Abstract
Diffusion bonding of two immiscible, binary metallic systems, Cu-Ta and Cu-W was employed to make repeatable and predictable dual-layer impactors for shock-reshock experiments. The diffusion bonded impactors were characterized using ultrasonic imaging and optical microscopy to ensure bonding and the absence of excessive Cu grain coarsening. The diffusion bonded impactors were launched via a two-stage gas gun at [100] LiF windows instrumented with multiple interferometry probes spanning nearly the entire impactor area. Consistent interferometry data was obtained from all experiments with no evidence of release prior to recompression, indicating a uniform bond. Comparisons to hydrocode simulations show excellent agreement for all experiments, facilitating easy application of these impactors to future experiments.
