An extra high evaporating heat transfer coefficient can be obtained by thin-film evaporation. In the current investigation, a new detailed mathematical model is developed by considering the effects of bulk flow and interfacial thermal resistance on fluid flow and heat transfer in the thin-film region of an evaporating meniscus. In addition to the interfacial thermal resistance occurring at the liquid–vapor interface, the pressure difference between liquid and vapor is considered to the bulk flow effect. The results show that the bulk flow, which depends on the pressure difference between the interfacial pressure and vapor pressure, significantly affects thin-film profile, heat flux distribution, interfacial temperature, meniscus radius, mass flow rate, and average flow velocity in the evaporating thin-film region. While the interfacial thermal resistance occurring at the liquid–vapor interface affects fluid flow and heat transfer in the evaporating thin-film region, the bulk flow effect is more important than the interfacial thermal resistance.
Evaporation Heat Transfer in Thin-Film Region With Bulk Vapor Flow Effect
Presented at the 5th ASME 2016 Micro/Nanoscale Heat & Mass Transfer International Conference. Paper No. MNHMT2016-6619.Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received July 9, 2016; final manuscript received April 13, 2017; published online August 23, 2017. Assoc. Editor: Chun Yang.
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Fu, B., Zhao, N., Tian, B., Corey, W., and Ma, H. (August 23, 2017). "Evaporation Heat Transfer in Thin-Film Region With Bulk Vapor Flow Effect." ASME. J. Heat Transfer. January 2018; 140(1): 011502. https://doi.org/10.1115/1.4037448
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