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Guest Editorial

J. Heat Transfer. April 2008, 130(4): 040301. doi: https://doi.org/10.1115/1.2818789

Research Papers

Micro/Nanoscale Heat Transfer

J. Heat Transfer. April 2008, 130(4): 042401. doi: https://doi.org/10.1115/1.2787020
J. Heat Transfer. April 2008, 130(4): 042402. doi: https://doi.org/10.1115/1.2818751
J. Heat Transfer. April 2008, 130(4): 042403. doi: https://doi.org/10.1115/1.2818760
J. Heat Transfer. April 2008, 130(4): 042404. doi: https://doi.org/10.1115/1.2818763
J. Heat Transfer. April 2008, 130(4): 042405. doi: https://doi.org/10.1115/1.2818764
J. Heat Transfer. April 2008, 130(4): 042406. doi: https://doi.org/10.1115/1.2818768
J. Heat Transfer. April 2008, 130(4): 042407. doi: https://doi.org/10.1115/1.2789719
J. Heat Transfer. April 2008, 130(4): 042408. doi: https://doi.org/10.1115/1.2789721
J. Heat Transfer. April 2008, 130(4): 042409. doi: https://doi.org/10.1115/1.2789722
J. Heat Transfer. April 2008, 130(4): 042410. doi: https://doi.org/10.1115/1.2818765
J. Heat Transfer. April 2008, 130(4): 042411. doi: https://doi.org/10.1115/1.2818771
J. Heat Transfer. April 2008, 130(4): 042412. doi: https://doi.org/10.1115/1.2818775
J. Heat Transfer. April 2008, 130(4): 042413. doi: https://doi.org/10.1115/1.2818783

Technical Briefs

J. Heat Transfer. April 2008, 130(4): 044501. doi: https://doi.org/10.1115/1.2818787
J. Heat Transfer. April 2008, 130(4): 044502. doi: https://doi.org/10.1115/1.2787026
J. Heat Transfer. April 2008, 130(4): 044503. doi: https://doi.org/10.1115/1.2818784
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