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Journal Articles

Forced Convection Heat Transfer From a Low-Profile Block Simulating a Package of Electronic Equipment

Hajime Nakamura, Tamotsu Igarashi

Publisher: ASME

J. Heat Mass Transfer. June 2004, 126(3): 463–470.

https://doi.org/10.1115/1.1737776

Published Online: June 16, 2004

View Articletitled, Forced Convection Heat Transfer From a Low-Profile Block Simulating a Package of Electronic Equipment

Topics: Ducts, Forced convection, Heat transfer, Laminar flow, Electronic equipment, Reynolds number, Flow (Dynamics), Heat flux

Journal Articles

Forced Convection in Microstructures for Electronic Equipment Cooling

S. J. Kim, D. Kim

Publisher: ASME

J. Heat Mass Transfer. August 1999, 121(3): 639–645.

https://doi.org/10.1115/1.2826027

Published Online: August 1, 1999

View Articletitled, Forced Convection in Microstructures for Electronic Equipment Cooling

Topics: Cooling, Electronic equipment, Forced convection, Heat transfer, Porous materials, Heat sinks, Fluids, Microchannels, Fluid dynamics, Temperature

Journal Articles

Conjugate Heat Transfer for Developing Flow Over Multiple Discrete Thermal Sources Flush-Mounted on the Wall

J.-J. Hwang

Publisher: ASME

J. Heat Mass Transfer. May 1998, 120(2): 510–514.

https://doi.org/10.1115/1.2824278

Published Online: May 1, 1998

View Articletitled, Conjugate Heat Transfer for Developing Flow Over Multiple Discrete Thermal Sources Flush-Mounted on the Wall

Topics: Flow (Dynamics), Heat transfer, Electronic equipment, Forced convection

Journal Articles

An Investigation of Key Factors Affecting Solder Microdroplet Deposition

B. Xiong, C. M. Megaridis, D. Poulikakos, H. Hoang

Publisher: ASME

J. Heat Mass Transfer. February 1998, 120(1): 259–270.

https://doi.org/10.1115/1.2830051

Published Online: February 1, 1998

View Articletitled, An Investigation of Key Factors Affecting Solder Microdroplet Deposition

Topics: Solders, Contact resistance, Modeling, Shapes, Solidification, Drops, Electronic equipment, Electronics, Fluids, Liquid metals

Journal Articles

Impingement Cooling Flow and Heat Transfer Under Acoustic Excitations

C. Gau, W. Y. Sheu, C. H. Shen

Publisher: ASME

J. Heat Mass Transfer. November 1997, 119(4): 810–817.

https://doi.org/10.1115/1.2824187

Published Online: November 1, 1997

View Articletitled, Impingement Cooling Flow and Heat Transfer Under Acoustic Excitations

Topics: Acoustics, Excitation, Flow (Dynamics), Heat transfer, Impingement cooling, Turbulence, Waves, Pressure, Reynolds number, Shear (Mechanics)

Journal Articles

Optimal Geometric Arrangement of Staggered Vertical Plates in Natural Convection

G. A. Ledezma, A. Bejan

Publisher: ASME

J. Heat Mass Transfer. November 1997, 119(4): 700–708.

https://doi.org/10.1115/1.2824174

Published Online: November 1, 1997

View Articletitled, Optimal Geometric Arrangement of Staggered Vertical Plates in Natural Convection

Topics: Natural convection, Vertical plates, Manufacturing, Plates (structures), Dimensions, Optimization, Electronic equipment, Fluids, Heat transfer, Rayleigh number

Journal Articles

Flow Field Effects on Heat Transfer in Confined Jet Impingement

J. A. Fitzgerald, S. V. Garimella

Publisher: ASME

J. Heat Mass Transfer. August 1997, 119(3): 630–632.

https://doi.org/10.1115/1.2824152

Published Online: August 1, 1997

View Articletitled, Flow Field Effects on Heat Transfer in Confined Jet Impingement

Topics: Electronic equipment, Flow (Dynamics), Forced convection, Heat transfer, Jets

