The main objective of this study is to examine the frosting characteristics affected by the surface wettability. Two different copper surfaces – bare and nano structured - were prepared for the experiments. Their static contact angles are 74° (bare: without surface treatment) and 154° (nano-structured), respectively. The temperature of the copper substrate was measured by using resistance temperature detector (RTD) sensors embedded inside small holes drilled at 1 mm underneath the surface. During the phase change, the temperature of the copper substrates remained -7.8±0.6°C and the ambient temperature was set as 24±0.5°C with the relative humidity of 45%. Images were captured by using the CMOS camera with the 5 second time interval. Film condensation occurred because of higher wettability of the bare copper surface. Film condensates were frozen at the early stage and frost crystal grew in the vertical direction. On the other hand, dropwise condensates formed on the nano-structured copper surface remained as the supercooled liquid phase for 44 minutes owing to its low wettability. After 4 minutes, frosting on the bare copper substrate was triggered and propagated until it covered the whole surface. The frosting was significantly delayed on the superhydrophobic copper surface due to the lower surface free energy. The different porous media composed of frost which directly influence the heat transfer characteristics was formed on each surfaces. Therefore, additional investigation for heat transfer phenomenon on superhydrophobic surface should be conducted.
Frosting Characteristics on Hydrophilic and Superhydrophobic Copper Surfaces
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Jeong, C. H., Lee, J. B., Lee, S. H., Lee, J., You, S. M., and Choi, C. K. (January 18, 2016). "Frosting Characteristics on Hydrophilic and Superhydrophobic Copper Surfaces." ASME. J. Heat Transfer. February 2016; 138(2): 020913. https://doi.org/10.1115/1.4032257
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