Previous research in dropwise condensation (DWC) on rough microtextured superhydrophobic surfaces has demonstrated evidence of high heat transfer enhancement compared to smooth hydrophobic surfaces. In this study, we experimentally investigate the use of microporous sintered copper powder on copper substrates coated with a thiol-based self-assembled monolayer to attain enhanced DWC for steam in a custom condensation chamber. Although microtextured superhydrophobic surfaces have shown advantageous droplet growth dynamics, precise heat transfer measurements are underdeveloped at high heat flux. Sintered copper powder diameters from 4 μm to 119 μm were used to investigate particle size effects on heat transfer. As powder diameter decreased, competing physical factors led to improved thermal performance. At consistent operating conditions, we experimentally demonstrated a 23% improvement in the local condensation heat transfer coefficient for a superhydrophobic 4 μm diameter microporous copper powder surface compared to a smooth hydrophobic copper surface. For the smallest powders observed, this improvement is primarily attributed to the reduction in contact angle hysteresis as evidenced by the decrease in departing droplet size. Interestingly, the contact angle hysteresis of sessile water droplets measured in air is in contradiction with the departing droplet size observations made during condensation of saturated steam. It is evident that the specific design of textured superhydrophobic surfaces has profound implications for enhanced condensation in high heat flux applications.
Skip Nav Destination
Article navigation
Research-Article
Dropwise Condensation on Superhydrophobic Microporous Wick Structures
Sean H. Hoenig,
Sean H. Hoenig
Advanced Cooling Technologies, Inc.,
1046 New Holland Avenue,
Lancaster, PA 17601
e-mail: Sean.Hoenig@1-ACT.com
1046 New Holland Avenue,
Lancaster, PA 17601
e-mail: Sean.Hoenig@1-ACT.com
Search for other works by this author on:
Richard W. Bonner, III
Richard W. Bonner, III
Advanced Cooling Technologies, Inc.,
1046 New Holland Avenue,
Lancaster, PA 17601
e-mail: Richard.Bonner@1-ACT.com
1046 New Holland Avenue,
Lancaster, PA 17601
e-mail: Richard.Bonner@1-ACT.com
Search for other works by this author on:
Sean H. Hoenig
Advanced Cooling Technologies, Inc.,
1046 New Holland Avenue,
Lancaster, PA 17601
e-mail: Sean.Hoenig@1-ACT.com
1046 New Holland Avenue,
Lancaster, PA 17601
e-mail: Sean.Hoenig@1-ACT.com
Richard W. Bonner, III
Advanced Cooling Technologies, Inc.,
1046 New Holland Avenue,
Lancaster, PA 17601
e-mail: Richard.Bonner@1-ACT.com
1046 New Holland Avenue,
Lancaster, PA 17601
e-mail: Richard.Bonner@1-ACT.com
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received April 28, 2017; final manuscript received December 6, 2017; published online April 6, 2018. Assoc. Editor: Gennady Ziskind.
J. Heat Transfer. Jul 2018, 140(7): 071501 (7 pages)
Published Online: April 6, 2018
Article history
Received:
April 28, 2017
Revised:
December 6, 2017
Citation
Hoenig, S. H., and Bonner, R. W., III (April 6, 2018). "Dropwise Condensation on Superhydrophobic Microporous Wick Structures." ASME. J. Heat Transfer. July 2018; 140(7): 071501. https://doi.org/10.1115/1.4038854
Download citation file:
Get Email Alerts
Cited By
Related Articles
Nucleate Boiling Heat Transfer on Plain and Microporous Surfaces in Subcooled Water
J. Heat Transfer (August,2017)
Nucleate Boiling Comparison between Teflon-Coated Plain Copper and Cu-HTCMC in Water
J. Heat Transfer (August,2018)
Special Issue From International Workshop on New Understanding in Nanoscale/Microscale Phase Change Phenomena Held in Trondheim, Norway, June 12–16, 2016
J. Heat Transfer (November,2017)
Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends
J. Heat Transfer (August,2017)
Related Proceedings Papers
Related Chapters
Liquid Cooled Systems
Thermal Management of Telecommunication Equipment, Second Edition
Liquid Cooled Systems
Thermal Management of Telecommunications Equipment
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment