACK2005-73110

Abstract

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Topics: Stress , Electronic packages , Finite element methods , Resins , Semiconductors (Materials) , Temperature , Elastic analysis , Failure , Gages , Numerical analysis

Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

Nobuki Ueta, Hideo Miura

InterPACK 2005; 1135-1140https://doi.org/10.1115/IPACK2005-73112

Abstract

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Topics: Flip-chip , Flip-chip devices , Stress , Sensors , Silicon chips , Strain gages , Finite element analysis , Gages , Polysilicon , Semiconductor wafers

Prediction of Microelectronic Substrate Warpage Using Homogenized Thermomechanical Finite Element Models

Parsaoran Hutapea, Joachim L. Grenestedt, Mitul Modi, Michael Mello, Kristopher Frutschy

InterPACK 2005; 1141-1145https://doi.org/10.1115/IPACK2005-73122

Abstract

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Topics: Finite element model , Thermomechanics , Warping , Adhesion , Copper , Curve fitting , Density , Fibers , Finite element analysis , Polymers

Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines

Kazuhiko Sasagawa, Shigeo Uno, Nao Yamaji, Masumi Saka

InterPACK 2005; 1147-1152https://doi.org/10.1115/IPACK2005-73133

Abstract

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Topics: Current density , Damage , Electrodiffusion , Shapes , Metals , Computer simulation , Density , Evaluation methods , Reliability

Adhesion Strength at High Temperatures Affected by Moisture for Die-Attach Materials of Integrated Circuit Packages

Hiroyuki Tanaka, Takashi Numata

InterPACK 2005; 1153-1158https://doi.org/10.1115/IPACK2005-73139

Abstract

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Topics: Adhesion , High temperature , Integrated circuits

Study on the Dynamic Behavior of Repetitive Drop Test for Electronic Component and the Reliability

Qiang Yu, Tsuyoki Shibata, Keiji Watanabe, Toshihiro Tsurusawa, Masaki Shiratori, Takayoshi Katahira

InterPACK 2005; 1159-1166https://doi.org/10.1115/IPACK2005-73146

Abstract

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Topics: Electronic components , Fracture (Materials) , Fracture (Process) , Reliability , Solder joints

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

Toru Ikeda, Won-Keun Kim, Noriyuki Miyazaki

InterPACK 2005; 1167-1175https://doi.org/10.1115/IPACK2005-73153

Abstract

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Topics: Bonding , Delamination , Flip-chip packages , Reflow soldering , Flip-chip , Flip-chip devices , Reliability , Fracture (Materials) , Solder joints , Stress

Micro-Via Reliability Study of High-Density Substrate

Youhong Wu

InterPACK 2005; 1177-1180https://doi.org/10.1115/IPACK2005-73156

Abstract

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Topics: Density , Reliability

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

Takahiro Nagata, Takaya Kobayashi

InterPACK 2005; 1181-1186https://doi.org/10.1115/IPACK2005-73162

Abstract

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Topics: Equilibrium (Physics) , Finite element analysis , Solders , Stability , Drops , Surface tension , Constitutive equations , Deformation , Fluids , Creep

Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

Saket Karajgikar, Wonkee Ahn, Dereje Agonafer

InterPACK 2005; 1187-1192https://doi.org/10.1115/IPACK2005-73184

Abstract

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Topics: Manufacturing , Printed circuit boards , Warping

Using High Speed Camera for Electronic Board Failure Analysis

Wade Hezeltine, Frank Z. Liang

InterPACK 2005; 1193-1198https://doi.org/10.1115/IPACK2005-73223

Abstract

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Topics: Failure analysis , Design , Failure , Corrective actions , Cross section (Physics) , Cycles , Microscopy , Modeling , Product design , Teams

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

Jin Liang, Xiaodong Li, Zhi-Hui Xu, Dongkai Shangguan

InterPACK 2005; 1199-1205https://doi.org/10.1115/IPACK2005-73233

Abstract

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Topics: Coating processes , Coatings , Deformation , Elastic moduli , Finishes , Finite element analysis , Nanoindentation , Nucleation (Physics) , Plating , Reliability

A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination

Guojun Hu, Andrew A. O. Tay

InterPACK 2005; 1207-1213https://doi.org/10.1115/IPACK2005-73238

Abstract

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Topics: Delamination , Displacement , Fracture (Materials) , Reflow soldering , Vapor pressure , Density , Diffusion (Physics) , Lead-free solders , Solders , Stress

Damage Path Simulation of Solder Joints in QFP

Minoru Mukai, Kenji Hirohata, Hiroyuki Takahashi, Takashi Kawakami, Kuniaki Takahashi

InterPACK 2005; 1215-1221https://doi.org/10.1115/IPACK2005-73297

Abstract

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Topics: Damage , Simulation , Solder joints , Crack propagation , Electronic packages , Solders , Design , Fatigue cracks , Fracture (Materials) , Cycles

SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method

Claire Ryan, Bryan A. Rodgers, Jeff M. Punch

InterPACK 2005; 1223-1228https://doi.org/10.1115/IPACK2005-73318

Abstract

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Topics: Ball-Grid-Array packaging , Fatigue testing , Solder joints , Torsion , Cycles , Failure , Solders , Chain , Copper , Electronic equipment

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

Hisashi Tanie, Takeshi Terasaki, Yasuhiro Naka

InterPACK 2005; 1229-1235https://doi.org/10.1115/IPACK2005-73331

Abstract

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Topics: Fatigue life , Semiconductors (Materials) , Solders , Crack propagation , Fracture (Materials) , Ball-Grid-Array packaging , Solder joints , Surface mount devices , Diluents , Damage

Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall

InterPACK 2005; 1237-1252https://doi.org/10.1115/IPACK2005-73348

Abstract

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Topics: Delamination , Flip-chip assemblies , Stress , Flip-chip , Flip-chip devices , Sensors , Silicon , Cycles , Manufacturing , Solder joints

Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures

M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, M. Saiful Islam, Hongtao Ma, Chang Lin, Pradeep Lall, Roy Knight, Mark Strickland, Jim Blanche

InterPACK 2005; 1253-1262https://doi.org/10.1115/IPACK2005-73349

Abstract

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Topics: Electronic packaging , Flip-chip , Flip-chip devices , Low temperature , Stress , Temperature , Finite element model , Flip-chip assemblies , Modeling , Packaging

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

Bryan Rodgers, Ben Flood, Jeff Punch, Finbarr Waldron

InterPACK 2005; 1263-1270https://doi.org/10.1115/IPACK2005-73352

Abstract

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Topics: Alloys , ASTM International , Ball-Grid-Array packaging , Bone , Computer software , Constitutive equations , Displacement , Fatigue life , Finite element model , Fittings

Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias

M. Reid, J. Punch, B. Rodgers, T. Galkin, T. Stenberg, O. Rusanenc, E. Elonen, M. Vile`n, K. Va¨keva¨inen

InterPACK 2005; 1271-1276https://doi.org/10.1115/IPACK2005-73353

Abstract

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Topics: Printed circuit boards , Steady state , Temperature , Failure , Condensation , Density , Electronic packaging , High temperature , Microelectronic packaging , Optical microscopy

Thermal Gradient in Solder Joints Under Electrical Current Stressing

Da-Jeng Yao, Chung-Yi Hsu, Chih Chen, Sheng-Hsiang Chiu

InterPACK 2005; 1277-1282https://doi.org/10.1115/IPACK2005-73356

Abstract

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Topics: Electric current , Solder joints , Temperature gradient , Temperature , Current density , Solders , Computer software , Errors , Finite element analysis , Heating

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Greg Heaslip, Jeff Punch, Bryan Rogers, Claire Ryan, Michael Reid

