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Proceedings Papers

Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference

ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications

Autonomous Systems and Ambient Intelligence

IDETC-CIE 2009; 9-15doi:https://doi.org/10.1115/DETC2009-86688
IDETC-CIE 2009; 17-25doi:https://doi.org/10.1115/DETC2009-86689
IDETC-CIE 2009; 27-30doi:https://doi.org/10.1115/DETC2009-86986
IDETC-CIE 2009; 31-36doi:https://doi.org/10.1115/DETC2009-87251
IDETC-CIE 2009; 37-43doi:https://doi.org/10.1115/DETC2009-87715
IDETC-CIE 2009; 45-52doi:https://doi.org/10.1115/DETC2009-87750

Bio-Mechatronics and Bio-Sensors

IDETC-CIE 2009; 53-59doi:https://doi.org/10.1115/DETC2009-86217
IDETC-CIE 2009; 61-67doi:https://doi.org/10.1115/DETC2009-86425
IDETC-CIE 2009; 69-76doi:https://doi.org/10.1115/DETC2009-87075
IDETC-CIE 2009; 77-84doi:https://doi.org/10.1115/DETC2009-87186
IDETC-CIE 2009; 85-87doi:https://doi.org/10.1115/DETC2009-87252
IDETC-CIE 2009; 89-97doi:https://doi.org/10.1115/DETC2009-87786
IDETC-CIE 2009; 99-108doi:https://doi.org/10.1115/DETC2009-87803

Cyber-Physical Systems

IDETC-CIE 2009; 109-118doi:https://doi.org/10.1115/DETC2009-87509
IDETC-CIE 2009; 119-126doi:https://doi.org/10.1115/DETC2009-87613
IDETC-CIE 2009; 127-134doi:https://doi.org/10.1115/DETC2009-87627
IDETC-CIE 2009; 135-142doi:https://doi.org/10.1115/DETC2009-87822

Embedded Soft Computing

IDETC-CIE 2009; 143-149doi:https://doi.org/10.1115/DETC2009-87178
IDETC-CIE 2009; 151-158doi:https://doi.org/10.1115/DETC2009-87337
IDETC-CIE 2009; 159-163doi:https://doi.org/10.1115/DETC2009-87841

Embedded System Infrastructure and Theory

IDETC-CIE 2009; 165-174doi:https://doi.org/10.1115/DETC2009-86108
IDETC-CIE 2009; 175-184doi:https://doi.org/10.1115/DETC2009-86109
IDETC-CIE 2009; 185-192doi:https://doi.org/10.1115/DETC2009-87373
IDETC-CIE 2009; 193-202doi:https://doi.org/10.1115/DETC2009-87769

Learning Control and Diagnosis in Mechatronic Systems

IDETC-CIE 2009; 203-208doi:https://doi.org/10.1115/DETC2009-86651
IDETC-CIE 2009; 209-214doi:https://doi.org/10.1115/DETC2009-86837
IDETC-CIE 2009; 215-222doi:https://doi.org/10.1115/DETC2009-87326

Mechatronic and Embedded System Applications

IDETC-CIE 2009; 223-229doi:https://doi.org/10.1115/DETC2009-86076
IDETC-CIE 2009; 231-240doi:https://doi.org/10.1115/DETC2009-86416
IDETC-CIE 2009; 241-245doi:https://doi.org/10.1115/DETC2009-86656
IDETC-CIE 2009; 247-254doi:https://doi.org/10.1115/DETC2009-86658
IDETC-CIE 2009; 255-261doi:https://doi.org/10.1115/DETC2009-86802
IDETC-CIE 2009; 263-272doi:https://doi.org/10.1115/DETC2009-86954
IDETC-CIE 2009; 273-280doi:https://doi.org/10.1115/DETC2009-87033
IDETC-CIE 2009; 281-289doi:https://doi.org/10.1115/DETC2009-87443
IDETC-CIE 2009; 291-297doi:https://doi.org/10.1115/DETC2009-87611
IDETC-CIE 2009; 299-304doi:https://doi.org/10.1115/DETC2009-87853