Journal Articles

A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps

Ashok Kumar Das, Satwindar Singh Sadhal

Publisher: ASME

J. Heat Mass Transfer. February 1997, 119(1): 177–180.

https://doi.org/10.1115/1.2824084

Published Online: February 1, 1997

View Articletitled, A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps

Topics: Electronic equipment, Heat conduction, Packaging

Journal Articles

Mixed Convective Heat Transfer Between a Series of Vertical Parallel Plates With Planar Heat Sources

J. C. Watson, N. K. Anand, L. S. Fletcher

Publisher: ASME

J. Heat Mass Transfer. November 1996, 118(4): 984–990.

https://doi.org/10.1115/1.2822601

Published Online: November 1, 1996

View Articletitled, Mixed Convective Heat Transfer Between a Series of Vertical Parallel Plates With Planar Heat Sources

Topics: Convection, Electronic equipment, Heat, Heat transfer, Mixed convection, Plates (structures)

Journal Articles

Optimal Spacing Between Pin Fins With Impinging Flow

G. Ledezma, A. M. Morega, A. Bejan

Publisher: ASME

J. Heat Mass Transfer. August 1996, 118(3): 570–577.

https://doi.org/10.1115/1.2822670

Published Online: August 1, 1996

View Articletitled, Optimal Spacing Between Pin Fins With Impinging Flow

Topics: Fins, Flow (Dynamics), Heat transfer, Thermal conductivity, Computer simulation, Electronic equipment, Fluids

Journal Articles

Thermal Conductivity of Graphite/Aluminum and Graphite/Copper Composites

M. A. Lambert, L. S. Fletcher

Publisher: ASME

J. Heat Mass Transfer. May 1996, 118(2): 478–480.

https://doi.org/10.1115/1.2825869

Published Online: May 1, 1996

View Articletitled, Thermal Conductivity of Graphite/Aluminum and Graphite/Copper Composites

Topics: Aluminum, Composite materials, Copper, Electronic equipment, Graphite, Heat conduction, Thermal conductivity

Journal Articles

Enhanced Flat Miniature Axially Grooved Heat Pipe

D. Khrustalev, A. Faghri

Publisher: ASME

J. Heat Mass Transfer. February 1996, 118(1): 261–264.

https://doi.org/10.1115/1.2824057

Published Online: February 1, 1996

View Articletitled, Enhanced Flat Miniature Axially Grooved Heat Pipe

Topics: Heat pipes, Electronic equipment

Journal Articles

Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts

M. R. Sridhar, M. M. Yovanovich

Publisher: ASME

J. Heat Mass Transfer. February 1996, 118(1): 202–205.

https://doi.org/10.1115/1.2824037

Published Online: February 1, 1996

View Articletitled, Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts

Topics: Electronic equipment, Heat conduction, Packaging

Journal Articles

Heat (Mass) Transfer in a Serpentine Channel With Right-Angled Turns

J. M. Choi, N. K. Anand, S. C. Lau, R. T. Kukreja

Publisher: ASME

J. Heat Mass Transfer. February 1996, 118(1): 211–213.

https://doi.org/10.1115/1.2824040

Published Online: February 1, 1996

View Articletitled, Heat (Mass) Transfer in a Serpentine Channel With Right-Angled Turns

Topics: Electronic equipment, Forced convection, Heat

Journal Articles

Elastoplastic Contact Conductance Model for Isotropic Conforming Rough Surfaces and Comparison With Experiments

M. R. Sridhar, M. M. Yovanovich

Publisher: ASME

J. Heat Mass Transfer. February 1996, 118(1): 3–9.

https://doi.org/10.1115/1.2824065

Published Online: February 1, 1996

View Articletitled, Elastoplastic Contact Conductance Model for Isotropic Conforming Rough Surfaces and Comparison With Experiments

Topics: Electrical conductance, Surface roughness, Deformation, Contact resistance, Electronic equipment, Heat conduction, Materials properties, Packing (Shipments), Packings (Cushioning)