InterPACK 2005; 1283-1291https://doi.org/10.1115/IPACK2005-73366

Abstract

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Topics: Ball-Grid-Array packaging , Failure , Failure analysis , Lead-free solders , Solders , Stress , Testing , Data acquisition systems , Design , Electronic components

Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications

Chunyan Yin, Hua Lu, Chris Bailey, Yan-Cheong Chan

InterPACK 2005; 1293-1298https://doi.org/10.1115/IPACK2005-73367

Abstract

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Topics: Anisotropy , Flip-chip , Flip-chip devices , Reliability , Adhesives , Modeling , Contact resistance , Diffusion (Physics) , Epoxy adhesives , Epoxy resins

Creep Behavior of Lead Free Solder Interconnects in Microelectronic Packages: Impression Creep Testing and Constitutive Modeling

I. Dutta, D. Pan, S. Jadhav, R. Mahajan

InterPACK 2005; 1299-1306https://doi.org/10.1115/IPACK2005-73408

Abstract

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Topics: Creep , Lead-free solders , Modeling , Testing , Solder joints , Ball-Grid-Array packaging , Tin , Stress , Intermetallic compounds , Particulate matter

Constitutive Modeling of Lead-Free Solders

M. Pei, J. Qu

InterPACK 2005; 1307-1311https://doi.org/10.1115/IPACK2005-73411

Abstract

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Topics: Lead-free solders , Modeling , Solders , Thermomechanics , Tin , Alloys , Creep , Curve fitting , Deformation , Fatigue

Lead-Free and PbSn Bump Electromigration Testing

Stephen Gee, Nikhil Kelkar, Joanne Huang, King-Ning Tu

InterPACK 2005; 1313-1321https://doi.org/10.1115/IPACK2005-73417

Abstract

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Topics: Electrodiffusion , Testing

Modeling of Thermo-Mechanical Stresses in Copper Interconnect/Low-k Dielectric Systems

Y.-L. Shen

InterPACK 2005; 1323-1330https://doi.org/10.1115/IPACK2005-73450

Abstract

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Topics: Copper , Modeling , Stress , Thermomechanics , Dielectric materials , Deformation , Electrodiffusion , Failure , Finite element analysis , Fracture (Materials)

Bending Simulation of BGA SMT Assemblies and Application to System Level Drop Simulation

Doug Carroll, Marc Zampino, Kinzy Jones

InterPACK 2005; 1331-1339https://doi.org/10.1115/IPACK2005-73475

Abstract

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Topics: Ball-Grid-Array packaging , Simulation , Solder joints , Design , Displacement , Failure , Lead-free solders , Printed circuit boards , Reliability , Solders

A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman

InterPACK 2005; 1341-1346https://doi.org/10.1115/IPACK2005-73493

Abstract

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Topics: Delamination , Flip-chip packages , Fracture mechanics , Fatigue , Flip-chip , Flip-chip devices , Solders , Adhesives , Computer simulation , Displacement

Photonics

Thermal Radiative Properties of Photonic Crystals

Koji Miyazaki, Masahiro Kihara, Hiroshi Tsukamoto

InterPACK 2005; 1347-1350https://doi.org/10.1115/IPACK2005-73135

Abstract

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Topics: Crystals , Reflectance , Particulate matter , Catalysts , Fourier transform infrared spectroscopy , Heat transfer , Self-assembly , Semiconductor wafers , Snell's law , Thermal radiation

Modeling and Characterization of Electronic and Photonic Systems

Development and Application of Mechanical and Reliability Models for Connectors and Sockets

Raymond J. Iannuzzelli, Javad A. Seyyedi, Daniel L. Callahan

InterPACK 2005; 1351-1358https://doi.org/10.1115/IPACK2005-73007

Abstract

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Topics: Boundary-value problems , Computers , Design , Friction , Materials properties , Modeling , Packaging , Reliability , Stress

A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations

L. T. Yeh, B. T. F. Chung, Joseph Yeh

InterPACK 2005; 1359-1364https://doi.org/10.1115/IPACK2005-73008

Abstract

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Topics: Air filters , Computational fluid dynamics , Server racks , Air flow , Computer software , Failure , Fans , Flow (Dynamics)

Characterization of Non-Conductive Adhesives

Daniel Farley, Abhijit Dasgupta, J. F. J. M. Caers

InterPACK 2005; 1365-1370https://doi.org/10.1115/IPACK2005-73021

Abstract

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Topics: Adhesives , Manufacturing , Stress , Metals , Modeling , Contact resistance , Simulation , Temperature , Bonding , Compression

Characterization of Maximum Current Capacity for Microprocessor Sockets

David Song, Ashish Gupta, Chia-Pin Chiu

InterPACK 2005; 1371-1374https://doi.org/10.1115/IPACK2005-73035

Abstract

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Topics: Computer simulation , Modeling , Pressure , Risk assessment , Temperature

Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects

Alex Vukovic, Michel Savoie

InterPACK 2005; 1375-1377https://doi.org/10.1115/IPACK2005-73039

Abstract

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Topics: Density , Heat pipes , Optical interconnections , Performance characterization , Server racks , Thermal management

High Precision Compact Thermal Models

Mohamed-Nabil Sabry

InterPACK 2005; 1379-1387https://doi.org/10.1115/IPACK2005-73051

Abstract

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Topics: Errors , Heat , Reliability , Temperature gradient

Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling

Jeevan Kanesan, Parthiban Arunasalam, Kankanhalli N. Seetharamu, Ishak A. Azid

InterPACK 2005; 1389-1395https://doi.org/10.1115/IPACK2005-73053

Abstract

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Topics: Artificial neural networks , Computer cooling , Genetic algorithms , Thermal energy storage , Fins , Operating temperature , Optimization , Phase transition temperature , Computer simulation , Aluminum

Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)

Satish C. Chaparala, Frank E. Andros, Bill Infantolino, Bahgat G. Sammakia, Satish C. Guttikonda, Julia Zhao, Dipak Sengupta

InterPACK 2005; 1397-1404https://doi.org/10.1115/IPACK2005-73085

Abstract

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Topics: Stress analysis (Engineering) , Stress , Fracture (Materials) , Packaging , Wire , Cracking (Materials) , Density , Design , Engineers , Finite element methods

A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

Hideo Koguchi, Mirai Ishida, Kazuto Nishida, Tomoaki Kuroishi

InterPACK 2005; 1405-1412https://doi.org/10.1115/IPACK2005-73096

Abstract

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Topics: Deflection , Reliability , Stress , Viscoelasticity , Relaxation (Physics) , Resins , Thermodynamic cycles , Adhesives , Thermal expansion , Thermal stresses

Thermal Characterization of Pulse-Activated Microelectronic Devices by Thermoreflectance-Based Surface Temperature Scanning

Pavel L. Komarov, Mihai G. Burzo, Peter E. Raad

InterPACK 2005; 1413-1420https://doi.org/10.1115/IPACK2005-73196

Abstract

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Topics: Microelectronic devices , Temperature , Thermal characterization , Thermoreflectance , Reflectance , Silicon , Transients (Dynamics) , MOSFET transistors , Resolution (Optics) , Calibration

Simplified Network Based Modeling of Cold Plate in a CFD Environment

Debabrata Pal, Mark Severson

InterPACK 2005; 1421-1426https://doi.org/10.1115/IPACK2005-73202

Abstract

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Topics: Computational fluid dynamics , Modeling , Flow (Dynamics) , Electronics , Manufacturing , Plates (structures) , Aerospace industry , Boundary-value problems , Design , Heat

Modeling of Electron Transport in Thin Films With Quantum and Scattering Effects

A. Bulusu, D. G. Walker

InterPACK 2005; 1427-1432https://doi.org/10.1115/IPACK2005-73212

Abstract

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Topics: Electromagnetic scattering , Electron transport , Modeling , Radiation scattering , Scattering (Physics) , Thin films , Equilibrium (Physics) , Phonons , Dimensions , Electrons

Solder Joint Reliability Prediction of Flip Chip Packages Under Shock Loading Environment

Wei Keat Loh, Luke J. Garner

InterPACK 2005; 1433-1440https://doi.org/10.1115/IPACK2005-73213

Abstract

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Topics: Flip-chip packages , Reliability , Shock (Mechanics) , Solder joints

A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application

Shaw Fong Wong, Wei Keat Loh, Yung Hsiang Lee, Eng Hooi Yap, Siang Woen Wong, Tze Yang Hin

InterPACK 2005; 1441-1447https://doi.org/10.1115/IPACK2005-73215

Abstract

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Topics: Ball-Grid-Array packaging , Dynamic response , Flip-chip , Flip-chip devices , Fracture (Materials) , Risk , Solder joints , Accelerometers , Computer software , Design

Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array

Keh Shin Beh, Wei Keat Loh, Jenn Seong Leong, Wooi Aun Tan

InterPACK 2005; 1449-1454https://doi.org/10.1115/IPACK2005-73216

Abstract

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Topics: Ball-Grid-Array packaging , Flip-chip , Flip-chip devices , Reliability , Solder joints , Heat sinks , Stress , Compression , Cycles , Electronic packages

Modeling Melting Solder in System-in-Package Assembly

J. F. Zhao, J. F. Wang, C. Yang

InterPACK 2005; 1455-1458https://doi.org/10.1115/IPACK2005-73237

Abstract

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Topics: Manufacturing , Melting , Modeling , Solders , Stress , System-in-package

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen

InterPACK 2005; 1459-1470https://doi.org/10.1115/IPACK2005-73239

Abstract

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Topics: Alloys , Creep , Heat , Manufacturing , Modeling , Surface mount devices , Bulk solids , Solders , Solder joints , Thermomechanics

High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation

V. Srinivasan, S. Radhakrishnan, X. Zhang, G. Subbarayan, T. Baughn, L. Nguyen

InterPACK 2005; 1471-1478https://doi.org/10.1115/IPACK2005-73258

Abstract

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Topics: Materials characterization , Resolution (Optics) , Composite materials , Computer software , Displacement , B-splines , Fibers , High temperature , Mechanical testing , Packaging

Hierarchical Modeling and Trade-Off Studies in Design of Thermal Interface Materials

X. Zhang, S. Kanuparthi, G. Subbarayan, B. Sammakia, S. Tonapi

InterPACK 2005; 1479-1486https://doi.org/10.1115/IPACK2005-73259

Abstract

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Topics: Design , Modeling , Tradeoffs , Particulate matter , Flat heat pipes , Thermal conductivity , Computer cooling , Fillers (Materials) , Heat sinks , Percolation theory

Mechanical Shock FE Modeling for ATCA Circuit Board Design

Frank Z. Liang, Larry M. Palanuk, Wade Hezeltine

InterPACK 2005; 1487-1492https://doi.org/10.1115/IPACK2005-73274

Abstract

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Topics: Design , Modeling , Printed circuit boards , Shock (Mechanics) , Finite element model , Bricks , Design engineering , Displacement , Displacement measurement , Dynamic response

Electronic Board/System Nonlinearity Characterization for Dynamic Analysis

Frank Z. Liang, Wade Hezeltine, Richard L. Williams

InterPACK 2005; 1493-1497https://doi.org/10.1115/IPACK2005-73277

Abstract

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Topics: Dynamic analysis , Dynamics (Mechanics) , Finite element model , Lumber , Random vibration , Shock (Mechanics) , Vibration tests

Realization of Ultra-Wideband, High-Resolution TDR for Chip-Carrier Packages

Dong-Ho Han, Bao-Shu Xu, Myoung J. Choi, Jiangqi He, Scott Gardiner, Cliff Lee

InterPACK 2005; 1499-1503https://doi.org/10.1115/IPACK2005-73291

Abstract

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Topics: Resolution (Optics) , Transmission lines , Ball-Grid-Array packaging , Calibration , Hardware , Reflection , Signals , Stress , Testing

Full Band S-Parameter Generation Methodology for High Speed Package Interconnect Modeling

Xiangyin Zeng, Jiangqi He, Baoshu Xu

InterPACK 2005; 1505-1508https://doi.org/10.1115/IPACK2005-73307

Abstract

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Topics: Modeling , Skin effect , Electromagnetic spectrum , Signals , Circuits , Waves , Manufacturing , Time-domain analysis

Thermal Simulation Benchmark of Graphic Module Under Installed, Operating Conditions

Fariborz Forghan, Gregory J. Kowalski, Mansour Zenouzi, Hameed Metghalchi

InterPACK 2005; 1509-1521https://doi.org/10.1115/IPACK2005-73370

Abstract

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Topics: Simulation , Temperature , Computer software , Steady state , Transients (Dynamics) , Computers , Operating temperature

Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models

Shankar Ganapathysubramanian, Sandeep Sane, Richard Raymond Dimagiba, Biju I. Chandran

InterPACK 2005; 1523-1528https://doi.org/10.1115/IPACK2005-73401

Abstract

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Topics: Approximation , Computer simulation , Elastic analysis , Electronic packaging , Flip-chip , Manufacturing , Modeling , Packaging , Polymers , Risk assessment

A Slim Sector Model for the Analysis of Fatigue Life of Fine Pitch Flip Chip Packages

Bing Zhao, Andrew A. O. Tay

InterPACK 2005; 1529-1534https://doi.org/10.1115/IPACK2005-73418

Abstract

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Topics: Fatigue analysis , Flip-chip packages , Finite element analysis , Creep , Flip-chip devices , Solders , Strips , Boundary-value problems , Computation , Computer technology

Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

Pradeep Lall, Nokibul Islam, Prakriti Choudhary, Jeff Suhling

InterPACK 2005; 1535-1543https://doi.org/10.1115/IPACK2005-73426

Abstract

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Topics: Electronics , Failure , Damage , Ball-Grid-Array packaging , Design , Electronic components , Intermetallic compounds , Laminates , MEMS packages , Solders

Models for Shock and Vibration Survivability of Electronic and MEMS Packaging

Pradeep Lall, Dhananjay Panchagade, Prakriti Choudhary, Jeff Suhling, Sameep Gupte

InterPACK 2005; 1545-1556https://doi.org/10.1115/IPACK2005-73427

Abstract

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Topics: MEMS packaging , Shock (Mechanics) , Vibration , Damage , Failure , Design , Electronic packaging , Reliability , Transients (Dynamics) , Boundary-value problems

The Impact of Varying Feature Dimensions on Substrate Reliability Risks

Kayleen L. E. Helms, Qing A. Zhou, Charles Zhang

InterPACK 2005; 1557-1563https://doi.org/10.1115/IPACK2005-73428

Abstract

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Topics: Dimensions , Reliability , Modeling , Design , Geometry , Cracking (Materials) , Electronic packaging , Failure , Failure mechanisms , Finite element analysis

The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages

Kayleen L. E. Helms, Betty Phillips

InterPACK 2005; 1565-1573https://doi.org/10.1115/IPACK2005-73429

Abstract

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Topics: Damage , Electronic packages , Flip-chip , Solder joints , Ball-Grid-Array packaging , Failure analysis , Fracture (Materials) , Cracking (Materials) , Design , Flat heat pipes

Thermal Characterization and Modeling of Stacked Die Packages

P. Szabo, M. Rencz, V. Sze´kely, A. Poppe, G. Farkas, B. Courtois

InterPACK 2005; 1575-1581https://doi.org/10.1115/IPACK2005-73437

Abstract

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Topics: Modeling , Steady state , Thermal characterization , Transients (Dynamics)

