Thermal management has a key role in the development of advanced electronic devices to keep the device temperature below a maximum operating temperature. Jet impingement and high conductive porous inserts can provide a high efficiency cooling and temperature control for a variety of applications including electronics cooling. In this work, advanced heat management devices are designed and numerically studied employing single and multijet impingement through porous-filled channels with inclined walls. The base of these porous-filled nonuniform heat exchanging channels will be in contact with the devices to be cooled; as such the base is subject to a high heat flux leaving the devices. The coolant enters the heat exchanging device through single or multijet impingement normal to the base, moves through the porous field and leaves through horizontal exit channels. For numerical modeling, local thermal nonequilibrium model in porous media is employed in which volume averaging over each of the solid and fluid phase results in two energy equations, one for solid phase and one for fluid phase. The cooling performance of more than 30 single and multijet impingement designs are analyzed and compared to achieve advantageous designs with low or uniform base temperature profiles and high thermal effectiveness. The effects of porosity value and employment of 5% titanium dioxide (TiO2) in water in multijet impingement cases are also investigated.

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