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Journal Articles

Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes

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Accepted Manuscript
Enes Tamdogan, Mehmet Arik
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Errata
J. Heat Mass Transfer.
Paper No: HT-24-1422
https://doi.org/10.1115/1.4068641
Published Online: May 12, 2025
View Articletitled, Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes
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Topics: Cooling, Light-emitting diodes, Particulate matter, Phosphors
Journal Articles

Thermal Spreading/Constriction From an Isothermal Source Into a Multilayer Orthotropic Semi-Infinite Flux Tube

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Ankur Jain
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2024, 146(6): 061401.
Paper No: HT-23-1372
https://doi.org/10.1115/1.4064831
Published Online: March 15, 2024
View Articletitled, Thermal Spreading/Constriction From an Isothermal Source Into a Multilayer Orthotropic Semi-Infinite Flux Tube
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Topics: Heat, Temperature, Thin films, Boundary-value problems, Algebra, Heat transfer, Polynomials, Thermal conductivity, Geometry
Journal Articles

Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels

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Sainan Lu, Kambiz Vafai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2023, 145(3): 032501.
Paper No: HT-22-1442
https://doi.org/10.1115/1.4055245
Published Online: December 9, 2022
View Articletitled, Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels
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Topics: Copper, Flat heat pipes, Heat sinks, Integrated circuits, Microchannels, Nanofluids, Optimization, Temperature, Weight (Mass)
Journal Articles

Transient Three-Dimensional Thermal Simulation of a Fin Field-Effect Transistor With Electron–Phonon Heat Generation, Three Phonon Scattering, and Drift With Periodic Switching

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Michael P. Medlar, Edward C. Hensel
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2023, 145(2): 022501.
Paper No: HT-22-1373
https://doi.org/10.1115/1.4056002
Published Online: November 22, 2022
View Articletitled, Transient Three-Dimensional Thermal Simulation of a Fin Field-Effect Transistor With Electron–Phonon Heat Generation, Three Phonon Scattering, and Drift With Periodic Switching
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Topics: Electromagnetic scattering, Electrons, Heat, Phonons, Radiation scattering, Scattering (Physics), Simulation, Transients (Dynamics), Transistors, Temperature
Journal Articles

Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes

Available to Purchase
Enes Tamdogan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. December 2022, 144(12): 122501.
Paper No: HT-22-1080
https://doi.org/10.1115/1.4055568
Published Online: October 6, 2022
View Articletitled, Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes
Open the PDF for Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diodes in another window
Topics: Cooling, Junctions, Light-emitting diodes, Particulate matter, Phosphors, Temperature, Coating processes, Coatings
Journal Articles

Discrete Phase Analysis of Self Heating Particles Over an Immersion Liquid Cooled High Power Blue Light-Emitting Diode With Suspended Phosphor Particles

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Ceren Cengiz, Ahmet Mete Muslu, Mohammad Azarifar, Mehmet Arik, Baris Dogruoz
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2022, 144(10): 102101.
Paper No: HT-21-1876
https://doi.org/10.1115/1.4055145
Published Online: August 18, 2022
View Articletitled, Discrete Phase Analysis of Self Heating Particles Over an Immersion Liquid Cooled High Power Blue Light-Emitting Diode With Suspended Phosphor Particles
Open the PDF for Discrete Phase Analysis of Self Heating Particles Over an Immersion Liquid Cooled High Power Blue Light-Emitting Diode With Suspended Phosphor Particles in another window
Topics: Fluids, Heat, Heating, Particulate matter, Phosphors, Temperature, Light-emitting diodes
Journal Articles

An Enhanced Statistical Phonon Transport Model for Nanoscale Thermal Transport

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Michael P. Medlar, Edward C. Hensel
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2022, 144(8): 082503.
Paper No: HT-22-1158
https://doi.org/10.1115/1.4054600
Published Online: June 7, 2022
View Articletitled, An Enhanced Statistical Phonon Transport Model for Nanoscale Thermal Transport
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Topics: Electromagnetic scattering, Phonons, Heat, Radiation scattering, Scattering (Physics), Transistors
Journal Articles

Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes

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Sainan Lu, Kambiz Vafai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2022, 144(6): 061901.
Paper No: HT-21-1801
https://doi.org/10.1115/1.4053803
Published Online: March 4, 2022
View Articletitled, Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes
Open the PDF for Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes in another window
Topics: Disks, Heat, Heat pipes, Heat sinks, Integrated circuits, Temperature, Flat heat pipes, Temperature distribution
Journal Articles

Thermal-Hydraulic Performance of Circular Electronic Components With Parabolic and Hyperbolic Front Facing the Upstream Flow

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Ashwin Mahendra, Rajendran Senthil Kumar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2021, 143(1): 011501.
Paper No: HT-19-1705
https://doi.org/10.1115/1.4048623
Published Online: November 4, 2020
View Articletitled, Thermal-Hydraulic Performance of Circular Electronic Components With Parabolic and Hyperbolic Front Facing the Upstream Flow
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Topics: Drag (Fluid dynamics), Electronic components, Flow (Dynamics), Fluids, Heat transfer, Reynolds number, Pressure drop, Shapes, Cylinders, Pressure
Journal Articles

Nonlinear Electro-Thermal Monte Carlo Device Simulation

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Ky Merrill, Marco Saraniti
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2020, 142(2): 022106.
Paper No: HT-19-1379
https://doi.org/10.1115/1.4045305
Published Online: December 9, 2019
View Articletitled, Nonlinear Electro-Thermal Monte Carlo Device Simulation
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Topics: Boundary-value problems, Gallium nitride, Heat, Simulation, Temperature, Thermal conductivity, Phonons, Electron mobility, Transistors
Journal Articles

Thermohydrodynamic Performance Evaluation of Recharging, Interrupted and Simple Microchannels: A Comparative Study

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Sangram Kumar Samal, Manoj Kumar Moharana
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2020, 142(1): 012503.
Paper No: HT-19-1284
https://doi.org/10.1115/1.4045066
Published Online: November 8, 2019
View Articletitled, Thermohydrodynamic Performance Evaluation of Recharging, Interrupted and Simple Microchannels: A Comparative Study
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Topics: Flow (Dynamics), Fluid dynamics, Fluids, Friction, Heat transfer, Microchannels, Particle filtering (numerical methods), Reynolds number, Sheet molding compound (Plastics), Sliding mode control
Journal Articles

The Effect of Carrier Gas and Reactor Pressure on Gallium Nitride Growth in MOCVD Manufacturing Process

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Omar Jumaah, Yogesh Jaluria
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2019, 141(8): 082101.
Paper No: HT-18-1529
https://doi.org/10.1115/1.4043895
Published Online: June 12, 2019
View Articletitled, The Effect of Carrier Gas and Reactor Pressure on Gallium Nitride Growth in MOCVD Manufacturing Process
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Topics: Flow (Dynamics), Gallium nitride, Manufacturing, Metalorganic chemical vapor deposition, Pressure, Thin films, Semiconductor wafers, Computer simulation
Journal Articles

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

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Sangbeom Cho, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2019, 141(5): 051401.
Paper No: HT-18-1568
https://doi.org/10.1115/1.4042328
Published Online: March 27, 2019
View Articletitled, Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber
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Topics: Copper, Heat, Vapors, Condensers (steam plant), Columns (Structural), Heat conduction, Heat transfer
Journal Articles

Application of the Semi-Analytic Complex Variable Method to Computing Sensitivities in Heat Conduction

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James Grisham, Ashkan Akbariyeh, Weiya Jin, Brian H. Dennis, Bo P. Wang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2018, 140(8): 082006.
Paper No: HT-17-1109
https://doi.org/10.1115/1.4039541
Published Online: June 29, 2018
View Articletitled, Application of the Semi-Analytic Complex Variable Method to Computing Sensitivities in Heat Conduction
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Topics: Finite element analysis, Heat conduction, Steady state, Event history analysis, Errors, Finite difference methods, Finite element methods, Stiffness, Computation, Algorithms
Journal Articles