Manufacturing and Test of Electronic and Photonic Systems

Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions

Phil Geng, Robert R. Martinson, Richard L. Williams, Michael Mello, Steve Cho

InterPACK 2005; 1583-1586https://doi.org/10.1115/IPACK2005-73046

Abstract

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Topics: Shades and shadows , Warping , Temperature , Creep , Failure mechanisms , Heating , Interferometry , Shapes

Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

Yuhki Sato, Hideo Miura

InterPACK 2005; 1587-1592https://doi.org/10.1115/IPACK2005-73109

Abstract

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Topics: Failure , Flip-chip , Flip-chip devices , Nondestructive evaluation , Deformation , Silicon chips , Adhesion , Bonding , Delamination , Diluents

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Hiren Thacker, Oluwafemi Ogunsola, Muhannad Bakir, James Meindl

InterPACK 2005; 1593-1599https://doi.org/10.1115/IPACK2005-73302

Abstract

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Topics: Probes , Semiconductor wafers , Testing , Columns (Structural) , Microoptoelectromechanical systems , Polymers , Density , Engineering prototypes , Hardware , Microfabrication

Manufacturability of MEMS

Wafer Level Bonding of MEMS Devices Using Ceramic Lids

Thomas S. Dory, Bill Read, Leonel R. Arana, John M. Heck

InterPACK 2005; 1601-1605https://doi.org/10.1115/IPACK2005-73377

Abstract

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Topics: Bonding , Ceramics , Microelectromechanical systems , Semiconductor wafers

RF Microwave

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris

InterPACK 2005; 1607-1611https://doi.org/10.1115/IPACK2005-73127

Abstract

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Topics: Millimeter waves , Design , Ceramics , Filters , Dimensions , Electromagnetic spectrum , Filtration , Internet , Liquid crystalline polymers , Low temperature

Experimental Study on the Effects of Human and Electronic-Mechanical Interaction on RF Signal Strength for a Personal Server

Michael Montero, Trevor Pering, Umair Udaud, Paul Wright, Roy Want

InterPACK 2005; 1613-1619https://doi.org/10.1115/IPACK2005-73154

Abstract

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Topics: Design , Signals

Embedded RF Filters for WLAN and Bluetooth Applications

Telesphor Kamgaing, Jiangqi He, Rockwell Hsu

InterPACK 2005; 1621-1624https://doi.org/10.1115/IPACK2005-73319

Abstract

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Topics: Filters , Wireless LAN , Ceramics , Design , Low-pass filters , Manufacturing

Biosensors/Bioengineering

Multidirectional Force and Torque Sensor for Insect Flight Research

Mansoor Nasir, Michael Dickinson, Dorian Liepmann

InterPACK 2005; 1625-1630https://doi.org/10.1115/IPACK2005-73221

Abstract

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Topics: Flight , Sensors , Torque , Aerodynamics , Degrees of freedom , Design , Microelectromechanical systems , Microsensors , Semiconductor wafers , Thrust

Reliability of Micro/Nanosystems

Early-Stage Analysis for MEMS Structural Optimization II: Its Application to Microrelay Reliability

Koji Ishikawa, Takahiro Miki, Hiroki Mamiya, Q. Yu

InterPACK 2005; 1631-1636https://doi.org/10.1115/IPACK2005-73049

Abstract

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Topics: Design , Microelectromechanical systems , Optimization , Reliability , Structural optimization , Switches

Early-Stage Analysis for MEMS Structural Optimization I: Concept

Takahiro Miki, Koji Ishikawa, Hiroki Mamiya, Qiang Yu

InterPACK 2005; 1637-1642https://doi.org/10.1115/IPACK2005-73050

Abstract

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Topics: Computer-aided engineering , Design , Microelectromechanical systems , Structural optimization

Effect of Voids on Thermal Fatigue Reliability of Lead Free Solder Joint

Doseop Kim, Qiang Yu, Yusuke Kobayashi, Tadahiro Shibutani

InterPACK 2005; 1643-1648https://doi.org/10.1115/IPACK2005-73136

Abstract

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Topics: Fatigue , Fatigue strength , Fatigue testing , Finite element methods , Lead-free solders , Reliability , Solder joints , Shear (Mechanics) , Tin , Crack propagation

Robust Design of Air-Cooled Server Cabinets for Thermal Efficiency

Nathan Rolander, Jeffrey Rambo, Yogendra Joshi, Farrokh Mistree

InterPACK 2005; 1649-1659https://doi.org/10.1115/IPACK2005-73171

Abstract

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Topics: Data centers , Design , Modeling , Thermal efficiency

An Engineering Model for Moisture Degradation of Polymer/Metal Interfacial Fracture Toughness

Timothy P. Ferguson, Jianmin Qu

InterPACK 2005; 1661-1664https://doi.org/10.1115/IPACK2005-73414

Abstract

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Topics: Engineering models , Fracture toughness , Metals , Polymers , Fracture mechanics , Hydrophobicity

Reliability Challenges in Design and Operation of High Heat Powered Processors

Ali Heydari, Vadim Gektin

InterPACK 2005; 1665-1668https://doi.org/10.1115/IPACK2005-73461

Abstract

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Topics: Design , Heat , Reliability , Cooling , Heat flux , Packaging density (Electronics) , Blades , Computers , Data centers , Electronics

Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination

Jiantao Zheng, Suresh K. Sitaraman

InterPACK 2005; 1669-1677https://doi.org/10.1115/IPACK2005-73495

Abstract

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Topics: Delamination , Fracture toughness , Microscale devices , Nanoscale phenomena , Strips , Thin films

Testing and Characterization of MEMS

Fracture and Fatigue Testing of Micro-Sized Materials for MEMS Applications

Kazuki Takashima, Timothy P. Halford, Yakichi Higo

InterPACK 2005; 1679-1683https://doi.org/10.1115/IPACK2005-73038

Abstract

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Topics: Fatigue testing , Fracture (Materials) , Microelectromechanical systems , Fatigue cracks , Alloys , Fatigue , Fatigue life , Fracture mechanics , Fracture toughness , Machinery

Molecular Dynamic Simulation of Crack Propagation Behavior in Nano Size HCP Crystals

Shinji Ando, Leping Bu, Masayuki Tsushida, Hideki Tonda

InterPACK 2005; 1685-1688https://doi.org/10.1115/IPACK2005-73042

Abstract

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Topics: Crack propagation , Crystals , Molecular dynamics , Simulation , Fracture (Materials) , Microelectromechanical systems , Molecular dynamics methods , Shear (Mechanics) , Stress , Stress-strain curves

Acoustic Microscopy for Micro Electrical Interconnections

Hironori Tohmyoh, Tsuyoshi Akaogi, Masumi Saka

InterPACK 2005; 1689-1693https://doi.org/10.1115/IPACK2005-73061

Abstract

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Topics: Acoustics , Microscopy , Design , Printed circuit boards , Silicon chips

Thermometry of Polycrystalline Silicon Structures Using Raman Spectroscopy

Mark R. Abel, Samuel Graham

InterPACK 2005; 1695-1702https://doi.org/10.1115/IPACK2005-73088

Abstract

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Topics: Microelectromechanical systems , Polysilicon , Raman spectroscopy , Temperature measurement , Thermal stresses

Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films

Kenichi Shimizu, Tasiyuki Torii

InterPACK 2005; 1703-1708https://doi.org/10.1115/IPACK2005-73134

Abstract

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Topics: Copper , Crystals , Fatigue cracks , Rotation , Crystal structure , Fatigue testing , Fracture (Materials) , Electron backscatter diffraction , Annealing , Evaluation methods

Design and Driving Methodology of Out-of-Plane Electrostatic Microactuator With Extended Stable Motion Range

