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Issues

Editor's Note

J. Heat Transfer. July 2005, 127(7): 669. doi: https://doi.org/10.1115/1.1994859

Research Papers

Conduction

J. Heat Transfer. July 2005, 127(7): 670–674. doi: https://doi.org/10.1115/1.1924625

Evaporation, Boiling, and Condensation

J. Heat Transfer. July 2005, 127(7): 675–683. doi: https://doi.org/10.1115/1.1924568
J. Heat Transfer. July 2005, 127(7): 684–691. doi: https://doi.org/10.1115/1.1924626

Forced Convection

J. Heat Transfer. July 2005, 127(7): 692–698. doi: https://doi.org/10.1115/1.1924567
J. Heat Transfer. July 2005, 127(7): 699–712. doi: https://doi.org/10.1115/1.1924630

Micro/Nanoscale Heat Transfer

J. Heat Transfer. July 2005, 127(7): 713–723. doi: https://doi.org/10.1115/1.1924571
J. Heat Transfer. July 2005, 127(7): 724–732. doi: https://doi.org/10.1115/1.1924627

Natural and Mixed Convection

J. Heat Transfer. July 2005, 127(7): 733–739. doi: https://doi.org/10.1115/1.1924570

Radiative Heat Transfer

J. Heat Transfer. July 2005, 127(7): 740–748. doi: https://doi.org/10.1115/1.1925281

Heat Exchangers

J. Heat Transfer. July 2005, 127(7): 749–759. doi: https://doi.org/10.1115/1.1924569

Electronic Cooling

J. Heat Transfer. July 2005, 127(7): 760–769. doi: https://doi.org/10.1115/1.1924624
J. Heat Transfer. July 2005, 127(7): 770–779. doi: https://doi.org/10.1115/1.1924628

Technical Briefs

J. Heat Transfer. July 2005, 127(7): 780–784. doi: https://doi.org/10.1115/1.1924631
J. Heat Transfer. July 2005, 127(7): 785–790. doi: https://doi.org/10.1115/1.1924629
J. Heat Transfer. July 2005, 127(7): 791–793. doi: https://doi.org/10.1115/1.1924572
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