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Proceedings Papers

2010 14th International Heat Transfer Conference
August 8–13, 2010
Washington, DC, USA
Conference Sponsors:
  • Heat Transfer Division
ISBN:
978-0-7918-4939-2
2010 14th International Heat Transfer Conference, Volume 4

Heat Transfer Measurement Techniques

IHTC 2010; 105-113doi:https://doi.org/10.1115/IHTC14-23129
IHTC 2010; 115-125doi:https://doi.org/10.1115/IHTC14-23220
IHTC 2010; 127-131doi:https://doi.org/10.1115/IHTC14-23271
IHTC 2010; 133-139doi:https://doi.org/10.1115/IHTC14-23286

Heat Transfer Equipment

IHTC 2010; 141-147doi:https://doi.org/10.1115/IHTC14-22030
IHTC 2010; 149-156doi:https://doi.org/10.1115/IHTC14-22058
IHTC 2010; 157-166doi:https://doi.org/10.1115/IHTC14-22075
IHTC 2010; 167-173doi:https://doi.org/10.1115/IHTC14-22084
IHTC 2010; 175-182doi:https://doi.org/10.1115/IHTC14-22086
IHTC 2010; 183-191doi:https://doi.org/10.1115/IHTC14-22095
IHTC 2010; 193-197doi:https://doi.org/10.1115/IHTC14-22097
IHTC 2010; 199-206doi:https://doi.org/10.1115/IHTC14-22100
IHTC 2010; 207-219doi:https://doi.org/10.1115/IHTC14-22101
IHTC 2010; 221-230doi:https://doi.org/10.1115/IHTC14-22115
IHTC 2010; 231-240doi:https://doi.org/10.1115/IHTC14-22123
IHTC 2010; 241-246doi:https://doi.org/10.1115/IHTC14-22200
IHTC 2010; 247-255doi:https://doi.org/10.1115/IHTC14-22229
IHTC 2010; 257-263doi:https://doi.org/10.1115/IHTC14-22245
IHTC 2010; 265-270doi:https://doi.org/10.1115/IHTC14-22250
IHTC 2010; 271-278doi:https://doi.org/10.1115/IHTC14-22251
IHTC 2010; 279-288doi:https://doi.org/10.1115/IHTC14-22276
IHTC 2010; 289-295doi:https://doi.org/10.1115/IHTC14-22292
IHTC 2010; 297-300doi:https://doi.org/10.1115/IHTC14-22312
IHTC 2010; 301-305doi:https://doi.org/10.1115/IHTC14-22313
IHTC 2010; 307-316doi:https://doi.org/10.1115/IHTC14-22314
IHTC 2010; 317-321doi:https://doi.org/10.1115/IHTC14-22315
IHTC 2010; 323-329doi:https://doi.org/10.1115/IHTC14-22357
IHTC 2010; 331-341doi:https://doi.org/10.1115/IHTC14-22373
IHTC 2010; 343-350doi:https://doi.org/10.1115/IHTC14-22374
IHTC 2010; 351-360doi:https://doi.org/10.1115/IHTC14-22378
IHTC 2010; 361-370doi:https://doi.org/10.1115/IHTC14-22382
IHTC 2010; 371-374doi:https://doi.org/10.1115/IHTC14-22386
IHTC 2010; 375-384doi:https://doi.org/10.1115/IHTC14-22387
IHTC 2010; 385-393doi:https://doi.org/10.1115/IHTC14-22392
IHTC 2010; 395-402doi:https://doi.org/10.1115/IHTC14-22395
IHTC 2010; 403-412doi:https://doi.org/10.1115/IHTC14-22400
IHTC 2010; 413-422doi:https://doi.org/10.1115/IHTC14-22401
IHTC 2010; 423-428doi:https://doi.org/10.1115/IHTC14-22409
IHTC 2010; 429-434doi:https://doi.org/10.1115/IHTC14-22411
IHTC 2010; 435-444doi:https://doi.org/10.1115/IHTC14-22426
IHTC 2010; 445-451doi:https://doi.org/10.1115/IHTC14-22427
IHTC 2010; 453-462doi:https://doi.org/10.1115/IHTC14-22459
IHTC 2010; 463-472doi:https://doi.org/10.1115/IHTC14-22492
IHTC 2010; 473-478doi:https://doi.org/10.1115/IHTC14-22502