Takashi Fukushige, Seiichi Hata, Takehiko Hayashi, Akira Shimokohbe

InterPACK 2005; 1709-1713https://doi.org/10.1115/IPACK2005-73145

Abstract

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Topics: Design , Microactuators , Cantilevers , Electrodes , Engineering prototypes , Shapes , Control systems , Deflection , Design methodology , Equilibrium (Physics)

A Basic Study of Characteristics Between Stress and Deflection on Strength Test of Bio-Ceramics

Mitsuyuki Nakayama, Hideto Suzuki

InterPACK 2005; 1715-1718https://doi.org/10.1115/IPACK2005-73147

Abstract

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Topics: Ceramics , Deflection , Stress , Biomaterials , Bone , Young's modulus , Materials properties , Mechanical properties

Effects of Interlayer Resin Bonding on Fatigue Crack Initiation/Propagation in Laminate Materials With a Surface Layer of Copper Film

Akira Matsuba, Tashiyuki Torii, DongHui Ma

InterPACK 2005; 1719-1724https://doi.org/10.1115/IPACK2005-73168

Abstract

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Topics: Annealing , Bonding , Copper , Crack propagation , Fatigue cracks , Laminates , Resins

Fatigue Test of Al-3%Ti Using Axial Loading Testing Machine for MEMS Materials

Jun-Hyub Park, Hyeon Chang Choi, Chang Seung Lee, Sung-Hoon Choa, Man Sik Myung, Yun-Jae Kim

InterPACK 2005; 1725-1730https://doi.org/10.1115/IPACK2005-73195

Abstract

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Topics: Fatigue testing , Machinery , Microelectromechanical systems , Testing , Fatigue strength , High cycle fatigue , Thin films , Switches , Tensile strength

Design and Analysis of a Comb-Drive Actuator for Large Displacement

C. L. Ku, R. Chen, Y. C. Chen

InterPACK 2005; 1731-1735https://doi.org/10.1115/IPACK2005-73327

Abstract

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Topics: Actuators , Design , Displacement , Electrodes , Electrostatic actuators , Grippers , Manufacturing , Mirrors , Simulation results

The Study of the Design in Micro Modal Actuators Using the Holographic Interferometry

Wei-Hsin Gau, Yuh-Chung Hu, Yen-Yi Peng

InterPACK 2005; 1737-1742https://doi.org/10.1115/IPACK2005-73333

Abstract

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Topics: Actuators , Design , Holographic interferometry , Electrodes , Shapes , Stability , Circuits , Electric fields , Equations of motion , Microactuators

High Precision Young’s Modulus Extraction of Thin Films Through Measuring the Electric-Circuit Behavior of Microstructures

Yuh-Chung Hu, Wei-Hsin Gau, Wei-Hsiang Tu

InterPACK 2005; 1743-1747https://doi.org/10.1115/IPACK2005-73337

Abstract

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Topics: Circuits , Microelectromechanical systems , Thin films , Young's modulus

A Rapid Method to Measure Thermal Conductivity of Dielectric Thin Films: Thermal Resistance Method

Da-Jeng Yao, Heng-Chieh Chien, Ming-Hsi Tseng

InterPACK 2005; 1749-1753https://doi.org/10.1115/IPACK2005-73350

Abstract

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Topics: Thermal conductivity , Thermal resistance , Thin films , Composite materials , Design , Heating , Metals , Microelectromechanical systems , Silicon , Thermal conductivity measurement

Development of Latching Type Large Vertical-Travel Microactuator

Risaku Toda, Eui-Hyeok Yang

InterPACK 2005; 1755-1759https://doi.org/10.1115/IPACK2005-73390

Abstract

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Topics: Microactuators , Actuators , Manufacturing , Design , Interferometers , Semiconductor wafers

Design of Transducer and Package at the Same Time

Gary Li, Andrew McNeil, Dan Koury, Mike Chapman, Dave Monk

InterPACK 2005; 1761-1765https://doi.org/10.1115/IPACK2005-73396

Abstract

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Topics: Design , Transducers , Microelectromechanical systems , Modeling , Sensors , Manufacturing , MEMS packaging , Semiconductors (Materials) , Signals , Simulation

Characterization of Heated Atomic Force Microscope Cantilevers in Air and Vacuum

Jungchul Lee, Tanya L. Wright, Mark Abel, Erik Sunden, Alexei Marchenkov, Samuel Graham, William P. King

InterPACK 2005; 1767-1772https://doi.org/10.1115/IPACK2005-73456

Abstract

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Topics: Atomic force microscopy , Cantilevers , Temperature measurement , Vacuum

Materials, Processes, and Technologies

Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys

Katsuhiko Sasaki, Takuji Kobayashi, Ken-Ichi Ohguchi

InterPACK 2005; 1773-1778https://doi.org/10.1115/IPACK2005-73054

Abstract

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Topics: Alloys , Creep , Solders , Tin , Deformation , Tension , Compression , Electronic packaging , Reliability , Safety

Polyimide Multi-Layer Substrate for High-Density Semiconductor Package

Shoichi Takenaka, Shoji Ito, Ryoichi Kishihara, Masahiro Okamoto, Osamu Nakao

InterPACK 2005; 1779-1782https://doi.org/10.1115/IPACK2005-73065

Abstract

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Topics: Density , Semiconductors (Materials) , Electrical wires , Epoxy adhesives , Epoxy resins , Glass , Heat , Multi-chip modules

CAM Systems Based on Traveling Salesman Problem From Time Perspective for High Density Through-Hole Drilling

Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Naohide Hashimoto, Mitsutaka Matsumura

InterPACK 2005; 1783-1789https://doi.org/10.1115/IPACK2005-73092

Abstract

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Topics: Density , Drilling , Printed circuit boards , Machine tools , Drills (Tools)

A Viscoplastic Constitutive Model and Estimation Method of Material Constants for Lead-Free Solder Alloys

Ken-Ichi Ohguchi, Katsuhiko Sasaki

InterPACK 2005; 1791-1796https://doi.org/10.1115/IPACK2005-73103

Abstract

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Topics: Alloys , Constitutive equations , Lead-free solders , Creep , Tin , Deformation , Engineering simulation , Finite element methods , Finite element model , Relaxation (Physics)

Cu-Direct Via-Hole Drilling of Aramid Fiber Reinforced Build-Up Layer by CO₂ Laser Beam

Eiichi Aoyama, Toshiki Hirogaki, Keiji Ogawa, Nobuyuki Doi, Ryu Minagi

InterPACK 2005; 1797-1804https://doi.org/10.1115/IPACK2005-73114

Abstract

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Topics: Aramid fibers , Carbon dioxide lasers , Drilling , Copper foil , Lasers , Absorption , Drills (Tools) , Fillers (Materials) , Heat , Hole quality

Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy

Noboru Hidaka, Megumi Nagano, Masayoshi Shimoda, Hirohiko Watanabe, Masahiro Ono

InterPACK 2005; 1805-1810https://doi.org/10.1115/IPACK2005-73148

Abstract

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Topics: Alloys , Creep , Lead-free solders , Tin

An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

Takehiko Takahashi, Susumu Hioki, Ikuo Shohji, Osamu Kamiya

InterPACK 2005; 1811-1817https://doi.org/10.1115/IPACK2005-73152

Abstract

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Topics: Cycles , Fatigue damage , Image processing , Lead-free solders , Solders , Tin , Low cycle fatigue , Fatigue life , Surface deformation , Fatigue

Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys

Changqing Liu, David A. Hutt, Dezhi Li, Paul P. Conway

InterPACK 2005; 1819-1825https://doi.org/10.1115/IPACK2005-73160

Abstract

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Topics: Alloys , Lead-free solders , Nickel , Coatings , Tin , Storage , Temperature , Testing , Copper , Mechanical properties

Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen

Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga, Masahisa Otsuka

InterPACK 2005; 1827-1832https://doi.org/10.1115/IPACK2005-73165

Abstract

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Topics: Alloys , Damage , Fatigue life , Fracture (Materials) , Low cycle fatigue , Solders , Tin

Reliability Improvement of Solder Joints Between Ceramic Chip Resistors and Insulated Metal Substrates With Thick Copper Pads

Kenji Monden

InterPACK 2005; 1833-1840https://doi.org/10.1115/IPACK2005-73176

Abstract

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Topics: Ceramics , Copper , Metals , Reliability , Resistors , Solder joints

Numerical Model to Analyse IC Chip Encapsulation Process

Venkatesh M. Kulkarni, Ishak Abdul Azid, K. N. Seetharamu, P. A. Aswatha Narayana

InterPACK 2005; 1841-1848https://doi.org/10.1115/IPACK2005-73197

Abstract

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Topics: Computer simulation , Flip-chip packages , Flow (Dynamics) , Fluids , Simulation , Cavities , Epoxy adhesives , Epoxy resins , Geometry , Pressure

Microstructure and Magnetic Properties of NdFeB Based Nanocomposites to Shock Compression

Jin-Chein Lin, M. H. Nien, L. C. Chang

InterPACK 2005; 1849-1855https://doi.org/10.1115/IPACK2005-73230

Abstract

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Topics: Compression , Magnetic alloys , Nanocomposites , Shock (Mechanics)

Loading Rate Effect Investigation of Through-Hole-Mounted Solder Joints

Frank Z. Liang, Larry M. Palanuk, Mike Gabriel

InterPACK 2005; 1857-1862https://doi.org/10.1115/IPACK2005-73275

Abstract

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Topics: Solder joints , Shock (Mechanics) , Stress , Failure , Actuators , Lead-free solders , Manufacturing

Characterization of Novolac Based Photoresists to Fabricate 3D Polymer Dome Features

Sriram Muthukumar, Tom W. Miller, Balu Pathangey, Neha M. Patel, Charles D. Hill

InterPACK 2005; 1863-1868https://doi.org/10.1115/IPACK2005-73300

Abstract

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Topics: Domes (Structural elements) , Photoresists , Polymers , Shapes , Cylinders , Deformation , Evaporation , Fourier transform infrared spectroscopy , Fourier transforms , Gas chromatography

Silicone Gel Thermal Interface Materials for High Heat Dissipation and Thermo-Mechanical Stress Management for Good Reliability Performance

J. C. Matayabas, Jr., Vassou LeBonheur

InterPACK 2005; 1869-1873https://doi.org/10.1115/IPACK2005-73372

Abstract

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Topics: Energy dissipation , Heat , Reliability , Silicones , Stress , Thermomechanics , Flat heat pipes , Packaging , Accelerated life testing , Clocks

Future Direction and Challenges for Microelectronics Packaging Materials

Vijay Wakharkar, J. C. Matayabas, Jr.

InterPACK 2005; 1875-1880https://doi.org/10.1115/IPACK2005-73374

Abstract

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Topics: Advanced materials , Density , Dimensions , Energy dissipation , Microelectronic devices , Microelectronic packaging , Packaging

Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages

Arun Raman, Jun Tian, Alfred A. La Mar, Shalabh Tandon

InterPACK 2005; 1881-1887https://doi.org/10.1115/IPACK2005-73389

Abstract

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Topics: Lasers , Spallation (Nuclear physics) , Adhesion , Adhesives , Ball-Grid-Array packaging , Copper , Dielectric materials , Epoxy adhesives , Epoxy resins , Flip-chip

Effect of Filler Geometry on the Conduction of Isotropically Conductive Adhesives

Bin Su, Jianmin Qu

InterPACK 2005; 1889-1901https://doi.org/10.1115/IPACK2005-73413

Abstract

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Topics: Adhesives , Fillers (Materials) , Geometry , Heat conduction , Particulate matter , Electrical resistivity , Design , Engineering simulation , Resistors , Simulation

CO₂ Laser Drilling of Microvias Using Diffractive Optics Techniques: I — Mathematical Modeling

Chong Zhang, Sachin Bet, Islam A. Salama, Nathaniel R. Quick, Aravinda Kar

InterPACK 2005; 1903-1909https://doi.org/10.1115/IPACK2005-73474

Abstract

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Topics: Carbon dioxide lasers , Drilling , Lasers , Modeling , Optics , Packaging

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Arun Gowda, Annita Zhong, Sandeep Tonapi, Kaustubh Nagarkar, K. Srihari

InterPACK 2005; 1911-1918https://doi.org/10.1115/IPACK2005-73490

Abstract

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Topics: Mechanical properties , Silicones , Heat , Adhesives , Fillers (Materials) , Flat heat pipes , Microelectronic devices , Phase change materials , Pumps , Resins

Micro- and Nanofabrication Processes

Fabrication of the Tip of GaAs Microwave Probe by Wet Etching

Yang Ju, Hiroyuki Sato, Hitoshi Soyama

InterPACK 2005; 1919-1922https://doi.org/10.1115/IPACK2005-73140

Abstract

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Topics: Chemical etching , Gallium arsenide , Manufacturing , Microwaves , Probes , Etching , Atomic force microscopy , Atoms , Microscopes , Semiconductor wafers

Evaluation of Damage Process Near Interfaces During Nanoscratch Test

Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Takeshi Akai

InterPACK 2005; 1923-1927https://doi.org/10.1115/IPACK2005-73159

Abstract

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Topics: Damage , Stress , Shear stress , Silicon , Thin films , Adhesion , Electronics , Failure , Fracture (Materials) , Fracture (Process)

Stress Concentration and Surface Roughness Effect on Strength of Polycrystalline Silicon Structure

Shigeru Hamada, Shuichi Tani, Daisuke Katagiri, Masahiro Tsugai, Makio Horikawa, Hiroshi Otani

InterPACK 2005; 1929-1934https://doi.org/10.1115/IPACK2005-73169

Abstract

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Topics: Polysilicon , Stress concentration , Surface roughness , Stress , Design , Finite element methods , Finite element model , Quality control

Subtractive Laser Processing of Low Temperature Inkjet Printed Micro Electric Components of Functional Nano-Ink for Flexible Electronics

Seung Hwan Ko, Jaewon Chung, Yeonho Choi, David J. Hwang, Costas P. Grigoropoulos, Dimos Poulikakos

InterPACK 2005; 1935-1941https://doi.org/10.1115/IPACK2005-73186

Abstract

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Topics: Electrical components , Flexible electronics , Inks , Lasers , Low temperature , Nanoparticles

Self-Assembly for Three Dimensional Integration of Functional Electrical Components

Andrew H. Cannon, Yueming Hua, Clifford L. Henderson, William P. King

InterPACK 2005; 1943-1948https://doi.org/10.1115/IPACK2005-73325

Abstract

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Topics: Electrical components , Microelectronic devices , Packaging , Self-assembly

Exploration of Thermolithography for Micro- and Nano-Manufacturing

Ming-Tsung Hung, Y. Sungtaek Ju

InterPACK 2005; 1949-1954https://doi.org/10.1115/IPACK2005-73424

Abstract

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Topics: Experimental methods , Heat , Heating , Lithography , Manufacturing , Nanomanufacturing , Nanoscale devices , Photoresists , Polymer films , Temperature

Development of a New Microscopic Four-Point AFM Probe for the Measurement of Local Electrical Conductivity

Bing-Feng Ju, Yang Ju, Masumi Saka

InterPACK 2005; 1955-1958https://doi.org/10.1115/IPACK2005-73433

Abstract

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Topics: Atomic force microscopy , Electrical conductivity , Probes , Aluminum , Electrical potential drop techniques , Electrodes , Microscale devices , Photolithography , Position control , Resolution (Optics)