Mechatronics and Embedded Systems Education

IDETC-CIE 2009; 305-312doi:https://doi.org/10.1115/DETC2009-86442
IDETC-CIE 2009; 313-317doi:https://doi.org/10.1115/DETC2009-86930
IDETC-CIE 2009; 319-324doi:https://doi.org/10.1115/DETC2009-87148
IDETC-CIE 2009; 325-334doi:https://doi.org/10.1115/DETC2009-87351

Mechatronics Control and Electrical Vehicles

IDETC-CIE 2009; 335-340doi:https://doi.org/10.1115/DETC2009-86569
IDETC-CIE 2009; 341-346doi:https://doi.org/10.1115/DETC2009-86969
IDETC-CIE 2009; 347-356doi:https://doi.org/10.1115/DETC2009-87023
IDETC-CIE 2009; 357-364doi:https://doi.org/10.1115/DETC2009-87100
IDETC-CIE 2009; 365-369doi:https://doi.org/10.1115/DETC2009-87204
IDETC-CIE 2009; 371-378doi:https://doi.org/10.1115/DETC2009-87354

Robotics and Mobile Machines

IDETC-CIE 2009; 379-384doi:https://doi.org/10.1115/DETC2009-86158
IDETC-CIE 2009; 385-395doi:https://doi.org/10.1115/DETC2009-86423
IDETC-CIE 2009; 397-404doi:https://doi.org/10.1115/DETC2009-86451
IDETC-CIE 2009; 405-410doi:https://doi.org/10.1115/DETC2009-87048
IDETC-CIE 2009; 411-418doi:https://doi.org/10.1115/DETC2009-87500
IDETC-CIE 2009; 419-426doi:https://doi.org/10.1115/DETC2009-87508
IDETC-CIE 2009; 427-433doi:https://doi.org/10.1115/DETC2009-87610
IDETC-CIE 2009; 435-441doi:https://doi.org/10.1115/DETC2009-87647
IDETC-CIE 2009; 443-447doi:https://doi.org/10.1115/DETC2009-87654
IDETC-CIE 2009; 449-457doi:https://doi.org/10.1115/DETC2009-87761

Sensor Networks

IDETC-CIE 2009; 459-469doi:https://doi.org/10.1115/DETC2009-86459
IDETC-CIE 2009; 471-477doi:https://doi.org/10.1115/DETC2009-87150
IDETC-CIE 2009; 479-485doi:https://doi.org/10.1115/DETC2009-87772
IDETC-CIE 2009; 487-493doi:https://doi.org/10.1115/DETC2009-87813
IDETC-CIE 2009; 495-500doi:https://doi.org/10.1115/DETC2009-87834

Sensors and MEMS

IDETC-CIE 2009; 501-510doi:https://doi.org/10.1115/DETC2009-86337
IDETC-CIE 2009; 511-517doi:https://doi.org/10.1115/DETC2009-86510
IDETC-CIE 2009; 519-524doi:https://doi.org/10.1115/DETC2009-86559
IDETC-CIE 2009; 525-533doi:https://doi.org/10.1115/DETC2009-87077
IDETC-CIE 2009; 535-538doi:https://doi.org/10.1115/DETC2009-87254