Journal Articles

Confined and Submerged Liquid Jet Impingement Heat Transfer

S. V. Garimella, R. A. Rice

Publisher: ASME

J. Heat Mass Transfer. November 1995, 117(4): 871–877.

https://doi.org/10.1115/1.2836304

Published Online: November 1, 1995

View Articletitled, Confined and Submerged Liquid Jet Impingement Heat Transfer

Topics: Heat transfer, Heat, Nozzles, Reynolds number, Electronic equipment, Fluids, Forced convection, Heat flux, Heat transfer coefficients, Jets

Journal Articles

The Optimal Spacing for Cylinders in Crossflow Forced Convection

A. Bejan

Publisher: ASME

J. Heat Mass Transfer. August 1995, 117(3): 767–770.

https://doi.org/10.1115/1.2822645

Published Online: August 1, 1995

View Articletitled, The Optimal Spacing for Cylinders in Crossflow Forced Convection

Topics: Cylinders, Electronic equipment, Forced convection

Journal Articles

Heat Transfer Enhancement in Narrow Channels Using Two and Three-Dimensional Mixing Devices

S. V. Garimella, D. J. Schlitz

Publisher: ASME

J. Heat Mass Transfer. August 1995, 117(3): 590–596.

https://doi.org/10.1115/1.2822618

Published Online: August 1, 1995

View Articletitled, Heat Transfer Enhancement in Narrow Channels Using Two and Three-Dimensional Mixing Devices

Topics: Forced convection, Heat transfer, Heat, Prandtl number, Reynolds number, Ducts, Surface roughness, Coolants, Electronic equipment, Flow (Dynamics)

Journal Articles

Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid

S. M. You, T. W. Simon, A. Bar-Cohen, Y. S. Hong

Publisher: ASME

J. Heat Mass Transfer. August 1995, 117(3): 687–692.

https://doi.org/10.1115/1.2822631

Published Online: August 1, 1995

View Articletitled, Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid

Topics: Boiling, Fluids, Pool boiling, Wetting, Computer cooling, Heat transfer, Cylinders, Electronic equipment, Heat flux, Heating

Journal Articles

Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

K. E. Goodson, M. I. Flik, L. T. Su, D. A. Antoniadis

Publisher: ASME

J. Heat Mass Transfer. August 1995, 117(3): 574–581.

https://doi.org/10.1115/1.2822616

Published Online: August 1, 1995

View Articletitled, Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

Topics: Electronic circuits, Heat conduction, Silicon-on-insulator, Temperature measurement, Circuits, Silicon, Temperature, Transistors, Cooling, Design

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Forced Convection Heat Transfer From a Low-Profile Block Simulating a Package of Electronic Equipment

Forced Convection in Microstructures for Electronic Equipment Cooling

Conjugate Heat Transfer for Developing Flow Over Multiple Discrete Thermal Sources Flush-Mounted on the Wall

An Investigation of Key Factors Affecting Solder Microdroplet Deposition

Impingement Cooling Flow and Heat Transfer Under Acoustic Excitations

Optimal Geometric Arrangement of Staggered Vertical Plates in Natural Convection

Flow Field Effects on Heat Transfer in Confined Jet Impingement

A Note on the Evaluation of Thermal Constriction Resistance for Finite Thickness Gaps

Mixed Convective Heat Transfer Between a Series of Vertical Parallel Plates With Planar Heat Sources

Optimal Spacing Between Pin Fins With Impinging Flow

Thermal Conductivity of Graphite/Aluminum and Graphite/Copper Composites

Enhanced Flat Miniature Axially Grooved Heat Pipe

Elastoplastic Constriction Resistance Model for Sphere-Flat Contacts

Heat (Mass) Transfer in a Serpentine Channel With Right-Angled Turns

Elastoplastic Contact Conductance Model for Isotropic Conforming Rough Surfaces and Comparison With Experiments

Confined and Submerged Liquid Jet Impingement Heat Transfer

The Optimal Spacing for Cylinders in Crossflow Forced Convection

Heat Transfer Enhancement in Narrow Channels Using Two and Three-Dimensional Mixing Devices

Effects of Dissolved Gas Content on Pool Boiling of a Highly Wetting Fluid

Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits

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