Multilayer Direct-Writing of Electrical Conductors With Gold Nanoinks Using the Fountain-Pen Principle

Ce´dric P. R. Dockendorf, Tae-Youl Choi, Dimos Poulikakos, C. P. Grigoropoulos

InterPACK 2005; 1959-1961https://doi.org/10.1115/IPACK2005-73497

Abstract

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Topics: Circuits , Electronic circuits , Flexible electronics , Inks , Manufacturing , Melting point , Nanoparticles , Plastics , Probes , Silicon

Embedded Passives

A Novel Discrete Passives Integration on Organic Substrate

Vasudivan Sunappan, Chee Wai Lu, Lai Lai Wai, Wei Fan, Boon Keng Lok

InterPACK 2005; 1963-1967https://doi.org/10.1115/IPACK2005-73102

Abstract

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Topics: Capacitors , Inductors , Integrated circuits , Lamination , Manufacturing , Printed circuit boards , Reliability , Resistors , Resonance , Solder joints

Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula

Xiangyin Zeng, Jiangqi He, Baoshu Xu

InterPACK 2005; 1969-1972https://doi.org/10.1115/IPACK2005-73308

Abstract

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Topics: Capacitors , Design , Inductors , Capacitance , Computer software , Curve fitting , Errors , Filters , Q-factor , Tolerance analysis

Integration of RF Inductors and Baluns in Multilayer Organic Substrates

Telesphor Kamgaing, Chee Hoo Lee, Kyu-Pyung Hwang, Xiang Yin Zeng, Jiangqi He, Rockwell Hsu, Yongki Min, Jae-Yong Ihm

InterPACK 2005; 1973-1977https://doi.org/10.1115/IPACK2005-73316

Abstract

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Topics: Inductors , Design , Modeling , Simulation , Wireless LAN

Analysis and Characterization of Embedded Resistors for Wideband Applications

Albert C. W. Lu, L. L. Wai, W. Fan, Stephen C. K. Wong, Toshio Yamazaki, Jacinto Jun Jarcia, Jr., Kim H. Chin

InterPACK 2005; 1979-1984https://doi.org/10.1115/IPACK2005-73345

Abstract

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Topics: Resistors , Manufacturing , Surface mount packaging , Design

Power Distribution Analysis of Multi-Layer Substrates With Power Decoupling Capacitors

Albert Chee Wai Lu, Lin Jin, Kai M. Chua, Wei Fan, Lai L. Wai

InterPACK 2005; 1985-1988https://doi.org/10.1115/IPACK2005-73347

Abstract

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Topics: Capacitors , Resonance , Ceramics , Design , Low temperature , Modeling , Waves

Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates

Woon Choi, Shintaro Ono, Seiichiro Yoshida, Hajime Tomokage

InterPACK 2005; 1989-1993https://doi.org/10.1115/IPACK2005-73469

Abstract

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Topics: Ceramics , Inductors , Low temperature , Design , Simulation results , Microscopes , Lasers , Microwaves , System-in-package

Integrated Passives for Commercial Wireless Applications (Invited Paper)

Rashaunda M. Henderson, Michael F. Petras

InterPACK 2005; 1995-1998https://doi.org/10.1115/IPACK2005-73499

Abstract

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Topics: Capacitors , Ceramics , Circuits , Density , Design , Filters , Inductors , Integrated circuits , Low temperature , Modeling

SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics

Swapan Bhattacharya, Mahesh Varadarajan, Premjeet Chahal, K. J. Lee, Ajanta Bhattacharjee, Rao R. Tummala, Suresh Sitaraman, John Papapolymerou, Manos Tentzeris, Joy Laskar

InterPACK 2005; 1999-2004https://doi.org/10.1115/IPACK2005-73500

Abstract

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Topics: Dielectric materials , Resistors , Thin films , Alloys , Electroless plating , Adhesion , Copper , Density , Electrical wires , Electroplating

Microfluidics

Effects of Acoustic Resonance on Hydrodynamics and Evaporation of a Pendant Liquid Droplet

Jong Hoon Moon, Byung Ha Kang, Ho-Young Kim

InterPACK 2005; 2005-2009https://doi.org/10.1115/IPACK2005-73111

Abstract

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Topics: Acoustics , Drops , Evaporation , Hydrodynamics , Oscillations , Resonance , Waves

An Evaluation of Auxiliary Part Configuration in the Micro Flow Sensor by Using Micro PIV

Daichi Suzuki, Takashi Nagumo, Shinji Honami, Shoji Kamiunten

InterPACK 2005; 2011-2015https://doi.org/10.1115/IPACK2005-73194

Abstract

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Topics: Flow sensors , Flow (Dynamics) , Columns (Structural) , Bonding , Microelectromechanical systems , Microfluidics , Wire , Design , Microparticles , Pins (Engineering)

Experimental Validation of Macro-Models for Simulating Capillary Driven Multiphase Flows Used for Micro-Chamber Filling

Debjyoti Banerjee

InterPACK 2005; 2017-2021https://doi.org/10.1115/IPACK2005-73412

Abstract

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Topics: Algebra , Bubbles , Design , Differential equations , Flow (Dynamics) , Fluids , Lumped parameter models , Multiphase flow , Simulation , Surface tension

Surface Micromachined Microfluidics: Example Microsystems, Challenges and Opportunities

Paul Galambos, Conrad James

InterPACK 2005; 2023-2032https://doi.org/10.1115/IPACK2005-73491

Abstract

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Topics: Ejectors , Microelectromechanical systems , Microfluidics , Micromachining

RF MEMS

Development of Piezoelectric RF-MEMS Switch Driven by Low Operating Voltage

Isaku Kanno, Takaaki Suzuki, Hironobo Endo, Hidetoshi Kotera

InterPACK 2005; 2033-2036https://doi.org/10.1115/IPACK2005-73099

Abstract

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Topics: Microelectromechanical systems , Switches , Thin films , Actuators , Cantilevers , Deflection , Electrodes , Microcantilevers

Liquid Packaged MEMS Tunable Capacitors With Fast Response Times and Reduced Vibration Sensitivity

Robert L. Borwick, III, Philip A. Stupar, Jeffrey DeNatale

InterPACK 2005; 2037-2040https://doi.org/10.1115/IPACK2005-73129

Abstract

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Topics: Capacitors , Microelectromechanical systems , Vibration , Packaging , Damping

Reliability and Characterization of Micro-Packages in a Wafer Level Au-Si Eutectic Vacuum Bonding Process

Jay S. Mitchell, Gholamhassan R. Lahiji, Khalil Najafi

InterPACK 2005; 2041-2045https://doi.org/10.1115/IPACK2005-73341

Abstract

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Topics: Bonding , Packaging , Reliability , Semiconductor wafers , Silicon , Solders , Vacuum

Wafer Level Micropackaging for RF MEMS Switches

David I. Forehand, Charles L. Goldsmith

InterPACK 2005; 2047-2051https://doi.org/10.1115/IPACK2005-73398

Abstract

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Topics: Microelectromechanical systems , Packaging , Semiconductor wafers , Switches

Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry

Daniel J. Hyman, Roger Kuroda

InterPACK 2005; 2053-2056https://doi.org/10.1115/IPACK2005-73419

Abstract

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Topics: Flip-chip assemblies , Microelectromechanical systems , Microwaves , Packaging , Flip-chip , Reliability , Filters , Performance characterization , Yield strength

Development of a Hermetically Sealed Enclosure for MEMS in Chip-on-Flex Modules Using Liquid Crystalline Polymer (LCP)