Small Unmanned Aerial Vehicle Technologies and Applications

IDETC-CIE 2009; 539-546doi:https://doi.org/10.1115/DETC2009-86151
IDETC-CIE 2009; 547-555doi:https://doi.org/10.1115/DETC2009-86412
IDETC-CIE 2009; 557-566doi:https://doi.org/10.1115/DETC2009-86456
IDETC-CIE 2009; 567-574doi:https://doi.org/10.1115/DETC2009-86490
IDETC-CIE 2009; 575-584doi:https://doi.org/10.1115/DETC2009-86500
IDETC-CIE 2009; 585-594doi:https://doi.org/10.1115/DETC2009-86547
IDETC-CIE 2009; 595-601doi:https://doi.org/10.1115/DETC2009-86725
IDETC-CIE 2009; 603-609doi:https://doi.org/10.1115/DETC2009-87107
IDETC-CIE 2009; 611-620doi:https://doi.org/10.1115/DETC2009-87136
IDETC-CIE 2009; 621-628doi:https://doi.org/10.1115/DETC2009-87574
IDETC-CIE 2009; 629-634doi:https://doi.org/10.1115/DETC2009-87586
IDETC-CIE 2009; 635-640doi:https://doi.org/10.1115/DETC2009-87636
IDETC-CIE 2009; 641-647doi:https://doi.org/10.1115/DETC2009-87671
IDETC-CIE 2009; 649-654doi:https://doi.org/10.1115/DETC2009-87675
IDETC-CIE 2009; 655-662doi:https://doi.org/10.1115/DETC2009-87741

20th Reliability, Stress Analysis, and Failure Prevention Conference

Computational Reliability and Applied Mechanics

IDETC-CIE 2009; 665-670doi:https://doi.org/10.1115/DETC2009-86324
IDETC-CIE 2009; 671-678doi:https://doi.org/10.1115/DETC2009-86836
IDETC-CIE 2009; 679-684doi:https://doi.org/10.1115/DETC2009-86995
IDETC-CIE 2009; 685-694doi:https://doi.org/10.1115/DETC2009-87442

Computer-Based (Numerical/FEA, etc.) Analyses for RSAFP

IDETC-CIE 2009; 695-701doi:https://doi.org/10.1115/DETC2009-86193
IDETC-CIE 2009; 703-710doi:https://doi.org/10.1115/DETC2009-86441
IDETC-CIE 2009; 711-717doi:https://doi.org/10.1115/DETC2009-86585
IDETC-CIE 2009; 719-724doi:https://doi.org/10.1115/DETC2009-87006
IDETC-CIE 2009; 725-729doi:https://doi.org/10.1115/DETC2009-87097

RSAFP Considerations in Design Process

IDETC-CIE 2009; 731-737doi:https://doi.org/10.1115/DETC2009-86981
IDETC-CIE 2009; 739-744doi:https://doi.org/10.1115/DETC2009-86997
IDETC-CIE 2009; 745-750doi:https://doi.org/10.1115/DETC2009-86998
IDETC-CIE 2009; 751-757doi:https://doi.org/10.1115/DETC2009-87003
IDETC-CIE 2009; 759-771doi:https://doi.org/10.1115/DETC2009-87103
IDETC-CIE 2009; 773-776doi:https://doi.org/10.1115/DETC2009-87206
IDETC-CIE 2009; 777-780doi:https://doi.org/10.1115/DETC2009-87615
IDETC-CIE 2009; 781-784doi:https://doi.org/10.1115/DETC2009-87795
IDETC-CIE 2009; 785-790doi:https://doi.org/10.1115/DETC2009-87830

Stress and Failure Analysis and Modeling

IDETC-CIE 2009; 791-798doi:https://doi.org/10.1115/DETC2009-86086
IDETC-CIE 2009; 799-804doi:https://doi.org/10.1115/DETC2009-86334
IDETC-CIE 2009; 805-809doi:https://doi.org/10.1115/DETC2009-86371
IDETC-CIE 2009; 811-817doi:https://doi.org/10.1115/DETC2009-86471
IDETC-CIE 2009; 819-825doi:https://doi.org/10.1115/DETC2009-86747
IDETC-CIE 2009; 827-832doi:https://doi.org/10.1115/DETC2009-86857
IDETC-CIE 2009; 833-838doi:https://doi.org/10.1115/DETC2009-87034
IDETC-CIE 2009; 839-845doi:https://doi.org/10.1115/DETC2009-87164
IDETC-CIE 2009; 847-851doi:https://doi.org/10.1115/DETC2009-87200
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