Effect of Temperature Jump on Nonequilibrium Entropy Generation in a MOSFET Transistor Using Dual-Phase-Lagging Model

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Fraj Echouchene, Hafedh Belmabrouk
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. December 2017, 139(12): 122007.
Paper No: HT-16-1132
https://doi.org/10.1115/1.4037061
Published Online: July 19, 2017
View Articletitled, Effect of Temperature Jump on Nonequilibrium Entropy Generation in a MOSFET Transistor Using Dual-Phase-Lagging Model
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Topics: Boundary-value problems, Entropy, Heat conduction, MOSFET transistors, Temperature, Transistors, Heat, Knudsen number, Transients (Dynamics)
Journal Articles

Mathematical Modeling of Novel Two-Phase Heat Transfer Device for Thermal Management of Light Emitting Diodes

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Karthik S. Remella, Frank M. Gerner, Ahmed Shuja
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2017, 139(6): 062901.
Paper No: HT-15-1623
https://doi.org/10.1115/1.4035649
Published Online: February 28, 2017
View Articletitled, Mathematical Modeling of Novel Two-Phase Heat Transfer Device for Thermal Management of Light Emitting Diodes
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Topics: Condensers (steam plant), Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Light-emitting diodes, Temperature, Thermal energy, Thermal management, Modeling
Journal Articles

Performance Analysis of a Near-Field Thermophotovoltaic Device With a Metallodielectric Selective Emitter and Electrical Contacts for the Photovoltaic Cell

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Yue Yang, Jui-Yung Chang, Payam Sabbaghi, Liping Wang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2017, 139(5): 052701.
Paper No: HT-15-1648
https://doi.org/10.1115/1.4034839
Published Online: February 7, 2017
View Articletitled, Performance Analysis of a Near-Field Thermophotovoltaic Device With a Metallodielectric Selective Emitter and Electrical Contacts for the Photovoltaic Cell
Open the PDF for Performance Analysis of a Near-Field Thermophotovoltaic Device With a Metallodielectric Selective Emitter and Electrical Contacts for the Photovoltaic Cell in another window
Topics: Electricity (Physics), Heat flux, Photovoltaic cells, Thin films, Tungsten, Vacuum, Electrons, Photons, Wavelength, Heat
Journal Articles

Temperature-Dependent Thermal Boundary Conductance at Metal/Indium-Based III–V Semiconductor Interfaces

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LeighAnn S. Larkin, MacKenzie R. Redding, Nam Q. Le, Pamela M. Norris
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2017, 139(3): 031301.
Paper No: HT-16-1369
https://doi.org/10.1115/1.4034938
Published Online: November 22, 2016
View Articletitled, Temperature-Dependent Thermal Boundary Conductance at Metal/Indium-Based III–V Semiconductor Interfaces
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Topics: Acoustics, Electrical conductance, Metals, Semiconductors (Materials), Temperature, Phonons, Bond strength, Grain size, Density, Thermoreflectance
Journal Articles

Long-Term Evolution of SCD-1 Satellite Temperatures Based on Comparative Analysis of Telemetric Data Measured in Orbit

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Andreia F. S. Genaro, Ezio C. Garcia, Issamu Muraoka, Kevin E. de Conde
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2016, 138(7): 072803.
Paper No: HT-15-1034
https://doi.org/10.1115/1.4033084
Published Online: April 19, 2016
View Articletitled, Long-Term Evolution of SCD-1 Satellite Temperatures Based on Comparative Analysis of Telemetric Data Measured in Orbit
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Topics: Satellites, Temperature, Optimization, Design, Solar energy, Batteries
Journal Articles

Thermal wave imaging of microelectronics

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Miguel Goni, Aaron J. Schmidt
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. February 2016, 138(2): 020911.
Paper No: HT-15-1717
https://doi.org/10.1115/1.4032255
Published Online: January 18, 2016
View Articletitled, Thermal wave imaging of microelectronics
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Topics: Imaging, Microelectronic devices, Waves, Thermal properties, Electrodes, Glass, Lasers, Temperature, Wave frequency, Wire