Morgan Chen, Nicole Evers, Chris Kapusta, Joe Iannotti, Anh-Vu Pham, William Kornrumpf, John Maciel, Nafiz Karabudak

InterPACK 2005; 2057-2060https://doi.org/10.1115/IPACK2005-73440

Abstract

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Topics: Liquid crystalline polymers , Microelectromechanical systems , Switches , Cavities , Low temperature , Packaging

Liquid Crystal Polymer for RF MEMS Packaging

Faheem F. Faheem, Y. C. Lee

InterPACK 2005; 2061-2065https://doi.org/10.1115/IPACK2005-73442

Abstract

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Topics: Liquid crystalline polymers , MEMS packaging , Microelectromechanical systems , Permeability , Sealing (Process) , Circuits , Flip-chip , Flip-chip devices , Glass , Helium

On Hermeticity Detection of Wafer Level Packages for MEMS Devices

A. Goswami, B. Han, C. Wade, A. Chien

InterPACK 2005; 2067-2071https://doi.org/10.1115/IPACK2005-73485

Abstract

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Topics: Helium , Leakage , Microelectromechanical systems , Semiconductor wafers

Electro-Thermal Interactions

Effect of the Device Structure in Electro-Thermal Analysis of Si CMOS

Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki

InterPACK 2005; 2073-2078https://doi.org/10.1115/IPACK2005-73151

Abstract

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Topics: Complementary metal oxide semiconductors , MOSFET transistors , Junctions , Silicon

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks

Tohru Suwa, Hamid A. Hadim

InterPACK 2005; 2079-2086https://doi.org/10.1115/IPACK2005-73178

Abstract

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Topics: Artificial neural networks , Electronic components , Heat , Optimization , Printed circuit boards , Genetic algorithms , Algorithms , Cascades (Fluid dynamics) , Density , Electrical wires

Impact of Thermal Sub-Continuum Effects on Electrical Performance of Silicon-on-Insulator Transistors

Keivan Etessam-Yazdani, Rozana Hussin, Mehdi Asheghi

InterPACK 2005; 2087-2095https://doi.org/10.1115/IPACK2005-73182

Abstract

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Topics: Silicon-on-insulator , Transistors , Heating , Gates (Closures) , Electromagnetic scattering , Phonons , Radiation scattering , Scattering (Physics) , Silicon , Simulation

Numerical Modeling of Heat Transfer and Phase Transition in Programming the Ovonic Unified Memory Cells

Evan Small, Sadegh M. Sadeghipour, Mehdi Asheghi

InterPACK 2005; 2097-2101https://doi.org/10.1115/IPACK2005-73188

Abstract

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Topics: Computer programming , Computer simulation , Heat transfer , Phase transitions , Crystallization , Diffusion (Physics) , Heat , Modeling , Alloys , Computers

Numerical Analysis of Electro-Thermal Phenomena in Metal by Boltzmann Transport Equation for Electron

Kohei Ito, Ryohei Muramoto, Isamu Shiozawa, Yasushi Kakimoto, Takashi Masuoka

InterPACK 2005; 2103-2107https://doi.org/10.1115/IPACK2005-73199

Abstract

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Topics: Electrons , Metals , Numerical analysis , Equilibrium (Physics) , Computer simulation , Heat flux , Microfabrication , Semiconductors (Materials) , Thermal conductivity

Solid State Power Generation and Refrigeration for Electronic Packages and Systems

Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings

R. McCarty, K. P. Hallinan, B. Sanders, T. Somphone

InterPACK 2005; 2109-2122https://doi.org/10.1115/IPACK2005-73010

Abstract

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Topics: Energy recovery , Heat , Temperature , Thermoelectric devices , Aerospace industry , Computer simulation , Exergy , Heat recovery , Switches , Waste heat

Sizing of Pellets in Thermoelectric Modules (TEMs)

Marc Hodes

InterPACK 2005; 2123-2131https://doi.org/10.1115/IPACK2005-73074

Abstract

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Topics: Contact resistance , Electrical resistance , Energy consumption , Geometry , Heat , Heat flux , Refrigeration , Stress

Quantum Well Thermoelectric Devices

S. Ghamaty, N. B. Elsner

InterPACK 2005; 2133-2138https://doi.org/10.1115/IPACK2005-73173

Abstract

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Topics: Quantum wells , Thermoelectric devices

An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment

Robert A. Taylor, Gary L. Solbrekken

InterPACK 2005; 2139-2145https://doi.org/10.1115/IPACK2005-73190

Abstract

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Topics: Electronic equipment , Optimization , Refrigeration , Heat sinks , Temperature , Junctions , Cooling , Geometry , Electronics , Heat

Superlattice Thermoelectrics for Thermal Management of Electronics and Optoelectronics

R. Venkatasubramanian, B. O’Quinn, R. Alley, E. Siivola, A. Reddy, M. Soto, P. Addepalli

InterPACK 2005; 2147-2152https://doi.org/10.1115/IPACK2005-73198

Abstract

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Topics: Electronics , Optoelectronic devices , Superlattices , Thermal management , Reliability , Cooling , Refrigeration , Thin films

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Ioan Sauciuc, Hakan Erturk, Gregory Chrysler, Vikram Bala, Ravi Mahajan

InterPACK 2005; 2153-2159https://doi.org/10.1115/IPACK2005-73243

Abstract

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Topics: Compressors , Computation , Computational fluid dynamics , Computer cooling , Control equipment , Cooling , Cycles , Energy consumption , Fluids , Geometry

Thermoelectric Micro-Cooler for Hot-Spot Thermal Management

Peng Wang, Avram Bar-Cohen, Bao Yang, Gary L. Solbrekken, Yan Zhang, Ali Shakouri

InterPACK 2005; 2161-2171https://doi.org/10.1115/IPACK2005-73244

Abstract

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Topics: Cooling , Microcoolers , Thermal management

Thermal Simulation and Experimental Validation for TEC Design

Peter Shi, Stephen Wong, Yeow Meng Tan, Vasudivan Sunappan, Wei Fan, Kai Meng Chua, Bill Freeman, Hongjin Jiang

InterPACK 2005; 2173-2178https://doi.org/10.1115/IPACK2005-73309

Abstract

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Topics: Design , Simulation , Thermoelectric coolers

Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications

Kazuhiko Fukutani, Ali Shakouri

InterPACK 2005; 2179-2183https://doi.org/10.1115/IPACK2005-73410

Abstract

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Topics: Cooling , Optimization , Thermal resistance , Energy dissipation , Power density , Circuits , Coolers , Geometry , Heat , Integrated circuits

Multi-Layer Thermionic-Tunneling Structures for Power Generation

Taofang Zeng

InterPACK 2005; 2185-2187https://doi.org/10.1115/IPACK2005-73448

Abstract

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Topics: Energy generation , Tunnel construction , Heat , Heat transfer , Design , Electrodes , Electron transport , Electrons , Generators , Heat sinks

Experimental Characterization of Bonded Microcoolers for Hot Spot Removal

Yan Zhang, Gehong Zeng, Christine Hoffman, Ali Shakouri, Peng Wang, Avram Bar-Cohen

InterPACK 2005; 2189-2197https://doi.org/10.1115/IPACK2005-73466

Abstract

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Topics: Experimental characterization , Microcoolers , Cooling , Coolers , Flow (Dynamics) , Heat , Heat flux , Integrated circuits , Microelectronic devices , Power density

Peltier Enhanced Heat Spreading for Localized Hot Spot Thermal Management

Gary L. Solbrekken

InterPACK 2005; 2199-2205https://doi.org/10.1115/IPACK2005-73471

Abstract

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Topics: Heat , Thermal management , Heat flux , Thermal conductivity , Thermoelectricity , Electrical resistivity , Heating , Junctions , Temperature , Temperature gradient