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Keywords: Electronic Equipment
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Journal Articles
Article Type: Technical Papers
J. Heat Transfer. June 2002, 124(3): 405–412.
Published Online: May 10, 2002
.... Tong. 19 May 1997 20 December 2001 10 05 2002 electric admittance metals coatings heat conduction Thermal Contact Conductance Electronic Equipment Thermal Packaging Metallic coatings typically offer the greatest enhancement of thermal contact conductance...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 1999, 121(2): 326–332.
Published Online: May 1, 1999
... in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division, Oct. 7, 1996; revision received, Dec. 21, 1998. Keywords: Direct-Contact Heat Transfer, Electronic Equipment, Forced Convection. Associate Technical Editor: S. Ramadhyani. the convective heat transfer coefficients for water...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. May 1998, 120(2): 510–514.
Published Online: May 1, 1998
... temperature Tu = free-stream turbulence intensity = u'lU U = average duct flow velocity u' = streanrwise velocity fluctuation W = duct or source width, see Fig. 1 X, Y, Z = coordinate, see Fig. 1 v = fluid kinematic viscosity Introduction Cooling of electronic equipment must be considered when designing...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. February 1998, 120(1): 259–270.
Published Online: February 1, 1998
.... Manuscript received by the Heat Transfer Division December 20, 1996; revision received November 6, 1997; Keywords: Electronic Equipment; Liquid Metals; Sprays/Droplets. Asso- ciate Technical Editor: A. S. Lavine. et al , 1990; Kang et al., 1995; Liu et al., 1995; Wang and Matthys, 1996). Most recent...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1997, 119(4): 810–817.
Published Online: November 1, 1997
... to 100 dB, and the Reynolds number varies from 5500 to 22,000. 06 September 1996 19 May 1997 05 12 2007 Augmentation and Enhancement Electronic Equipment Jets Baughn J. W. , and Shimizu S. , 1989 , “ Heat Transfer Measurements from a Surface With Uniform Heat...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. November 1997, 119(4): 700–708.
Published Online: November 1, 1997
... by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division January 21, 1997; revision received June 13, 1997; Keywords: Augmentation and Enhance- ment; Electronic Equipment; Finned Surfaces. Associate Technical Editor: P. G. Simpkins. L L...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. August 1997, 119(3): 630–632.
Published Online: August 1, 1997
...; Keywords: Electronic Equipment; Forced Convection; Jets. Associate Technical Editor: B. W. Webb. T ' < V \ \ \ v measurement mesh u measurement mesh Fig. 1 Schematic diagram of the experimental set up and measurement locations for the axial (v) and radial (u) velocity and turbulence measure- ments face...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. February 1997, 119(1): 177–180.
Published Online: February 1, 1997
... of Southern California, Los Angeles, CA 90089-1453 Contributed by the Heat Transfer Division for publication in the Journal of Heat Transfer. Manuscript received by the Heat Transfer Division October 4, 1995; revision received October 17, 1996; Keywords: Conduction, Electronic Equipment, Thermal Packaging...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. November 1996, 118(4): 984–990.
Published Online: November 1, 1996
...J. C. Watson; N. K. Anand; L. S. Fletcher 11 August 1995 31 May 1996 05 12 2007 Conjugate Heat Transfer Electronic Equipment Mixed Convection Aung W. , and Worku G. , 1987 , “ Mixed Convection in Ducts With Asymmetric Wall Heat Fluxes ,” ASME JOURNAL...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1996, 118(3): 562–569.
Published Online: August 1, 1996
... April 1996 05 12 2007 Electronic Equipment Jets Turbulence Agarwal R. K. , and Bower W. W. , 1982 , “ Navier-Stokes Computations of Turbulent Compressible Two-Dimensional Impinging Jet Field ,” AIAA Journal , Vol. 20 , No. 5 , pp. 577 – 584 . Amano R. S...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1996, 118(3): 570–577.
