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Keywords: Electronic Equipment
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2002, 124(3): 405–412.
Published Online: May 10, 2002
... Thermal Contact Conductance Electronic Equipment Thermal Packaging Metallic coatings typically offer the greatest enhancement of thermal contact conductance in comparison to other classes of coatings and interstitial materials, as well as offering several other...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1999, 121(2): 326–332.
Published Online: May 1, 1999
... in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division, Oct. 7, 1996; revision received, Dec. 21, 1998. Keywords: Direct-Contact Heat Transfer, Electronic Equipment, Forced Convection. Associate Technical Editor: S. Ramadhyani. the convective heat transfer coefficients for water...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 1998, 120(2): 510–514.
Published Online: May 1, 1998
...J.-J. Hwang 14 April 1997 22 October 1997 05 12 2007 Conjugate Heat Transfer Electronic Equipment Forced Convection Anderson A. M. , 1994 , “ Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient ,” ASME Journal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1998, 120(1): 259–270.
Published Online: February 1, 1998
.... Manuscript received by the Heat Transfer Division December 20, 1996; revision received November 6, 1997; Keywords: Electronic Equipment; Liquid Metals; Sprays/Droplets. Asso- ciate Technical Editor: A. S. Lavine. et al , 1990; Kang et al., 1995; Liu et al., 1995; Wang and Matthys, 1996). Most recent...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1997, 119(4): 810–817.
Published Online: November 1, 1997
... 19, 1997; Keywords: Augmentation and Enhance- ment; Electronic Equipment; Jets. Associate Technical Editor: B. W. Webb. successfully proposed a subharmonic evolution model in which the vortex formation and the pairing process between two neigh- boring vortices are the result of the evolution of its...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1997, 119(4): 700–708.
Published Online: November 1, 1997
... 1997 05 12 2007 Augmentation and Enhancement Electronic Equipment Finned Surfaces Anand N. K. , Kim S. H. , and Fletcher L. S. , 1992 , “ The Effect of Plate Spacing on Free Convection Between Heated Parallel Plates ,” ASME JOURNAL OF HEAT TRANSFER , Vol. 114 , pp...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. August 1997, 119(3): 630–632.
Published Online: August 1, 1997
...J. A. Fitzgerald; S. V. Garimella 08 August 1996 28 April 1997 05 12 2007 Electronic Equipment Forced Convection Jets Ashforth-Frost S. , and Jambunathan K. , 1996 , “ Effect of Nozzle Geometry and Semi-Confinement on the Potential Core of a Turbulent...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1997, 119(1): 177–180.
Published Online: February 1, 1997
...-Dimensional Constrictions,” Progress in Astronautics and Aeronautics, Vol. 21: Thermal Design Principles of Spacecraft and Entry Bodies , pp. 591–615. Conduction Electronic Equipment Thermal Packaging 04 October 1995 17 October 1996 05 12 2007 Bardon, J. P., 1994, "Bases...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 1996, 118(4): 984–990.
Published Online: November 1, 1996
...J. C. Watson; N. K. Anand; L. S. Fletcher 11 August 1995 31 May 1996 05 12 2007 Conjugate Heat Transfer Electronic Equipment Mixed Convection Aung W. , and Worku G. , 1987 , “ Mixed Convection in Ducts With Asymmetric Wall Heat Fluxes ,” ASME JOURNAL...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1996, 118(3): 562–569.
Published Online: August 1, 1996
... April 1996 05 12 2007 Electronic Equipment Jets Turbulence Agarwal R. K. , and Bower W. W. , 1982 , “ Navier-Stokes Computations of Turbulent Compressible Two-Dimensional Impinging Jet Field ,” AIAA Journal , Vol. 20 , No. 5 , pp. 577 – 584 . Amano R. S...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1996, 118(3): 570–577.
Published Online: August 1, 1996
... and Enhancement Electronic Equipment Finned Surfaces Anand N. K. , Kim S. H. , and Fletcher L. S. , 1992 , “ The Effect of Plate Spacing on Free Convection Between Heated Parallel Plates ,” ASME JOURNAL OF HEAT TRANSFER , Vol. 114 , pp. 515 – 518 . Bar-Cohen A. , and Rohsenow...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1996, 118(3): 672–679.
Published Online: August 1, 1996
... and subcooling, resulting in a new correlation for spray cooling of small surfaces. 10 January 1995 02 April 1995 05 12 2007 Boiling Electronic Equipment Sprays/Droplets Bolle, L., and Moureau, J. C., 1976, “Spray Cooling of Hot Surfaces: A Description of the Dispersed Phase...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1996, 118(2): 279–286.
Published Online: May 1, 1996
... by the Heat Transfer Division and presented at the Fourth ASME/ JSME Thermal Engineering Joint Conference, Maui, Hawaii, March 19-24, 1995. Manuscript received by the Heat Transfer Division February 1995; revision re- ceived December 1995. Keywords: Conduction, Electronic Equipment. Associate Technical Editor...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 1996, 118(2): 478–480.
Published Online: May 1, 1996
...M. A. Lambert; L. S. Fletcher 01 January 1995 01 December 1995 05 12 2007 Conduction Electronic Equipment Thermophysical Properties Aluminum Company of America (ALCOA), 1968, personal communication to L. S., Fletcher, Dec. 10. ASM Metals Reference Book , 1983...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1996, 118(2): 301–309.
Published Online: May 1, 1996
... Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division March 1995; revision received November 1995. Keywords: Conjugate Heat Transfer, Electronic Equipment, Forced Convection. Associate Technical Editor: R. Viskanta. The design analysis...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1996, 118(1): 56–64.
Published Online: February 1, 1996
... Study of The Heat-Transfer Performance of the Open Thermosyphon ,” Int. J. Heat Mass Transfer , Vol. 14 , pp. 1717 – 1730 . Incropera, F. P., 1987, Future Research Directions, Cooling Technology for Electronic Equipment , W. Aung, ed., International Symposium on Cooling Technology for Electronic...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1996, 118(1): 261–264.
Published Online: February 1, 1996
...–82. Stepanov V. G. , Volyak L. D. , and Tarlakov Yu. V. , 1977 , “ Wetting Contact Angles for Some Systems ,” J. Engineering Physics and Thermophysics , Vol. 32 , No. 6 , pp. 1000 – 1003 . Augmentation and Enhancement Electronic Equipment Heat Pipes and Thermosyphons...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1996, 118(1): 202–205.
Published Online: February 1, 1996
.... Conduction Electronic Equipment Thermal Packaging 01 May 1994 01 November 1994 05 12 2007 Temperature [°C] 2s- Simulat ion 24- " "" " ' ~ NMR 22 (b) - . , . . v w . .m, l " " ' ' ' ~ 2o2 ~ k ..j(a) Pixel I . . . . . . i . . . . i . . . . i . . . . i . . . . . ' ~ ' to t~ ~o 2...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1996, 118(1): 211–213.
Published Online: February 1, 1996
...J. M. Choi; N. K. Anand; S. C. Lau; R. T. Kukreja Choi, J. M., 1993, “Heat Transfer in a Serpentine Channel With a Series of Right-Angle Turns,” Ph.D. Dissertation, Texas A&M University, College Station, TX. Augmentation and Enhancement Electronic Equipment Forced Convection...
Journal Articles