IHTC 2010; 479-485doi:https://doi.org/10.1115/IHTC14-22529
IHTC 2010; 487-494doi:https://doi.org/10.1115/IHTC14-22531
IHTC 2010; 495-502doi:https://doi.org/10.1115/IHTC14-22536
IHTC 2010; 503-512doi:https://doi.org/10.1115/IHTC14-22577
IHTC 2010; 513-522doi:https://doi.org/10.1115/IHTC14-22587
IHTC 2010; 523-528doi:https://doi.org/10.1115/IHTC14-22589
IHTC 2010; 529-538doi:https://doi.org/10.1115/IHTC14-22615
IHTC 2010; 539-544doi:https://doi.org/10.1115/IHTC14-22618
IHTC 2010; 545-551doi:https://doi.org/10.1115/IHTC14-22640
IHTC 2010; 553-562doi:https://doi.org/10.1115/IHTC14-22712
IHTC 2010; 563-571doi:https://doi.org/10.1115/IHTC14-22727
IHTC 2010; 573-582doi:https://doi.org/10.1115/IHTC14-22747
IHTC 2010; 583-588doi:https://doi.org/10.1115/IHTC14-22783
IHTC 2010; 589-598doi:https://doi.org/10.1115/IHTC14-22789
IHTC 2010; 599-608doi:https://doi.org/10.1115/IHTC14-22790
IHTC 2010; 609-618doi:https://doi.org/10.1115/IHTC14-22791
IHTC 2010; 619-628doi:https://doi.org/10.1115/IHTC14-22793
IHTC 2010; 629-635doi:https://doi.org/10.1115/IHTC14-22826
IHTC 2010; 637-642doi:https://doi.org/10.1115/IHTC14-22845
IHTC 2010; 643-651doi:https://doi.org/10.1115/IHTC14-22856
IHTC 2010; 653-661doi:https://doi.org/10.1115/IHTC14-22880
IHTC 2010; 663-668doi:https://doi.org/10.1115/IHTC14-22927
IHTC 2010; 669-676doi:https://doi.org/10.1115/IHTC14-22952
IHTC 2010; 677-681doi:https://doi.org/10.1115/IHTC14-22957
IHTC 2010; 683-692doi:https://doi.org/10.1115/IHTC14-22964
IHTC 2010; 693-701doi:https://doi.org/10.1115/IHTC14-22971
IHTC 2010; 703-712doi:https://doi.org/10.1115/IHTC14-23037
IHTC 2010; 713-718doi:https://doi.org/10.1115/IHTC14-23052
IHTC 2010; 719-729doi:https://doi.org/10.1115/IHTC14-23053
IHTC 2010; 731-740doi:https://doi.org/10.1115/IHTC14-23092
IHTC 2010; 741-750doi:https://doi.org/10.1115/IHTC14-23158
IHTC 2010; 751-760doi:https://doi.org/10.1115/IHTC14-23162
IHTC 2010; 761-768doi:https://doi.org/10.1115/IHTC14-23180
IHTC 2010; 769-777doi:https://doi.org/10.1115/IHTC14-23193
IHTC 2010; 779-786doi:https://doi.org/10.1115/IHTC14-23200
IHTC 2010; 787-797doi:https://doi.org/10.1115/IHTC14-23201
IHTC 2010; 799-807doi:https://doi.org/10.1115/IHTC14-23232
IHTC 2010; 809-816doi:https://doi.org/10.1115/IHTC14-23250
IHTC 2010; 817-821doi:https://doi.org/10.1115/IHTC14-23278
IHTC 2010; 823-829doi:https://doi.org/10.1115/IHTC14-23390
IHTC 2010; 831-838doi:https://doi.org/10.1115/IHTC14-23394

Thermoelectrics

IHTC 2010; 839-843doi:https://doi.org/10.1115/IHTC14-22352
IHTC 2010; 845-855doi:https://doi.org/10.1115/IHTC14-22690
IHTC 2010; 857-864doi:https://doi.org/10.1115/IHTC14-22892
IHTC 2010; 865-871doi:https://doi.org/10.1115/IHTC14-23110
IHTC 2010; 873-877doi:https://doi.org/10.1115/IHTC14-23270
IHTC 2010; 879-889doi:https://doi.org/10.1115/IHTC14-23301
IHTC 2010; 891-898doi:https://doi.org/10.1115/IHTC14-23312
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