This work presents a simple method based on electrical and thermal properties of materials. It permits researchers, in the field of manufacturing and characterization of thin and thick films in solid state to take appropriate experimental conditions before the preparation process. The calculation of the thermal diffusion length, its comparison with thicknesses of the substrate, the thin layer deposited on the substrate, the use of photothermal deflection technique, and the Cahill's law permit to highlight the necessary conditions that allow researchers to manufacture samples with high thermoelectric power such as the required thickness, electric conductivity, and thermal conductivity.

References

References
1.
Khélia
,
C.
, Boubaker, K., Nasrallah, T. B., Amlouk, M., and Belgacem. S.,
2009
, “
Morphological and Thermal Properties of β-SnS2 Sprayed Thin Films Using Boubaker Polynomials Expansion
,”
J. Alloys Compd.
,
477
(
1–2
), pp.
461
467
.
2.
Lamorlette
,
A.
, and
Candelier
,
F.
,
2015
, “
Thermal Behavior of Solid Particles at Ignition: Theoretical Limit Between Thermally Thick and Thin Solids
,”
Int. J. Heat Mass Transfer
,
82
, pp.
117
122
.
3.
Ghrib, T., Boubaker, K., and Bouhafs, M.,
2008
, “
Investigation of Thermal Diffusivity-Microhardness Correlation Extended to Surface-Nitrured Steel Using Boubaker Polynomials Expansion
,”
Mod. Phys. Lett. B
,
22
(
29
), pp.
2893
2907
.
4.
Ghrib, T., Ben Salem, S., and Noureddine, Y.,
2009
, “
EDM Effects on the Thermal Properties of 36NiCrMo16 Steel
,”
Tribol. Int.
,
42
(
3
), pp.
391
396
.
5.
Alam
,
H.
, and
Ramakrishna
,
S.
,
2013
, “
A Review on the Enhancement of Figure of Merit From Bulk to Nano-Thermoelectric Materials
,”
Nano Energy
,
2
(
2
), pp.
190
212
.
6.
Snyder
,
G. J.
, and
Toberer
,
E. S.
,
2008
, “
Complex Thermoelectric Materials
,”
Nat. Mater.
,
7
(
2
), pp.
105
114
.
7.
Sootsman
,
J. R.
,
2009
, “
New and Old Concepts in Thermoelectric Materials
,”
Angew. Chem., Int. Ed.
,
48
(
46
), pp.
8616
8639
.
8.
Tritt
,
T. M.
,
2011
, “
Thermoelectric Phenomena, Materials, and Applications
,”
Annu. Rev. Mater. Res.
,
41
(
1
), pp.
433
448
.
9.
Quelin X., Perrin B., Louis G., and Peretti P.,
1993
, “
Three-dimensional Thermal Conductivity Tensor Measurement of a Polydiacetylene Sample by Photothermal Probe Beam Deflection
,”
Phys. Rev. B
,
48
(
6
), p.
3677
.
10.
Medlin
,
D. L.
, and
Snyder
,
G. J.
,
2009
, “
Interfaces in Bulk Thermoelectric Materials: A Review for Current Opinion in Colloid and Interface Science
,”
Curr. Opin. Colloid Interface Sci.
,
14
(
4
), pp.
226
235
.
11.
Liu, W., Yan, X., Chen, G., and Ren, Z.,
2012
, “
Recent Advances in Thermoelectric Nanocomposites
,”
Nano Energy
,
1
(
1
), pp.
42
56
.
12.
Chen, Z.-G., Han, G., Yang, L., Cheng, L., and Zou, J.,
2012
, “
Nanostructured Thermoelectric Materials: Current Research and Future Challenge
,”
Prog. Nat. Sci. Mater. Int.
,
22
(
6
), pp.
535
549
.
13.
Huang, M. J., Yen, R. H., and Wang A. B.,
2005
, “
The Influence of the Thomson Effect on the Performance of a Thermoelectric Cooler
,”
Int. J. Heat Mass Transfer
,
48
(
2
), pp.
413
418
.
14.
Mitrani, D., Salazar, J., Turó, A., García, M. J., and Chávez, J. A.,
2009
, “
One-Dimensional Modeling of TE Devices Considering Temperature Dependent Parameters Using SPICE
,”
Microelectron. J.
,
40
(
9
), pp.
1398
1405
.
15.
Reddy, B. V. K., Barry, M., Li, J., and Chyu, M. K.,
2013
, “
Mathematical Modeling and Numerical Characterization of Composite Thermoelectric Devices
,”
Int. J. Therm. Sci.
,
67
(1), pp.
53
63
.
16.
Chen, W.-H., Liao, C., Y., and Hung, C. I.,
2012
, “
A Numerical Study on the Performance of Miniature Thermoelectric Cooler Affected by Thomson Effect
,”
Appl. Energy
,
89
(
1
), pp.
464
473
.
17.
Pulugurtha, S. R., Bhat, D. G., Gordon, M. H., and Schultz, J.,
2007
, “
Effect of Substrate Orientation on Film Properties Using AC Reactive Megnetron Sputterings
,”
Surf. Coat. Technol.
,
202
(4–7), pp.
755
761
.
18.
Cahill, D. G., Watson, S. K., and Pohl R. O.,
1992
, “
Lower Limit to the Thermal Conductivity of Disordered Crystals
,”
Phys. Rev. B
,
46
(
10
), pp.
6131
6140
.
19.
Tang, X. F., Chen, L. D., Wang, J., Zhang, Q. J., Goto, T., and Hirai, T.,
2005
, “
Effects of Filling Atoms Ba, Ce, Y and Substituting Atoms Fe, Ni on Lattice Thermal Conductivity of RyMxCo4−xSb12
,”
J. Alloys Compd.
,
394
(1–2), pp.
259
264
.
20.
Liu, R., Yang, J., Chen, J., Shi, X., Chen, L., and Uher, C.,
2011
, “
p-Type Skutterudites RxMyFe3CoSb12 (R, M=Ba, Ce, Nd, and Yb): Effectiveness of Double-Filling for the Lattice Thermal Conductivity Reduction
,”
Intermetallics
,
19
(
11
), pp.
1747
1751
.
21.
Wan, C., Wang, Y., Wang, N., and Koumoto, K.,
2010
, “
Low-Thermal-Conductivity (MS)1+x(TiS2)2 (M = Pb, Bi, Sn) Misfit Layer Compounds for Bulk Thermoelectric Materials
,”
Materials
,
3
(
4
), pp.
2606
2617
.
22.
Rao, V. L., Shekharam, T., Kumar, T. M., and Nagabhushanam, M.,
2015
, “
Effect of Copper on Impedance and Dielectric Studies of CuxZn1−xS Mixed Semiconductor Compounds
,”
Mater. Chem. Phys.
,
159
, pp.
83
92
.
23.
Vining
,
C. B.
,
1991
, “
A Model for the High-Temperature Transport Properties of Heavily Doped n-Type Silicon-Germanium Alloys
,”
J. Appl. Phys.
,
69
(
1
), pp.
331
341
.
24.
Sadeghi, H., Sangtarash, S., and Lambert, C. J.,
2015
, “
Enhancing the Thermoelectric Figure of Merit in Engineered Graphene Nanoribbons
,”
Beilstein J. Nanotechnol.
,
6
(1), pp.
1176
1182
.
You do not currently have access to this content.