Published Online: August 1, 1996
... and Enhancement Electronic Equipment Finned Surfaces Anand N. K. , Kim S. H. , and Fletcher L. S. , 1992 , “ The Effect of Plate Spacing on Free Convection Between Heated Parallel Plates ,” ASME JOURNAL OF HEAT TRANSFER , Vol. 114 , pp. 515 – 518 . Bar-Cohen A. , and Rohsenow...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. August 1996, 118(3): 672–679.
Published Online: August 1, 1996
... and subcooling, resulting in a new correlation for spray cooling of small surfaces. 10 January 1995 02 April 1995 05 12 2007 Boiling Electronic Equipment Sprays/Droplets Bolle, L., and Moureau, J. C., 1976, “Spray Cooling of Hot Surfaces: A Description of the Dispersed Phase...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 1996, 118(2): 279–286.
Published Online: May 1, 1996
... by the Heat Transfer Division and presented at the Fourth ASME/ JSME Thermal Engineering Joint Conference, Maui, Hawaii, March 19-24, 1995. Manuscript received by the Heat Transfer Division February 1995; revision re- ceived December 1995. Keywords: Conduction, Electronic Equipment. Associate Technical Editor...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. May 1996, 118(2): 478–480.
Published Online: May 1, 1996
...M. A. Lambert; L. S. Fletcher 01 January 1995 01 December 1995 05 12 2007 Conduction Electronic Equipment Thermophysical Properties Aluminum Company of America (ALCOA), 1968, personal communication to L. S., Fletcher, Dec. 10. ASM Metals Reference Book , 1983...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. May 1996, 118(2): 301–309.
Published Online: May 1, 1996
... in Electronic Equipment—1983 , ASME HTD-Vol. 28, pp. 35–42. Chang, M. J., Shyu, R. J., and Fang, L. J., 1987, “An Experimental Study of Heat Transfer From Surface Mounted Components to a Channel Airflow,” ASME Paper No. 87-HT-75. Choi C. Y. , Kim S. J. , and Ortega A. , 1994 , “ Effects...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. February 1996, 118(1): 56–64.
Published Online: February 1, 1996
... Study of The Heat-Transfer Performance of the Open Thermosyphon ,” Int. J. Heat Mass Transfer , Vol. 14 , pp. 1717 – 1730 . Incropera, F. P., 1987, Future Research Directions, Cooling Technology for Electronic Equipment , W. Aung, ed., International Symposium on Cooling Technology for Electronic...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. February 1996, 118(1): 261–264.
Published Online: February 1, 1996
...–82. Stepanov V. G. , Volyak L. D. , and Tarlakov Yu. V. , 1977 , “ Wetting Contact Angles for Some Systems ,” J. Engineering Physics and Thermophysics , Vol. 32 , No. 6 , pp. 1000 – 1003 . Augmentation and Enhancement Electronic Equipment Heat Pipes and Thermosyphons...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. February 1996, 118(1): 202–205.
Published Online: February 1, 1996
...M. R. Sridhar; M. M. Yovanovich 01 May 1994 01 November 1994 05 12 2007 Conduction Electronic Equipment Thermal Packaging Churchill S. W. , and Usagi R. , 1972 , “ A General Expression for the Correlations of Rates and Other Phenomena ,” AIChE Journal...
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. February 1996, 118(1): 211–213.
Published Online: February 1, 1996
...J. M. Choi; N. K. Anand; S. C. Lau; R. T. Kukreja 01 January 1995 01 July 1995 05 12 2007 Augmentation and Enhancement Electronic Equipment Forced Convection Choi, J. M., 1993, “Heat Transfer in a Serpentine Channel With a Series of Right-Angle Turns,” Ph.D...
Journal Articles
Article Type: Research Papers
J. Heat Transfer. February 1996, 118(1): 3–9.
Published Online: February 1, 1996
... by the Heat Transfer Division May 1994; revision received January 1995. Keywords: Conduction, Electronic Equipment, Thermal Packing. Associate Technical Editor: L. S. Fletcher. faces using the recently proposed elastoplastic model for sphere- flat contacts and then reduce experimental data (Antonetti, 1983...